The Preparation and Performance Analysis of a Cr2O3 Gel Abrasive Tool for Sapphire Substrate Polishing
Round 1
Reviewer 1 Report
On what basis Abrasive tool is prepared? No literature evidance shown
Figure 3 and 4, how many times experiments repeated. Provide error bar
Fig3 and 4 represents same ? why author repeated twice
Fig 6, encircle the findings
Results are not dicussed by comparing with existing literatures, in most cases
How friction experiments were conducted? Details about input, interface, equipment, roughness is missing
Whether friction experiments repeated thrice?
What load is applied and why author restricted for 10 mins.
Whether the contact between interfaces are flat on flat or circular on flat?
Fig 10, lot of abrasion is visible, why such phenomenon exists?
Author Response
Please see the attachment
Reviewer 2 Report
This manuscript presents the polishing of sapphire using chromium oxide polishing tools. Follows are the comments on this work.
1. The English of this manuscript is not well organized, and lots of grammatical errors exist in text. Therefore, this manuscript should be corrected and honed by a native English speaker.
2. There should be a blank between a digit and its followed unit, such as 2.69 nm, 42 MPa, etc., which should be corrected thoroughly throughout this manuscript.
3. In this work, sapphire, CMP and CMG are described, while recent significant progresses on them are lost. In this regard, follows should be added in Introduction. Chemical mechanical polishing (CMP) is an effective method to obtain atomic surface for the use in high performance devices (COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS 651 (2022) 129718; APPLIED SURFACE SCIENCE 597 (2022) 153703). However, traditional CMP usually uses toxic and polluted ingredients, resulting in the pollution to the environment. To solve this challenge, novel green CMP is developed for sapphire (Nanoscale, 2020, 12 (2020) 22518-22526; ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY 11 (2022) 084002), copper (Applied Surface Science, 467-468 (2019) 5-11), and alloys (Applied Surface Science, 506 (2020) 144670), and CMP mechanisms are elucidated. Moreover, green mechanical chemical grinding is also proposed (Journal of Alloys and Compounds, 726 (2017) 514-524). These studies are a great contribution to the conventional CMP and manufacturing (Journal of Manufacturing Processes, 62 (2021) 762-771; ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY 11 (2022) 074002).
4. A space is lost between a word and its subsequent bracket, e.g. grinding (CMG), etc., which should be revised carefully in context.
5. What is the aim of this work? What are the challenges and difficulties in this field? Introduction just lists some references. Challenges and difficulties met in the field should be well addressed in both Abstract and Introduction, and then the significance and necessity of this work could be brought out.
6. What is CMP and CTAB? When an abbreviation appears firstly, it should be written with full words, and otherwise it will confuse the readers.
7. For Figs. 3, 4, 5, 7, 8, 9 and 12, standard deviation is lost. For a test, at least three experiments should be performed, and then an average value and standard deviation could be obtained.
8. In Figs. 6, 10, 11, and 13, there should be a blank between a digit and unit on the scale bar. In addition, the comparison is not good between a black background and red words. It is necessary to change the color of words from red to white.
9. Conclusion should be rewritten. At present, it is too long to read.
10. In Fig. 16, the font size for scales and words in figures should be the same as that in text.
11. For Fig. 14, the sapphire wafer is difficult to identify, and the background should be replaced by blue or black colors.
Author Response
Please see the attachment
Author Response File: 
Author Response.docx
Round 2
Reviewer 2 Report
All the comments have been revised and corrected, and now it is appropriate for publication.
