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Journal: MicromachinesVolume: 2Number: 49
Article: Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration
  • Authors:
  • Takafumi Fukushima1,*,
  • Takayuki Konno2 and
  • Mitsumasa Koyanagi1
  • et al.
Link: https://www.mdpi.com/2072-666X/2/1/49

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