Next Article in Journal
Effects of Powder Characteristics and Chemical Composition on the Properties of 25Cr7Ni Stainless Steel Fabricated by Laser-Powder Bed Fusion and Evaluation of Process Simulation
Previous Article in Journal
Microstructures and Electrical Resistivity of Aluminum–Copper Joints
Previous Article in Special Issue
A Review on the Development of Adding Graphene to Sn-Based Lead-Free Solder
 
 

Order Article Reprints

Journal: Metals, 2023
Volume: 13
Number: 1475

Article: Microstructure and Properties of Electromigration of Sn58Bi/Cu Solder Joints with Different Joule Thermal Properties
Authors: by Yijie Gao, Keke Zhang, Chao Zhang, Yuming Wang and Weiming Chen
Link: https://www.mdpi.com/2075-4701/13/8/1475

MDPI provides article reprints in high quality with convenient shipping to destinations worldwide. The articles are printed in on premium paper with high-resolution figures. Our covers are customized to your article and designed to be complimentary to the journal. These reprints are ideal additions to your portfolio. Copy details: 135g/m2 paper, 2x stitched, full colour and glossy finish, orderable in quantities from 10 to 1000.

If you have any questions, or special requests, please write to our support team; we are happy to provide you with the information you need.

Reprint Options

If you need more than 400 copies, please contact us by e-mail (publisher@mdpi.com) and we will prepare an individual offer for you.

Order Cost and Details

Contact Person

Invoice Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop