Effect of Remelting Duration on Microstructure and Properties of SiCp/Al Composite Fabricated by Powder-Thixoforming for Electronic Packaging
Abstract
:1. Introduction
2. Materials and Methods
2.1. Fabrication of SiCp/Al Composites
2.2. Material Characterization
3. Results and Discussion
3.1. Microstructure
3.2. Thermal Physical Properties
3.2.1. Thermal Conductivity of SiCp/Al Composites
3.2.2. Coefficient of Thermal Expansion of SiCp/Al Composites
3.3. Mechanical Properties of SiCp/Al Composites
4. Conclusions
- (1)
- The extension of the remelting duration could decrease the number of pores in the composite microstructure and enhance its density. The composites remelted at 90 min exhibited the optimal TC value because no excessive interfacial reaction occurred. However, further increased remelting duration could promote the formation of harmful Al4C3 near the SiCp/Al interface, which could decrease the TC.
- (2)
- The experimental TC first increased during the period from 45 to 90 min owing to the reduced pore content and reached the maximum value of 135.79 W/(m·K) at 90 min. It then decreased because of the interfacial reaction. The calculated TC data from the modified H–J models are always higher than the experimental values regardless of the remelting duration.
- (3)
- The CTE values of SiCp/Al composites were actually unrelated to the remelting duration and varied in the range of 6–9 ppm/K. The calculated data from Turner’s model are much more consistent with the experimental values than those from the ROM in the present work.
- (4)
- The BS and hardness continuously increased from 45 to 90 min owing to the gradually reduced pore content. Further extension of the remelting duration beyond 90 min decreased the BS and enhanced the hardness because of the formation of brittle Al4C3.
Acknowledgments
Author Contributions
Conflicts of Interest
References
- Mohn, W.R.; Vukobratovich, D. Recent applications of metal matrix composites in precision instruments and optical systems. J. Mater. Eng. 1988, 10, 225–235. [Google Scholar] [CrossRef]
- Jin, S. Advances in thermal management materials for electronic applications. JOM 1998, 50, 46. [Google Scholar] [CrossRef]
- Rawal, S.P. Metal-matrix composites for space applications. JOM 2001, 53, 14–17. [Google Scholar] [CrossRef]
- Miracle, D.B. Metal matrix composites—From science to technological significance. Compos. Sci. Technol. 2005, 65, 2526–2540. [Google Scholar] [CrossRef]
- Cui, Y.; Wang, L.; Ren, J. Multi-functional SiC/Al composites for aerospace applications. Chin. J. Aeronaut. 2008, 21, 578–584. [Google Scholar]
- Beelen-Hendrikx, C.; Verguld, M. Trends in electronic packaging and assembly for portable consumer products. In Proceedings of the 3rd Electronics Packaging Technology Conference, Sheraton Towers, Singapore, 5–7 December 2000; pp. 24–32.
- Prabu, S.B. Effect of the squeeze pressure on the mechanical properties of the squeeze cast Al/SiCp metal matrix composite. Int. J. Met. 2013, 8, 299–312. [Google Scholar]
- Bishop, D.P.; Caley, W.F.; Kipouros, G.J.; Hexemer, R.L.; Donaldson, I.W. Powder metallurgy processing of 2xxx and 7xxx series aluminium alloys. Can. Metall. Q. 2011, 50, 246–252. [Google Scholar] [CrossRef]
- Liu, M.T.; Cai, X.S.; Li, G.Q. Microstructure and thermal properties of high-performance SiC reinforced Al matrix composite. Trans. Nonferr. Met. Soc. China 2013, 23, 1040–1046. [Google Scholar]
- Jung, H.K.; Kang, C.G. A study on a thixoforming process using the thixotropic behavior of an aluminum alloy with an equiaxed microstructure. J. Mater. Eng. Perform. 2000, 9, 530–535. [Google Scholar]
- Li, Y.; Liu, X.; Zhang, X.; Zhou, H. A review of semi-solid near-net forming in wrought aluminum alloy. Spec. Cast. Nonferr. Alloy. 2014, 34, A28. (In Chinese) [Google Scholar]
- Li, P.B.; Chen, T.J.; Zhang, S.Q.; Wang, Y.J. Effects of partial remelting on the microstructure evolution of SiCp/2024 aluminum composites prepared by alloy powder cold pressing. Spec. Cast. Nonferr. Alloy. 2015, 35, 260–263. [Google Scholar]
