Direct Ink Writing of Phenylethynyl End-Capped Oligoimide/SiO2 to Additively Manufacture High-Performance Thermosetting Polyimide Composites
Abstract
:1. Introduction
2. Materials and Methods
2.1. Materials
2.2. Preparation of Thermosetting Polyimide and Polyamide Acid (PAA) Powders
2.3. Preparation of Inks and 3D Printing of Thermoset Objects
2.4. Characterizations
3. Results and Discussion
3.1. Chemical Structures of Uncured Polyimide and Cured Thermosetting Polyimide
3.2. Three-Dimensional Printing of SiO2@TSPI Composites Using Direct Ink Writing (DIW)
3.3. Thermal Stability of TSPI Films and Printed SiO2@TSPI-26.3%
3.4. Mechanical Properties of Printed Specimens
4. Conclusions
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Conflicts of Interest
References
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Composition (Mole Ratio) | Designation of Polyamic Acids | Designation of Oligoimides | Mn (g/mol) Calculated | Mn (g/mol) Measured | PDI |
---|---|---|---|---|---|
PEPA/ODA/6FDA 2/24.47/23.57 | PAA | PI | 15,000 | 18,700 | 1.38 |
PEPA/ODA/6FDA 2/8.13/7.13 | PAA-1 | PI-1 | 5000 | 5100 | 1.97 |
Samples | Tg (°C) | T5% (°C) | T10% (°C) | Char Yield (%) |
---|---|---|---|---|
C-TSPI-Air | - | 519.0 | 536.6 | 0.00 |
C-TSPI-NSi2 | 306.1 | 525.5 | 544.5 | 54.7 |
SiO2@TSPI-26.3%-Air | - | 525.9 | 545.6 | 24.2 |
SiO2@TSPI-26.3%-NSi2 | 300.7 | 529.1 | 546.5 | 66.0 |
Sample | Tensile Strength (MPa) | Elastic Modulus (GPa) |
---|---|---|
C-TSPI | 118.95–125.60 | 2.60–3.15 |
C- SiO2@TSPI-26.3% | 90.10–99.67 | 5.66–7.55 |
SiO2@TSPI-26.3%-X | 89.36–102.56 | 2.29–3.58 |
SiO2@TSPI-26.3%-Y | 32.96–38.22 | 1.75–1.87 |
Printing Method | Structure | T5% (°C) a | Tensile Stress (MPa) | Dimensional Shrinkage (%) | Ref. |
---|---|---|---|---|---|
MPSL | | 590 | 80 | 52 | [27] |
SLA | | 498 | --- | 48 | [34] |
UV-DIW | | 534 | --- | 45 | [28] |
DLP | | 420 | 24.9 | --- | [29] |
FDM | | ---- | 86 ± 11 | --- | [33] |
DIW (this work) | | 529 | 95 | 16 | --- |
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Li, K.; Ding, J.; Guo, Y.; Wu, H.; Wang, W.; Ji, J.; Pei, Q.; Gong, C.; Ji, Z.; Wang, X. Direct Ink Writing of Phenylethynyl End-Capped Oligoimide/SiO2 to Additively Manufacture High-Performance Thermosetting Polyimide Composites. Polymers 2022, 14, 2669. https://doi.org/10.3390/polym14132669
Li K, Ding J, Guo Y, Wu H, Wang W, Ji J, Pei Q, Gong C, Ji Z, Wang X. Direct Ink Writing of Phenylethynyl End-Capped Oligoimide/SiO2 to Additively Manufacture High-Performance Thermosetting Polyimide Composites. Polymers. 2022; 14(13):2669. https://doi.org/10.3390/polym14132669
Chicago/Turabian StyleLi, Keda, Jinghong Ding, Yuxiong Guo, Hongchao Wu, Wenwen Wang, Jiaqi Ji, Qi Pei, Chenliang Gong, Zhongying Ji, and Xiaolong Wang. 2022. "Direct Ink Writing of Phenylethynyl End-Capped Oligoimide/SiO2 to Additively Manufacture High-Performance Thermosetting Polyimide Composites" Polymers 14, no. 13: 2669. https://doi.org/10.3390/polym14132669