A Review on Synthesis, Structural, Flame Retardancy and Dielectric Properties of Hexasubstituted Cyclotriphosphazene
Abstract
:1. Introduction
2. Synthesis of Hexasubstituted Cyclotriphosphazene and Flame Retardant Properties
3. Effect of Linking Unit in Flame Retardancy Properties of Cyclotriphosphazene
4. Dielectric Properties in Cyclotriphosphazene
5. Flame Retardant and Dielectric Properties of Cyclotriphosphazene
6. Conclusions
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Acknowledgments
Conflicts of Interest
References
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Title of Journal | Structure and Name of Compound | Flame Retardant Properties | Ref. |
---|---|---|---|
Flame retardant properties of cyclotriphosphazene derivatives for ABS | | - LOI value: BPCP (21.2%, 22.1%, and 22.73% respectively), NTCP (22.3%, 23.1%, and 24.5% respectively, PTCP (23.1%, 24.1%, and 25.2%, respectively) - Additive used: 10 wt%, 15 wt%, and 20 wt% of each of BPCP, NTCP, and PTCP, respectively - Molding: ABS resin UL-94: Achieved V-1 rating | [34] |
The flame retardancy and thermal stability properties of the poly(ethylene terephthalate)/hexakis(4-nitrophenoxy) cyclotriphosphazene system. | Hexakis(4-nitrophenoxy) cyclotriphosphazene (HNCP) | - LOI value: 35.1% - Additive used: 10 wt% of HNCP - Molding: Polyethylene terephthalate) PET UL-94: Achieved V-0 rating | [35] |
Preparation and properties of halogen free flame-retardant blending modification polyester | Hexa(phenylamino)cyclotriphosphazene (HPACP) | - LOI value: 28.3% - Additive used: 10 wt% of HPACP - Molding: Poly(ethylene terephthalate) PET UL-94: Not mentioned in this study | [36] |
Synthesis of hexa-allylamino cyclotriphosphazene as a reactive flame retardant for unsaturated polyester. | Hexa-Allylamino Cyclotriphosphazene (HAC) | - LOI value: 36.5% - Additive used: Hexa-Allylamino Cyclotriphosphazene (HAC) - Molding: Diglycidyl ether bisphenol-A (DGEBA) UL-94: Not mentioned in this study | [37] |
Synthesis of a phosphorus/nitrogen-containing compound based on maleimide and cyclotriphosphazene and its flame-retardant mechanism on epoxy resin. | Hexa(4-maleimido-phenoxyl)-cyclotriphosphazene (HMCP) | - LOI value: 36.5% - Additive used: Hexa(4-maleimido-phenoxyl)-cyclotriphosphazene (HMCP) - Molding: Epoxy Resin UL-94: Achieved V-0 rating | [38] |
Synthesis of a novel flame retardant based on cyclotriphosphazene and DOPO groups and its application in epoxy resins | Hexa-[4-p-hydroxyanilino-phosphaphenanthrene-methyl)phenoxyl]-cyclotriphosphazene (HPMPC) | - LOI value: 36.6% - Additive used: 10.6 wt% of HPMPC - Molding: Diglycidyl ether bisphenol-A (DGEBA) UL-94: Achieved V-0 rating | [39] |
Preparation of hexakis (4-aldehyde phenoxy) cyclotriphosphazene grafted kalonite and its synergistic fire resistance in poly(butylene succinate) | Hexakis (4-aldehyde phenoxy) cyclotriphosphazene (HAPC) | - LOI value: 40.3% - Additive used: 3 wt% of HAPC - Molding: Poly(butylene succinate) UL-94: Achieved V-0 rating | [40] |
Synthesis, mechanical properties, and fire behavior of rigid polyurethane foam with a reactive flame retardant containing phosphazene and phosphate. | Hexa-(phosphite-hydroxyl-methyl-phenoxyl)-cyclotriphosphazene (HPHPCP) | - LOI value: 25% - Additive used: 15 wt% of HPHPCP - Molding: Rigid polyurethane foams (FR-RFUFs) UL-94: Achieved HF-1 rating | [20] |
Synthesis and characterization of flame-retardant rigid polyurethane foam based on reactive flame retardant containing phosphazene and cyclophosphonate | Hexa-(5,5-dimethyl-1,3,2-dioxaphosphinane-hydroxyl-methyl-phenoxyl-cycyclotriphosphazene (HDPCP) | - LOI value: 25% - Additive used: 25 wt% of HDPCP - Molding: Rigid polyurethane foams (FR-RFUFs) UL-94: Not mentioned in this study | [41] |
