Chen, J.; Zhou, L.; Hang, Z.; Bian, X.; Huo, T.; Peng, B.; Li, H.; Wen, Y.; Du, H.
Electrospun Biomaterials for Scarless Acne Wound Healing: Advances and Prospects. J. Funct. Biomater. 2025, 16, 316.
https://doi.org/10.3390/jfb16090316
AMA Style
Chen J, Zhou L, Hang Z, Bian X, Huo T, Peng B, Li H, Wen Y, Du H.
Electrospun Biomaterials for Scarless Acne Wound Healing: Advances and Prospects. Journal of Functional Biomaterials. 2025; 16(9):316.
https://doi.org/10.3390/jfb16090316
Chicago/Turabian Style
Chen, Jiahui, Liping Zhou, Zhongci Hang, Xiaochun Bian, Tong Huo, Bing Peng, Haohao Li, Yongqiang Wen, and Hongwu Du.
2025. "Electrospun Biomaterials for Scarless Acne Wound Healing: Advances and Prospects" Journal of Functional Biomaterials 16, no. 9: 316.
https://doi.org/10.3390/jfb16090316
APA Style
Chen, J., Zhou, L., Hang, Z., Bian, X., Huo, T., Peng, B., Li, H., Wen, Y., & Du, H.
(2025). Electrospun Biomaterials for Scarless Acne Wound Healing: Advances and Prospects. Journal of Functional Biomaterials, 16(9), 316.
https://doi.org/10.3390/jfb16090316