Mei, Q.; Wang, H.; Tong, D.; Song, J.; Huang, Z.
A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal Properties. Polymers 2020, 12, 999.
https://doi.org/10.3390/polym12050999
AMA Style
Mei Q, Wang H, Tong D, Song J, Huang Z.
A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal Properties. Polymers. 2020; 12(5):999.
https://doi.org/10.3390/polym12050999
Chicago/Turabian Style
Mei, Qilin, Honghua Wang, Danliao Tong, Jiuqiang Song, and Zhixiong Huang.
2020. "A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal Properties" Polymers 12, no. 5: 999.
https://doi.org/10.3390/polym12050999
APA Style
Mei, Q., Wang, H., Tong, D., Song, J., & Huang, Z.
(2020). A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal Properties. Polymers, 12(5), 999.
https://doi.org/10.3390/polym12050999