Application of cyclophosphazene derivatives as flame retardant for ABS | | - LOI value: PNCP (20.8%, 21.5% and 22.1%, respectively) - CTCP (22.0%, 22.7% and 23.1%, respectively) - HNCP (22.9%, 23.6% and 24.9%, respectively) - Additive used: 10 wt%, 15 wt% and 20 wt% of PNCP, CTCP and HNCP, respectively - Molding: ABS resin UL-94: 15 wt% of the flame retardants were classified as the V-2 class, and 20 wt% of the flame retardants using PNCP were classified as V-2 but using HNCP or CTCP were classed as V-1 | [42] |
The non-halogen flame retardant epoxy resin based on novel compound with phosphenanthrene and cyclotriphosphazene double functional groups | Hexa-(phosphaphenanthrene-hydroxyl-methyl-phenoxyl)-cyclotriphosphazene (HAP-DOPO) | - LOI value: 35.2% - Additive used: 1.5 wt% of HAP-DOPO - Molding: epoxy resin UL-94: Achieved V-0 rating | [43] |
Computer simulation study on the compatibility of cyclotriphosphazene containing the aminopropylsilicone functional group in flame retardant polypropylene/ammonium polyphosphate composites | APESP | - LOI value: 26.5% - Additive used: APESP - Molding: Polypropylene (PP)/ammonium polyphospate (APP) UL-94: Achieved rating V-2 | [44] |
Hexa (eugenol) cyclotriphosphazene modified bismaleimide resins with unique thermal stability and flame retardancy | Hexa(eugenol)cyclotriphosphazene (HEC) | - LOI value: 39%, 48.4%, 50.1%, 49.8%, and 48.9%, respectively. - Additive used: Hexa(eugenol)cyclotriphosphazene (HEC) - Molding: 4,4′-bismaleimidodiphenylmethane (BMI) UL-94: Achieved rating V-0 | [45] |
Aminobenzothiazole-substituted cyclotriphosphazene derivatives as reactive fire retardant for epoxy resin. | Aminobenzothiazole-substituted cyclotriphosphazene derivative (ABCP) | - LOI value: 31.2% - Additive used: Aminobenzothiazole-substituted cyclotriphosphazene (ABCP) - Molding: Epoxy Resin UL-94: Achieved V-0 rating | [46] |
Effect of cyclotriphosphazene-based curing agents on the fire retardant of epoxy resin | Hexacyclohexylamino-cyclotriphosphazene (HCACTP) Diaminotetracyclohexylamino-cyclotriphosphazene (DTCATP) | - LOI value: 25.3% and 22.2% respectively. - Additive used: Hexacyclohexylamino-cyclotriphosphazene (HCACTP) and Diaminotetracyclohexylamino-cyclotriphosphazene (DTCATP). - Molding: Epoxy Resin UL-94: Not mentioned in this study | [47] |
The flame retardant properties and mechanism of poly(ethylene terephalate)/hexakis (para-allyloxyphenoxy) cyclotriphosphazene systems. | Para-allyl ether phenol derivative of cyclophosphazene (PACP) | - LOI value: 33.5%, 33%, and 32.1%, respectively. - Additive: 5 wt%, 10 wt% and 15 wt% of PACP - Molding: Poy(ethylene terephalate) PET. UL-94: Achieved V-0 rating | [48] |
Benzimidazolyl-substituted cyclotriphosphazene derivatives as a latent flame-retardant curing agent for a one-component epoxy resin system with excellent comprehensive performance. | Benzimidazolyl- substituted cyclotriphosphazene (BICP) | - LOI value: 33.5% - Additive: Benzimidazolyl-substituted cyclotriphosphazene (BICP) - Molding: Epoxy Resin UL-94: Achieved V-0 rating | [49] |
Synthesis of melamine-cyclotriphosphazene derivatives and its application as flame retardant on cotton gauze | Melamine-Cyclotriphosphazene (MCP). | - LOI value: 16.9%, 23.5%, 24.6%, 25.4% 26.5%, and 25.8% respectively - Additive: Melamine-Cyclotriphosphazene (MCP). - Molding: Cotton Gauze UL-94: Not mentioned in this study | [50] |
The flame retardancy and thermal stability properties of flame-retardant epoxy resin based on a-hydroxyphosponate cyclotriphosphazene | a-hydroxyphosponate cyclotriphos-phazene | - LOI value: 30.7% - Additive: a hydroxyphosponate cyclotriphosphazene - Molding: Epoxy Resin UL-94: V-0 rating | [51] |
