Next Article in Journal
Editorial for the Special Issue on AC Electrokinetics in Microfluidic Devices, Volume II
Previous Article in Journal
Fabrication of Electrospun Porous TiO2 Dielectric Film in a Ti–TiO2–Si Heterostructure for Metal–Insulator–Semiconductor Capacitors
 
 
Article

Article Versions Notes

Micromachines 2024, 15(10), 1235; https://doi.org/10.3390/mi15101235
Action Date Notes Link
article pdf uploaded. 30 September 2024 17:35 CEST Version of Record https://www.mdpi.com/2072-666X/15/10/1235/pdf
Back to TopTop