D: Materials and Processing
A section of Micromachines (ISSN 2072-666X).
Section Information
The “Materials and Processing” section of Micromachines focuses on the latest research in micro- and nanoscale materials and their fabrication technologies and integration into novel devices and systems. The section’s scope spans from the fundamentals of material synthesis to advanced processing techniques and applied device innovation across diverse fields such as electronics, healthcare, energy, and environmental science.
This section welcomes research on both established and emerging classes of materials, including semiconductors, superconductors, magnetic materials, polymers, metals, ceramics, composites, liquid crystals, and colloidal systems. It also covers new and rapidly evolving materials such as two-dimensional (2D) materials, bioinspired and biomimetic materials, materials for additive manufacturing, as well as photonic and optoelectronic materials. Contributions exploring the role of artificial intelligence and machine learning in the design, discovery, and processing of advanced materials and devices are particularly encouraged.
Beyond materials, the scope extends to the fabrication, characterization, and application of micro- and nanoscale devices. Areas of interest include electrical and optical components (antennas, photodetectors, and wireless and III–V devices); MEMS devices (accelerometers, gyroscopes, and pressure sensors); microfluidic and organ-on-chip systems; minimally invasive, implantable and wearable biomedical devices; and environmental and energy-harvesting platforms.
The section invites original research articles, comprehensive reviews, communications, and perspective papers that offer fundamental insights, novel concepts and methods, translational potential, or significant improvements in processing and fabrication techniques. Submissions that demonstrate system-level integration of materials and devices, cross-disciplinary innovation, or address real-world challenges in sectors such as healthcare, automotive technology, communications, and renewable energy are especially welcome.
Keywords
- micro/nano structures, devices, sensors, and systems
- micro/nano fabrication techniques
- smart functional materials and devices
- bio-inspired, biomedical, and biomolecular materials
- microelectromechanical systems
- materials and devices for energy harvesting applications
- wearable and point-of-care devices
- microfluidics and organs-on-a-chip devices
- implantable devices
- flexible and stretchable sensors and devices
- micro/nanoscale device packaging
- 3D-printed micro/nano devices
- semiconductors, superconducting, and magnetic materials
- bio-inspired, biomedical, and biomolecular materials
- optical, photonic, and optoelectronic materials
- artificial intelligence applications in micro/nano devices
Editorial Board
Topical Advisory Panel
Special Issues
Following special issues within this section are currently open for submissions:
- Laser-Assisted Ultra-Precision Machining (Deadline: 25 September 2026)
- Laser Micro/Nano Fabrication and Surface Modification Technology (Deadline: 25 September 2026)
- Fabrication of Functional Surface Microstructures (Deadline: 30 September 2026)
- Graphene-Based Micro- and Nanoelectronic Devices (Deadline: 30 September 2026)
- Two-Dimensional Materials for Electronic and Optoelectronic Devices, 2nd Edition (Deadline: 30 September 2026)
- Advanced Thin-Films: Design, Fabrication and Applications, Third Edition (Deadline: 20 October 2026)
- Wide-Bandgap Semiconductors: From Materials to Radiation Detectors (Deadline: 30 October 2026)
- Emerging Micro Manufacturing Technologies and Applications, 4th Edition (Deadline: 31 October 2026)
- Piezoelectric Aluminium Scandium Nitride (AlScN) Thin Films: Material Development and Applications in Microdevices, 2nd Edition (Deadline: 31 October 2026)
- Advanced Surface Engineering Processes in Micro/Nano-Manufacturing (Deadline: 31 October 2026)
- Emerging Packaging and Interconnection Technology, Second Edition (Deadline: 15 November 2026)
- Micro/Nano Manufacturing of Electronic Devices, 2nd Edition (Deadline: 20 November 2026)
- Recent Advances in Micro/Nanofabrication, 3rd Edition (Deadline: 20 November 2026)
- Nanomaterials for Micro/Nano Devices, 3rd Edition (Deadline: 30 November 2026)
- 2D Material-Based Fabrication and Devices, 2nd Edition (Deadline: 30 November 2026)
- Advanced Manufacturing Technology and Systems, 4th Edition (Deadline: 20 December 2026)
- Electronic and Photonic Device Integration and Packaging (Deadline: 25 December 2026)
- Carbon-Based Electronic Devices: Recent Advances and Future Challenges (Deadline: 31 December 2026)
- Diamond Devices: Design, Fabrication and Applications (Deadline: 31 December 2026)
- Advances in Power Microelectronics and Chips (Deadline: 31 December 2026)
- Ultrafast Laser Micro- and Nanoprocessing, 3rd Edition (Deadline: 31 December 2026)
- Advanced Functional Shape Memory Alloys and Their Applications (Deadline: 31 December 2026)
- Research Progress of Ultra-Precision Micro-Nano Machining, Second Edition (Deadline: 31 January 2027)
- Alternative-Material Semiconductor Devices (Deadline: 31 January 2027)
- Low-Dimensional Materials and Applications in Electronics (Deadline: 31 January 2027)
- Materials and Devices for Advanced Thermal Energy Harvesting and Management (Deadline: 20 February 2027)
- Ferroelectric Materials, Devices and Applications (Deadline: 20 February 2027)
- RF and Power Electronic Devices and Applications, 2nd Edition (Deadline: 25 February 2027)
- Low-Dimensional Nano-Scaled Materials: From Principles to Device Application, 2nd Edition (Deadline: 28 February 2027)
- Optical and Laser Material Processing, 3rd Edition (Deadline: 28 February 2027)
- Laser Micro/Nano-Fabrication, 2nd Edition (Deadline: 28 February 2027)
- Advanced Thermoelectric Materials and Devices (Deadline: 20 March 2027)
- Nanomaterials for Energy Storage and Sensing Applications (Deadline: 30 March 2027)
- Current Research Progress in Microwave Metamaterials and Metadevices (Deadline: 31 March 2027)
- Future Trends in Ultra-Precision Machining, Second Edition (Deadline: 31 March 2027)
- Next-Generation Functional Thin Films for Smart and Sustainable Electronics (Deadline: 31 March 2027)
- Field-Assisted Hybrid Manufacturing for High-Performance Components (Deadline: 20 April 2027)
- Advances in Abrasive Micro-Machining (Deadline: 30 April 2027)
- Laser Precision Processing and Intelligent Inspection Technologies for Transparent and Selectively Transmissive Materials (Deadline: 30 April 2027)
- Micro-Manufacturing and Mechanics of Metallic Micro-Components and Architected Structures (Deadline: 12 May 2027)
- Microwave Dielectric Materials and Devices (Deadline: 31 May 2027)
- Laser Processing of Semiconductors (Deadline: 31 May 2027)
- Laser Micro/Nano Fabrication, Third Edition (Deadline: 31 May 2027)
- SiC Based Miniaturized Devices, 4th Edition (Deadline: 25 June 2027)