Synthesis and flame retardant properties of cyclotriphosphazene derivatives containing Boron. | Cyclotriphosphazene derivatives containing Boron (CP-6B) | - LOI value: 32.3% - Additive: CP-6B - Molding: Epoxy Resin UL-94: Achieved V-0 rating. | [52] |
An effective flame retardant for Poly(ethylene terephthalate) synthesis by phosphaphenanthrene and cyclotriphosphazene. | DOPO-TPN | - LOI value: 34% - Additive: DOPO-TPN - Molding: Poly(ethylene terephtthalate) PET UL-94: Achieved V-0 rating | [53] |
The influence of synergistic effects of hexakis (4-nitrophenoxy)cyclotriphosphazene and POE-g-MA on anti-dripping and flame retardancy of PET | Hexakis (4-nitrophenoxy)cyclotriphosphazene (HNCP) | - LOI value: 28.3% - Additive used: 10 wt% - Molding: Poly(etyhylene terepththalate PET - UL-94: PET/10 wt% HNCP with 0.5 wt% POE-g-MA achieved a rating of V-0 and PET/10 wt% HNCP with 3 wt% POE-g-MA achieved rating V-0 | [54] |
Design of a self-healing and flame-retardant cyclotriphosphazene-based epoxy vitrimer | Cyloliner cylotriphosphazene-based epoxy resin (CTP-EP) | - LOI value: 30.5% - Additive used: CTP-EP/DTDA - Molding: Epoxy Resin UL-94: Achieved V-0 rating. | [55] |
Synthesis and flame retardant efficacy of hexakis(3-(triethoxysilyl)propyloxy)cyclotriphosphazene/silica coatings for cotton fabrics | Hexakis(3-(triethoxysilyl)propyloxy)cyclotriphosphazene (HTPC) | - LOI value: 27.7% - Additive used: Hexakis(3-(triethoxysilyl)propyloxy)cyclotriphosphazene (HTPC) - Molding: Cotton Fibre UL-94: Not mentioned in this study | [56] |
Synthesis and characterization of thermally stable and flame retardant of hexakis(4-aminophenoxy)cyclotriphosphazene-based polyimide matrices | Hexakis(4-aminophenoxy)cyclotriphosphazene-based polyimide matrices (HACTP) | - LOI value: Range from 44.3% until 46.7%, respectively - Additive: HACTP - Molding: PI-PMDA and PI-BPDA UL-94: Achieved V-0 rating | [57] |
The synthesis, curing kinetics, thermal properties, and flame retardancy of cyclotriphosphazene-containing multifunctional epoxy resin | Hexa-[4-(glycidyloxymethyl)phenoxy]-cyclotriphosphazene (HGPCP) | - LOI value: 32.5% and 35.4%, respectively - Additive: HGPCP/DDS and HGPCP/DDM - Molding: Epoxy Resin UL-94: Achieved V-0 rating | [58] |
Hexa-[4-(glycidloxycarbonyl)phenoxy]cyclotriphosphazene chain extender for preparing high-performance flame retardant polyamide-six composites | Hexa-[4-(glycidloxycarbonyl)phenoxy]cyclotriphosphazene (CTP-EP) | - LOI value: 31.3% - Additive: 11 wt% of ALPi/CTP-EP - Molding: Polyamide 6/aliminium diethylphpsphinate (PA6/AlPi) UL-94: Achieved V-0 rating | [59] |
Synergistic effect of the intumescent flame-retardant system consisting of hexophenoxy cyclotriphosphazene and ammonium polyphosphate on methyl ethyl silicon rubber | Hexophenoxy cyclotriphosphazene (HPCP) | - LOI value: 30.6% - Additive: Hexophenoxy cyclotriphosphazene (HPCP) - Molding: Methyl ethyl silicone rubber (VMQ) UL-94: Achieved V-0 rating | [60] |
High transmittance and environmentally friendly flame-retardant optical resin based on poly(methyl methacrylate) and cyclotriphosphazene derivatives | Ethyl p-hydroxybenzoate derivatives of cyclotriphosphazene Phenol derivatives of cyclotriphosphazene | - LOI value: 26% and 22%, respectively - Additive: Two cyclotriphosphazene derivatives - Molding: High transparent optical resin based on methacrylate (PMMA) UL-94: Not mentioned in this study | [61] |
Study of thermal properties of flame-retardant epoxy resin treated with hexakis[p-(hydroxymethyl)phenoxy] cyclotriphosphazene | Hexakis[p-(hydroxymethyl)phenoxy] cyclotriphosphazene (HHPCP) | - LOI value: 26.5% - Additive: Hexakis[p-(hydroxymethyl)phenoxy] cyclotriphosphazene (HHPCP) - Molding: Epoxy Rein UL-94: Not mentioned in this study | [62] |
