This is an early access version, the complete PDF, HTML, and XML versions will be available soon.
Open AccessReview
A Systematic Review of Modeling and Simulation for Precision Diamond Wire Sawing of Monocrystalline Silicon
by
Ansheng Li
Ansheng Li 1,2,
Hongyan Wang
Hongyan Wang 2,3,
Shunchang Hu
Shunchang Hu 2,
Yu Zhou
Yu Zhou 4,
Jinguang Du
Jinguang Du 2,
Lianqing Ji
Lianqing Ji 2,* and
Wuyi Ming
Wuyi Ming 2,3,*
1
Mechanical and Electrical Transportation Science and Education Center, Huanghe Science and Technology University, Zhengzhou 450006, China
2
Mechanical and Electrical Engineering Institute, Zhengzhou University of Light Industry, Zhengzhou 450002, China
3
Guangdong Provincial Key Laboratory of Digital Manufacturing Equipment, Huazhong University of Science and Technology, Dongguan 523808, China
4
Gokin Solar Company Limited, Zhuhai 519031, China
*
Authors to whom correspondence should be addressed.
Micromachines 2024, 15(8), 1041; https://doi.org/10.3390/mi15081041 (registering DOI)
Submission received: 23 July 2024
/
Revised: 14 August 2024
/
Accepted: 15 August 2024
/
Published: 17 August 2024
Abstract
Precision processing of monocrystalline silicon presents significant challenges due to its unique crystal structure and chemical properties. Effective modeling and simulation are essential for advancing the understanding of the manufacturing process, optimizing design, and refining production parameters to enhance product quality and performance. This review provides a comprehensive analysis of the modeling and simulation techniques applied in the precision machining of monocrystalline silicon using diamond wire sawing. Firstly, the principles of mathematical analytical model, molecular dynamics, and finite element methods as they relate to monocrystalline silicon processing are outlined. Subsequently, the review explores how mathematical analytical models address force-related issues in this context. Molecular dynamics simulations provide valuable insights into atomic-scale processes, including subsurface damage and stress distribution. The finite element method is utilized to investigate temperature variations and abrasive wear during wire cutting. Furthermore, similarities, differences, and complementarities among these three modeling approaches are examined. Finally, future directions for applying these models to precision machining of monocrystalline silicon are discussed.
Share and Cite
MDPI and ACS Style
Li, A.; Wang, H.; Hu, S.; Zhou, Y.; Du, J.; Ji, L.; Ming, W.
A Systematic Review of Modeling and Simulation for Precision Diamond Wire Sawing of Monocrystalline Silicon. Micromachines 2024, 15, 1041.
https://doi.org/10.3390/mi15081041
AMA Style
Li A, Wang H, Hu S, Zhou Y, Du J, Ji L, Ming W.
A Systematic Review of Modeling and Simulation for Precision Diamond Wire Sawing of Monocrystalline Silicon. Micromachines. 2024; 15(8):1041.
https://doi.org/10.3390/mi15081041
Chicago/Turabian Style
Li, Ansheng, Hongyan Wang, Shunchang Hu, Yu Zhou, Jinguang Du, Lianqing Ji, and Wuyi Ming.
2024. "A Systematic Review of Modeling and Simulation for Precision Diamond Wire Sawing of Monocrystalline Silicon" Micromachines 15, no. 8: 1041.
https://doi.org/10.3390/mi15081041
Note that from the first issue of 2016, this journal uses article numbers instead of page numbers. See further details
here.
Article Metrics
Article Access Statistics
For more information on the journal statistics, click
here.
Multiple requests from the same IP address are counted as one view.