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Journal: Polymers, 2021
Volume: 13
Number: 3633

Article: High-Density Patterned Array Bonding through Void-Free Divinyl Siloxane Bis-Benzocyclobutene Bonding Process
Authors: by Nam Woon Kim, Hyeonjeong Choe, Muhammad Ali Shah, Duck-Gyu Lee and Shin Hur
Link: https://www.mdpi.com/2073-4360/13/21/3633

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