The flame retardancy and thermal properties of poly (ethylene terephthalate)/cyclotriphosphazene modified by the montmorillonite system | Hexachlorocyclotriphosphazene mofidies by montmorillonite (HCCP-OMMT) | - LOI value: 31.5% - Additive: 3% of hexachlorocyclotriphosphazene mofidied by montmorillonite (HCCP-OMMT) - Molding: Poly(ethylene terephthalate) UL-94: Achieved V-0 rating | [63] |
Synthesis, characterization, and utilization of novel phosphorus/nitrogen-containing flame retardant | Hexa(phosphaphenanthrene aminophenoxyl)-cyclotriphosphazene (HPAPC) | - LOI value: 34.7% - Additive: Hexa(phosphaphenanthrene aminophenoxyl)-cyclotriphosphazene (HPAPC) - Molding: Poly(lactic acid) (PLA) UL-94: Achieved V-0 rating | [25] |
Effect of surface chemical modification for aluminum hypophosphite with hexa-(4-aldehyde-phenoxy)-cyclotriphosphazene on flame retardancy, water resistance, and thermal properties for polyamide 6 | Hexa-(4-aldehyde-phenoxy)-cyclotriphosphazene (AHP) | - LOI value: 27.6% - Additive: Hexa-(4-aldehyde-phenoxy)-cyclotriphosphazene (AHP) - Molding: Polyamide 6 (PA6) - UL-94: Achieved V-0 rating | [64] |
Synthesis of tris(phenoxy)triflorocyclotriphosphazene and study of its effect on the flammable, thermal, optical, and mechanical properties of bisphenol-A polycarbonate | Tris(phenoxy)trifluorocyclotriphosphazene (TCTP) | - LOI value: 40% - Additive: Tris(phenoxy)trifluorocyclotriphosphazene (TCTP) - Molding: Polycarbonate - UL-94: Achieved V-0 rating | [65] |
Effect of trisilanolphenyl-POSS on rheological, mechanical, and flame retardancy properties of the poly(ethylene terephthalate)/cyclotriphosphazene system | Hexakis (para-alloxyphenoxy) cyclotriphosphazene (PACP) | - LOI value: Not mentioned in this study - Additive: Hexakis (para-alloxyphenoxy) cyclotriphosphazene (PACP) - Molding: Poly(ethylene terepthtalate) (PET) UL-94: Achieved V-0 rating | [66] |
Preparation and properties of novel inherent flame-retardant cyclotriphophazene containing epoxy resin | Bis-(4-hydroxyphenylsulfonylphenoxy)tereohenoxycyclotriphosphazene (HSPPZ) | - LOI value: Not mentioned in this study - Additive: Bis-(4-hydroxyphenylsulfonylphenoxy) tereohenoxycyclotriphosphazene (HSPPZ) - Molding: Epoxy Resin UL-94: Achieved V-0 rating | [67] |
Title of Journal | Types of Linking Unit | Description | Ref. |
---|---|---|---|
Synthesis of new star-shaped liquid crystalline cyclotriphosphazene derivatives with flame-retardant bearing amide-azo and azo-azo linking units. | Amide azo and azo-azo linking units | - This study aimed to synthesize two series of new hexasubstituted cyclotriphosphazene containing two types of linking units: amide-azo and azo-azo. - The homologues of the same series contain different terminal substituents such as heptyl, nonyl, decyl, dodecyl, tetradecyl, hydroxyl, carboxyl, chloro, nitro, and amino. - The flame retardancy of synthesized compounds is measured using the Limiting Oxygen Index. - From the result obtained, compounds containing heptyl have a higher LOI value compared with other compounds. The LOI values for alkylated compounds decrease as the aliphatic chain length increases. This study also compared the flame retardancy properties of two compounds containing two different linking units. The compound containing amide-azo was reported to have a high LOI value. The phenomenon indicates the attribute to the electron withdrawing properties of amide moiety. | [73] |
| |||
