Ghiami, A.; Sun, T.; Fiadziushkin, H.; Tang, S.; Grundmann, A.; Heuken, M.; Kalisch, H.; Vescan, A.
Optimization of Layer Transfer and Photolithography for Device Integration of 2D-TMDC. Crystals 2023, 13, 1474.
https://doi.org/10.3390/cryst13101474
AMA Style
Ghiami A, Sun T, Fiadziushkin H, Tang S, Grundmann A, Heuken M, Kalisch H, Vescan A.
Optimization of Layer Transfer and Photolithography for Device Integration of 2D-TMDC. Crystals. 2023; 13(10):1474.
https://doi.org/10.3390/cryst13101474
Chicago/Turabian Style
Ghiami, Amir, Tianyishan Sun, Hleb Fiadziushkin, Songyao Tang, Annika Grundmann, Michael Heuken, Holger Kalisch, and Andrei Vescan.
2023. "Optimization of Layer Transfer and Photolithography for Device Integration of 2D-TMDC" Crystals 13, no. 10: 1474.
https://doi.org/10.3390/cryst13101474
APA Style
Ghiami, A., Sun, T., Fiadziushkin, H., Tang, S., Grundmann, A., Heuken, M., Kalisch, H., & Vescan, A.
(2023). Optimization of Layer Transfer and Photolithography for Device Integration of 2D-TMDC. Crystals, 13(10), 1474.
https://doi.org/10.3390/cryst13101474