- Ferreira, L.M.P.; Robert, M.H.; Bayraktar, E.; Zaimova, D. New design of aluminium based composites through combined method of powder metallurgy and thixoforming. Adv. Mater. Res. 2014, 939, 68–75. [Google Scholar] [CrossRef]
- Li, P.B.; Chen, T.J.; Qin, H. Effects of mold temperature on the microstructure and tensile properties of SiCp/2024 Al-based composites fabricated via powder thixoforming. Mater. Des. 2016, 112, 34–45. [Google Scholar] [CrossRef]
- Zhang, X.Z.; Chen, T.J.; Qin, Y.H. Effects of solution treatment on tensile properties and strengthening mechanisms of SiCp/6061Al composites fabricated by powder thixoforming. Mater. Des. 2016, 99, 182–192. [Google Scholar] [CrossRef]
- Guo, M.H.; Liu, J.Y.; Jia, C.C.; Guo, S.J.; Li, Y.X.; Zhou, H.Y. Microstructure and properties of SiCp/Al electronic packaging materials fabricated by pseudo-semi-solid thixoforming. J. Univ. Sci. Technol. Beijing 2014, 36, 489–495. [Google Scholar]
- He, X.X.; Yan, F.Y.; Liu, Z.H.; Li, X. Effects of SiC particles with varied granulrity combination on microstructure and properties of high volume SiCp/Al composites. Spec. Cast. Nonferr. Alloy. 2015, 35, 742–745. (In Chinese) [Google Scholar]
- Liu, J.Y.; Liu, Y.C.; Liu, G.Q.; Yin, Y.S.; Shi, Z.L. Oxidation behavior of silicon carbide particales and their interfacial characterization in aluminum matrix composite. Trans. Nonferr. Met. Soc. China 2002, 12, 961–966. [Google Scholar]
- Wang, Y.W. The Microstructures and Properties of SiCp/Al Matrix Composites Prepared by Reciprocating Extrusion. Master’s Thesis, Xi’an University of Technology, Xi’an, China, 24 March 2009. [Google Scholar]
- Lee, J.M.; Lee, S.K.; Hong, S.J.; Kwon, Y.N. Microstructures and thermal properties of A356/SiCp composites fabricated by liquid pressing method. Mater. Des. 2012, 37, 313–316. [Google Scholar] [CrossRef]
- Lee, J.C.; Ahn, J.P.; Shim, J.H.; Shi, Z.; Lee, H.I. Control of the interface in SiC/Al composites. Scr. Mater. 1999, 41, 895–900. [Google Scholar] [CrossRef]
- Aghajanian, M.K.; Rocazella, M.A.; Burke, J.T.; Keck, S.D. The fabrication of metal matrix composites by a pressureless infiltration technique. J. Mater. Sci. 1991, 26, 447–454. [Google Scholar] [CrossRef]
- Ren, S.; He, X.; Qu, X.; Humail, I.S.; Li, Y. Effect of Mg and Si in the aluminum on the thermo-mechanical properties of pressureless infiltrated SiCp/Al composites. Compos. Sci. Technol. 2007, 67, 2103–2113. [Google Scholar] [CrossRef]
- Masayuki, M.; Yoshiharu, T.; Akio, K. Thermal Expansion Behavior of SiCp/Aluminum alloy composites fabricated by a low-pressure infiltration process. Mater. Trans. 2004, 45, 1769–1773. [Google Scholar]
- Shi, F.; Qing, D.F.; Wu, S.H. The analyses of interracial reactions of SiCp/Al System by XRD and Thermodynamic. Bull. Chin. Ceram. Soc. 2003, 6, 12–16. [Google Scholar]
- Viala, J.C.; Bosselet, F.; Laurent, V.; Lepetitcorps, Y. Mechanism and kinetics of the chemical interaction between liquid aluminium and silicon-carbide single crystals. J. Mater. Sci. 1992, 28, 5301–5312. [Google Scholar] [CrossRef]
- Carotenuto, G.; Arpaia, G.; Nicolais, L. Erosion of reinforcement particles in SiC/aluminum composites. Appl. Compos. Mater. 1994, 1, 449–463. [Google Scholar] [CrossRef]
- Gui, M.; Kang, S.B.; Euh, K. Thermal conductivity of Al–SiCp composites by plasma spraying. Scr. Mater. 2005, 52, 51–56. [Google Scholar] [CrossRef]
- Hasselman, D.P.H.; Donaldson, K.Y.; Geiger, A.L. Effect of reinforcement particle size on the thermal conductivity of a particulate-silicon carbide-reinforced aluminum matrix composite. J. Mater. Sci. Lett. 1992, 12, 420–423. [Google Scholar] [CrossRef]
- Tian, R.Z.; Wang, Z.T. Aluminum and its Working Hand Book; Central South University: Changsha, China, 2000; pp. 155–169. [Google Scholar]