Synthesis of novel liquid crystalline and flame-retardant molecules based on six armed cyclotriphosphazene cores containing Schiff base and amide linking units. | Schiff base and amide linking units | - This study aimed to synthesize hexa substituted cyclotriphosphazene containing Schiff base and amide linking units, characterization, and chemical testing (flame retardancy using LOI value) were also measured. - From the result obtained, the LOI value indicating the flame retardancy properties of the compound showed that the compound with the nitro group had a high LOI value due to the electron withdrawing group that enhances the synergistic effect of P-N bonds. - This study also reported that cyclotriphosphazene compounds could enhance the flame retardancy of polyester resin. The LOI value of polyester resin increased from 22.53% to 24.71%. Schiff base linking unit was found to enhance these properties due to char formation in the condensed phase. - Other than that, the amide linking unit also contributed to the increase of LOI value. This is because the electron withdrawing of the amide bond enhances the flammability of these compounds. | [74] |
| |||
Synthesis, characterization, and mesophase transition of Hexasubstituted cyclotriphosphazene molecules with Schiff base and Azo linking units and determination of their flame-retardant properties. | Schiff base and azo linking units | - This study aimed to synthesis hexasubstituted cyclotriphosphazene containing Schiff base and Azo linking units. The characterization and chemical testing (flame Retardancy using LOI value) were also measured. - From the result obtained, the LOI valued increased when incorporated with hexasubstituted cyclotriphosphazene. The LOI value of the compound containing the nitro group was recorded as the highest, which was 27.90%. This is due to the nitro group’s electron withdrawing, which releases the electron from their resonance effects to their corresponding P-N bonds. As a result, the P-N synergistic effect was enhanced, and they exhibited both the condensed and gas phase action, which caused the compound to have a high LOI value. | [75,76] |
|
Compound | Name |
---|---|
| 2,2-Bis(4-formyl-2-methoxyphenoxy)-4,4,6,6-bis[spiro(2′,2″- dioxy-1′,1″-biphenylyl)] cyclotriphosphazene |
| 2,2-di[(4-(hydroxyimino)-2-methoxy)phenoxy]- 4,4,6,6-bis[spiro(2′,2″-dioxy-1′1″-biphenylyl)]cyclotriphosphazene |
| 2,2-di[{(4-(methyloxy)imino)-2-methoxy} phenoxy]-4,4,6,6-bis[spiro(2′2″-dioxy-1′,1″-biphenylyl)] cyclotriphosphazene |
| 2,2-di[{(4-(allyloxy)imino)-2-methoxy} phenoxy]-4,4,6,6-bis[spiro(2′,2″-dioxy-1′,1″-biphenylyl)] cyclotriphosphazene |
| 2,2-di[{(4-(benzyloxy)imino)-2-methoxy} phenoxy]-4,4,6,6-bis[spiro(2′,2″-dioxy-1′,1″-biphenylyl)] cyclotriphosphazene |
| 2,2-di[{(4-(chloroacetyloxy)imino)-2-methoxy} phenoxy]-4,4,6,6-bis[spiro(2′,2″-dioxy-1′,1″-biphenylyl)] cyclotriphosphazene |
| 2,2-di[{(4-(propanoyloxy)imino)-2-methoxy} phenoxy]-4,4,6,6-bis[spiro(2′,2″-dioxy-1′,1″-biphenylyl)] cyclotriphosphazene |
| 2,2-di[{(4-(o-chlorobenzoyloxy)imino)-2- methoxy}phenoxy]-4,4,6,6-bis[spiro(2′,2″-dioxy-1′,1″-biphenylyl)] cyclotriphosphaz |
| 2,2-di[{(4-(thiophene-2-carbonyloxy)imino)-2- methoxy}phenoxy]-4,4,6,6-bis[spiro(2′,2″-dioxy-1′,1″-biphenylyl)] cyclotriphosphazene |
Compound Name | Dielectric Constant | Dielectric Loss | Ref. |
---|---|---|---|
