Evaluation of Solidification and Interfacial Reaction of Sn-Bi and Sn-Bi-In Solder Alloys in Copper and Nickel Interfaces
Abstract
:1. Introduction
2. Materials and Methods
3. Results and Discussion
3.1. Solidification of As-Soldered Sn-Bi and Sn-Bi-In Alloy Samples in Copper
3.2. Wetting Behavior in Copper and Nickel Interfaces
3.3. Interfacial Reaction of the Sn-40%Bi-10%In Samples in Copper
3.4. Adhesion Strength of the Sn-40%Bi-10%In Alloy in Copper and Nickel
4. Conclusions
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- Significant macrosegregation of Bi towards the Cu/alloy interface in both Sn-40%Bi and Sn-40%Bi-10%In alloys was observed, with the latter showing the formation of coarse Bi and a more pronounced segregation pattern. This segregation aligns with previous findings that higher Bi content results in thicker IMC layers.
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- Both alloys exhibited β-Sn dendritic primary phases, with Bi forming in eutectic-like morphologies in the ternary alloy (Sn-40%Bi-10%In) and as a final eutectic reaction in the binary alloy (Sn-40%Bi).
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- The Sn-40%Bi-10%In alloy demonstrated a larger cell spacing (200 μm) as compared to the binary Sn-40%Bi alloy, which had a spacing of 82 μm. The presence of In significantly influenced the cell and Bi spacing, resulting in approximately three times coarser structures due to the extended solidification interval.
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- The Sn-40%Bi-10%In/Cu joint exhibited the formation of Cu6(Sn,In)5 IMCs, with In incorporation leading to a reduction in IMC layer growth rate by 40% compared to the Sn-40%Bi alloy. The addition of In increased the activation energy needed for the formation of the Cu6Sn5 layer, making its growth more difficult. Adhesion strength tests indicated slightly higher adhesion strength in the Sn-Bi-In/Ni joints (37 MPa) compared to the Sn-Bi-In/Cu joints (19 MPa), which is attributed to the finer microstructure and less tortuous IMC layer formed in the contact with nickel. The fracture predominantly occurred at the alloy/IMC boundary, with dimples and cleavage features observed in the fracture’s surface.
Author Contributions
Funding
Data Availability Statement
Acknowledgments
Conflicts of Interest
References
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Leal, J.R.d.S.; Reyes, R.A.V.; Gouveia, G.L.d.; Coury, F.G.; Spinelli, J.E. Evaluation of Solidification and Interfacial Reaction of Sn-Bi and Sn-Bi-In Solder Alloys in Copper and Nickel Interfaces. Metals 2024, 14, 963. https://doi.org/10.3390/met14090963
Leal JRdS, Reyes RAV, Gouveia GLd, Coury FG, Spinelli JE. Evaluation of Solidification and Interfacial Reaction of Sn-Bi and Sn-Bi-In Solder Alloys in Copper and Nickel Interfaces. Metals. 2024; 14(9):963. https://doi.org/10.3390/met14090963
Chicago/Turabian StyleLeal, Jaderson Rodrigo da Silva, Rodrigo André Valenzuela Reyes, Guilherme Lisboa de Gouveia, Francisco Gil Coury, and José Eduardo Spinelli. 2024. "Evaluation of Solidification and Interfacial Reaction of Sn-Bi and Sn-Bi-In Solder Alloys in Copper and Nickel Interfaces" Metals 14, no. 9: 963. https://doi.org/10.3390/met14090963