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Article

Thermally Stable UV-Curable Pressure-Sensitive Adhesives Based on Silicon–Acrylate Telomers and Selected Adhesion Promoters

Department of Chemical Organic Technology and Polymeric Materials, Faculty of Chemical Technology and Engineering, West Pomeranian University of Technology in Szczecin, 70-322 Szczecin, Poland
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Polymers 2024, 16(15), 2178; https://doi.org/10.3390/polym16152178
Submission received: 26 June 2024 / Revised: 25 July 2024 / Accepted: 29 July 2024 / Published: 30 July 2024
(This article belongs to the Special Issue Advances in Photopolymerization Process and Applications)

Abstract

A new type of UV-curable pressure-sensitive adhesive containing Si atoms (Si-PSAs) was prepared by a solution-free UV-initiated telomerization process of n-butyl acrylate, acrylic acid, methyl methacrylate, and 4-acrylooxybenzophenone using triethylsilane (TES) as a telogen and an acylphosphine oxide (APO) as a radical photoinitiator. Selected commercial adhesion promoters were tested as additives in the formulation of adhesive compositions, i.e., (i) an organic copolymer with polar groups (carboxyl and hydroxyl); (ii) a hydroxymetal-organic compound; and (iii) a quaternary ammonium salt and (iv) a chlorinated polyolefin. No fillers, crosslinking agents, or photoinitiators were used in the adhesive compositions. NMR techniques confirmed the incorporation of silicon atoms into the polyacrylate structure. The influence of adhesion promoters on the kinetics of the UV-crosslinking process of Si-PSAs was investigated by a photo-DSC technique. The obtained Si-PSAs were characterized by adhesion (to steel, glass, PMMA, and PE), tack, and cohesion at 20 °C. Finally, the wetting angle of Si-PSAs with water was checked and their thermal stability was proved (TGA). Unexpectedly, the quaternary ammonium salt had the most favorable effect on improving the thermal stability of Si-PSAs (302 °C) and adhesion to glass and PMMA. In contrast, Si-PSAs containing the hydroxymetal-organic compound showed excellent adhesion to steel.
Keywords: photopolymerization; telomerization; adhesion promoter; pressure-sensitive adhesives; silicone; acrylate photopolymerization; telomerization; adhesion promoter; pressure-sensitive adhesives; silicone; acrylate

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MDPI and ACS Style

Kowalczyk, A.; Kowalczyk, K.; Gruszecki, J.; Idzik, T.J.; Sośnicki, J.G. Thermally Stable UV-Curable Pressure-Sensitive Adhesives Based on Silicon–Acrylate Telomers and Selected Adhesion Promoters. Polymers 2024, 16, 2178. https://doi.org/10.3390/polym16152178

AMA Style

Kowalczyk A, Kowalczyk K, Gruszecki J, Idzik TJ, Sośnicki JG. Thermally Stable UV-Curable Pressure-Sensitive Adhesives Based on Silicon–Acrylate Telomers and Selected Adhesion Promoters. Polymers. 2024; 16(15):2178. https://doi.org/10.3390/polym16152178

Chicago/Turabian Style

Kowalczyk, Agnieszka, Krzysztof Kowalczyk, Jan Gruszecki, Tomasz J. Idzik, and Jacek G. Sośnicki. 2024. "Thermally Stable UV-Curable Pressure-Sensitive Adhesives Based on Silicon–Acrylate Telomers and Selected Adhesion Promoters" Polymers 16, no. 15: 2178. https://doi.org/10.3390/polym16152178

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