2,2,4,4-tetra(4′-oxy-substituted-chalcone)- 6,6-diphenyl cyclotriphosphazene derivatives | - Dielectric constants decreased with the increasing frequency, while they remained constant at high frequencies. Structural Reasons: This can be thought to be a polarization effect. Polarization occurs since the effect of dipole increases the frequencies. - Dielectric constant hexasubstituted cyclotrphosphazene compound containing Cl in ortho position was found as higher compared with the synthesized compound of hexasubstituted cyclotriphosphazene containing F atom in ortho position. Structural Reasons: The chlorine atom in the structure increased the polarity, and hence the dipole moment increased. - Dielectric constant of the synthesis compound containing pyridine was recorded to be the highest. Structural Reasons: This is due to the presence of the hetero atom in a ring, which can contribute to higher polarization. | Dielectric loss values of the compounds decreased along with the increasing frequency and remained unchanged after some point. | [4] |
Mono(4-fluorobenzyl)cyclotriphosphazene derivatives with (dimethylamino)ethoxy and (dimethylamino)propoxy chains. | - Sharp decrease of the dielectric constant in the low region of frequency. Structural Reasons: This is due to the relaxation process of the diffusion ion. - Compounds containing ethyl groups as an alkyl chain had a higher dielectric constant than those containing methyl groups. Structural Reasons: Increasing the side chain resulted in a deteriorated charge transport and unfavorable intermolecular interactions, leading to a decreasing dielectric constant. | - | [91,92,93] |
Hexasubstitued cyclotriphosphazene compounds containing chalcone derivatives | - Dielectric constant decreased with increasing frequency. Structural Reasons: This is because the atom in the compound was consistent with the direct charge of the alternating electric field (AEF) at low frequencies that reduce the dielectric constant value at high frequencies. | - Dielectric loss of the sample decreased with increasing frequency. Structural Reasons: Interfacial dipoles had less time to orient themselves in the direction of the alternate field. As a result, the low-frequency region is attributed to the contribution of charge accumulation at the interface. | [94] |
Cyclotri(trifluoroethoxy, acryloyloxy-ethyleneoxy)phosphazene | - Dielectric constant increased with increasing temperature and with decreasing frequency. Structural Reasons: Due to the rigidity of the polymer matrix. | - Dielectric loss increased with increasing temperature and with decreasing frequency. Structural Reasons: Due to the viscosity of the PNF polymer decrease, which favors dipole orientation. | [95] |
Addictive | Polymer Matrix | Properties Studies | Finding(s) | Ref. |
---|---|---|---|---|
Hexa(aminophenyl)cyclotriphosphazene | Cyanate ester (CE) | Thermal properties Dielectric properties | Limiting oxygen index (LOI) increased. Structural reasons: CPA contains phosphorus, and nitrogen compounds exhibit a good flame retardancy by forming phosphorus char that will act as a protecting layer of heat transfer that will reduce combustible gas production. Nitrogen in CPA will enhance the formation of phosphorus char and a nitrogen compound, which is also efficient in preventing oxygen from burning materials [105]. Dielectric loss and dielectric constant of CPA/CE lower than neat CE. Structural reasons: CPA has bulky sextet moiety with flexible structure; hence incorporated CE composites with CPA contribute to low dielectric properties. | [96] |
