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Journal: Micromachines, 2025
Volume: 16
Number: 980
980
Article: Assembly and Interconnection Technologies for 3D Plastic Circuit Carriers: An Overview of Technologies, Materials, and Applications
Authors: by Kai Werum, Wolfgang Eberhardt, Dieter Reenaers, Thomas Mager, Mika Endl, André Zimmermann and Wim Deferme
Link: https://www.mdpi.com/2072-666X/16/9/980

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