- Lynch, J.F.; Spindel, R.C.; Ching-Sang, C.; Miller, J.H.; Birdsall, T.G. Effective Thermal Conductivity of Composites with Interfacial Thermal Barrier Resistance; Springer: New York, NY, USA, 1989; pp. 508–515. [Google Scholar]
- Molina, J.M.; Prieto, R.; Narciso, J.; Louis, E. The effect of porosity on the thermal conductivity of Al–12 wt % Si/SiC composites. Scr. Mater. 2009, 60, 582–585. [Google Scholar] [CrossRef]
- Chu, K.; Jia, C.; Tian, W.; Liang, X.; Chen, H.; Guo, H. Thermal conductivity of spark plasma sintering consolidated SiCp/Al composites containing pores: Numerical study and experimental validation. Compos. Part A Appl. Sci. Manuf. 2010, 41, 161–167. [Google Scholar] [CrossRef]
- Gao, W.; Jia, C.; Jia, X.; Liang, X.; Chu, K.; Zhang, L.; Huang, H.; Liu, M. Effect of processing parameters on the microstructure and thermal conductivity of diamond/Ag composites fabricated by spark plasma sintering. Rare Met. 2010, 29, 625–629. [Google Scholar] [CrossRef]
- Gencer, A.; Aksu, E.; Nezir, S.; Celebi, S.; Yanmaz, E.; Ates, A.; Shen, Y.L. Combined effects of microvoids and phase contiguity on the thermal expansion of metal-ceramic composites. Mater. Sci. Eng. A 1997, 237, 102–108. [Google Scholar]
- Zhang, Q.; Wu, G.; Jiang, L.; Chen, G. Thermal expansion and dimensional stability of Al–Si matrix composite reinforced with high content SiC. Mater. Chem. Phys. 2003, 82, 780–785. [Google Scholar] [CrossRef]
- Geiger, A.L.; Jackson, M. Low-expansion MMCs boost avionics. Adv. Mater. Process. 1989, 136, 23–30. [Google Scholar]
- Elomari, S.; Skibo, M.D.; Sundarrajan, A.; Richards, H. Thermal expansion behavior of particulate metal-matrix composites. Compos. Sci. Technol. 1998, 58, 369–376. [Google Scholar] [CrossRef]
- Vaidya, R.U.; Chawla, K.K. Thermal expansion of metal-matrix composites. Compos. Sci. Technol. 1994, 50, 13–22. [Google Scholar] [CrossRef]
- Luan, B.F.; Pei, Y.F.; Huang, T.L.; Ye, Q.; Huang, G.J.; Yang, Q. Fabrication and thermal expansion properties of particle reinforced Al matrix composites. J. Chongqing Univ. 2010, 33, 136–142. [Google Scholar]
- Zhang, X.; Chen, T.; Qin, H.; Wang, C. A comparative study on permanent mold cast and powder thixoforming 6061 aluminum alloy and SiCp/6061Al composite: Microstructures and mechanical properties. Materials 2016, 9, 407. [Google Scholar] [CrossRef]
SiCp | Alloy Powders | ||||||
---|---|---|---|---|---|---|---|
SiC | Fe | Si | O | Al | Fe | Si | Cu |
97.2% | 1.14% | 0.98% | 0.35% | 86.82% | 0.106% | 13.06% | 0.0006% |
Remelting Duration (min) | Pore Size (μm) | Pore (%) | Density (%) |
---|---|---|---|
45 | 38.537 | 8.64 | 90.2 |
60 | 32.334 | 4.71 | 93.1 |
75 | 28.392 | 2.37 | 96.4 |
90 | 20.433 | 1.96 | 97.3 |
105 | 18.138 | 0.93 | 98.5 |
120 | - | - | 99.2 |
Remelting Duration (min) | MSiC (g) | VSiC (cm3) | Vc (cm3) | SiC Vol % |
---|---|---|---|---|
45 | 1.7283 ± 0.0087 | 0.535 | 1.078 | 49.63 |
60 | 1.5782 ± 0.0031 | 0.489 | 0.987 | 49.54 |
75 | 1.7606 ± 0.0105 | 0.545 | 1.104 | 49.37 |
90 | 1.6121 ± 0.0048 | 0.499 | 1.016 | 49.11 |
105 | 1.6156 ± 0.0056 | 0.500 | 1.025 | 48.78 |
120 | 1.5584 ± 0.0043 | 0.483 | 0.998 | 48.40 |
© 2016 by the authors; licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC-BY) license (http://creativecommons.org/licenses/by/4.0/).
Share and Cite
Cai, S.; Chen, T.; Zhang, X. Effect of Remelting Duration on Microstructure and Properties of SiCp/Al Composite Fabricated by Powder-Thixoforming for Electronic Packaging. Metals 2016, 6, 311. https://doi.org/10.3390/met6120311
Cai S, Chen T, Zhang X. Effect of Remelting Duration on Microstructure and Properties of SiCp/Al Composite Fabricated by Powder-Thixoforming for Electronic Packaging. Metals. 2016; 6(12):311. https://doi.org/10.3390/met6120311
Chicago/Turabian StyleCai, Siyu, Tijun Chen, and Xuezheng Zhang. 2016. "Effect of Remelting Duration on Microstructure and Properties of SiCp/Al Composite Fabricated by Powder-Thixoforming for Electronic Packaging" Metals 6, no. 12: 311. https://doi.org/10.3390/met6120311