Cyclotriphosphazene reinforced polybenzoxazine (PBZ) | EP/PZT | Flame-retardant properties Dielectric properties (Temperature and Volume) | Limiting oxygen index (LOI) increased. Structural reasons: Incorporated phosphorus and nitrogen-containing phosphazene fiber into the FBZ/EP matrix contributed to flame retardancy since the phosphorus can act in a condensed phase to promote char formation, shielding the polymer from heat and air. Dielectric loss and dielectric constant increased with decreasing the temperature. Structural reasons: It can be ascertained that the composite samples exhibit stable dielectric behavior with regard to variation in temperature. Dielectric constant decreased when the volume of the loaded composite increases. Structural reasons: The dielectric of polymer was determined by the three factors in this study: volume, charge distribution, and statically thermal motion of the polar group. The reduction in the dielectric constant may be explained due to the enhancement of the free volume and, to a certain extent, due to the influencing effect of PZT fiber. | [98] |
Hexa(aminophenyl)cyclotriphosphazene (PZA) | PZI matrix | Flame-retardant properties Dielectric constant | Limiting oxygen index (LOI) of PZA/PZI matrix was higher than neat PZI. Structural Reasons: Due to the nitrogen and phosphorus in skeletal moiety [105]. In addition, the network structure of PZI matrix also offered an alternative to phosphazene cores. Low dielectric constant obtained from this compound. Structural Reasons: Introduction of such porous materials creates a free volume and contributes to obtaining materials that have a low dielectric constant. | [103] |
BICP | Epoxy Resin | Fire retardant Dielectric constant | Limiting oxygen index (LOI) of curing EP with BICP improved. Structural Reasons: These organophosphorus compounds facilitated the formation of more residual chars with better thermo-oxidative stability. Dielectric constant and loss of EP/BICP thermosets were lower in comparison with those of the EP/BIM10 thermoset over a wide frequency range. Structural Reasons: Increased free volume of the EP matrix due to the incorporation of a bulky, rigid BICP molecule might be responsible for the decreased dielectric constant of EP/BICP thermosets. Moreover, in the case of thermosets with the homogeneous network, the dielectric properties of polymers generally depend on the orientation and relaxation of dipoles which are closely related to the movement of polymer-chain segments [106]. | [104] |
HSSPZ | Epoxy Resin | Flame-retardant Electrical properties | The UL-94 achieved a V-0 rating. Structural reasons: This is attributed to the high nitrogen and phosphorus content in the resins. These are believed to have a synergistic effect during burning and yield the higher char amount that can retard the flammability of the materials. The resistivity of the compound increased. Structural Reasons: Inorganic ring of alternating phosphorus and nitrogen atoms of cyclotriphosphazene skeleton in the molecular backbone. The skeleton of cyclotriphosphazene is not a conjugated structure [107], and no electron can be supplied. Thus, the addition of CPEP could retain the electrical resistance of EP. | [67] |
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Usri, S.N.K.; Jamain, Z.; Makmud, M.Z.H. A Review on Synthesis, Structural, Flame Retardancy and Dielectric Properties of Hexasubstituted Cyclotriphosphazene. Polymers 2021, 13, 2916. https://doi.org/10.3390/polym13172916
Usri SNK, Jamain Z, Makmud MZH. A Review on Synthesis, Structural, Flame Retardancy and Dielectric Properties of Hexasubstituted Cyclotriphosphazene. Polymers. 2021; 13(17):2916. https://doi.org/10.3390/polym13172916
Chicago/Turabian StyleUsri, Siti Nur Khalidah, Zuhair Jamain, and Mohamad Zul Hilmey Makmud. 2021. "A Review on Synthesis, Structural, Flame Retardancy and Dielectric Properties of Hexasubstituted Cyclotriphosphazene" Polymers 13, no. 17: 2916. https://doi.org/10.3390/polym13172916
APA StyleUsri, S. N. K., Jamain, Z., & Makmud, M. Z. H. (2021). A Review on Synthesis, Structural, Flame Retardancy and Dielectric Properties of Hexasubstituted Cyclotriphosphazene. Polymers, 13(17), 2916. https://doi.org/10.3390/polym13172916