A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging
Abstract
:1. Introduction
2. Interconnections Using Ag NP Pastes
2.1. Description of the Synthesis and Sintering of Ag NP Pastes
2.2. Synthesis of Ag NP Pastes and Effect of Organic Components
Die-Attach Systems | Electrical Conductivity, ×105 (Ω cm)−1 | Ref. |
---|---|---|
Ag NP paste | 2.5 | [45] |
Cu micro-paste | 1.3 | [46] |
Ag-Al NP paste | 1.01 | [47] |
Au solder alloys | 0.2–0.4 | [48,49] |
Sn-Pb solder alloys | 0.5–0.9 | [50] |
2.3. Sintering–Bonding Process of Ag NP Pastes
2.4. Sintering Mechanisms of Ag NP Pastes
2.5. High-Temperature Joint Properties of Ag NP Pastes
3. Summary and Future Trends
- (1)
- Generally, in order to obtain robust joints with a high shear strength, the sintering-bonding process is usually carried out with an auxiliary pressure, which limits widespread applications, especially in flexible electronic devices. Future work needs to focus on reducing the pressure applied on chips during the sintering processes.
- (2)
- The bonding between NP pastes and metal substrates is a complicated process, which relies on multiple factors, such as organic components, sintering temperature, pressure, and paste deposition distribution. Future work needs to focus on the interfacial reactions between NP pastes and metal base during the sintering processes.
- (3)
- The classical sphere-to-sphere models are usually used to investigate the sintering-bonding mechanism of NP pastes. For other pastes which have various morphologies, the sintering-bonding mechanism could be different. Future work needs to focus on the study of the theoretical models.
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Conflicts of Interest
References
- Chen, C.; Suganuma, K. Microstructure and mechanical properties of sintered Ag particles with flake and spherical shape from nano to micro size. Mater. Des. 2019, 162, 311–321. [Google Scholar] [CrossRef]
- Navarro, L.A.; Perpina, X.; Godignon, P.; Montserrat, J.; Banu, V.; Vellvehi, M.; Jorda, X. Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications. IEEE Trans. Power Electron. 2013, 29, 2261–2271. [Google Scholar] [CrossRef]
- Kong, Y.-F.; Li, X.; Mei, Y.-H.; Lu, G.-Q. Effects of Die-Attach Material and Ambient Temperature on Properties of High-Power COB Blue LED Module. IEEE Trans. Electron. Devices 2015, 62, 2251–2256. [Google Scholar] [CrossRef]
- Hong, W.S.; Kim, M.S.; Kim, D.; Oh, C. Silver Sintered Joint Property between Silicon Carbide Device and Ceramic Substrate for Electric Vehicle Power Module. J. Electron. Mater. 2018, 48, 122–134. [Google Scholar] [CrossRef]
- Tan, K.S.; Wong, Y.H.; Cheong, K.Y. Thermal characteristic of sintered Ag–Cu nanopaste for high-temperature die-attach application. Int. J. Therm. Sci. 2015, 87, 169–177. [Google Scholar] [CrossRef]
- Shen, W.; Zhang, X.; Huang, Q.; Xu, Q.; Song, W. Preparation of solid silver nanoparticles for inkjet printed flexible electronics with high conductivity. Nanoscale 2014, 6, 1622–1628. [Google Scholar] [CrossRef] [PubMed]
- Zhang, W.; Chen, J.; Deng, Z.; Liu, Z.; Huang, Q.; Guo, W.; Huang, J. The pressureless sintering of micron silver paste for electrical connections. J. Alloys Compd. 2019, 795, 163–167. [Google Scholar] [CrossRef]
- Yan, J.; Zou, G.; Wu, A.P.; Ren, J.; Yan, J.; Hu, A.; Zhou, Y. Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging. Scr. Mater. 2012, 66, 582–585. [Google Scholar] [CrossRef]
- Jiang, Q.; Zhang, S.; Li, J. Grain size-dependent diffusion activation energy in nanomaterials. Solid State Commun. 2004, 130, 581–584. [Google Scholar] [CrossRef]
- Kim, M.I.; Choi, E.B.; Leea, J.-H. Improved sinter-bonding properties of silver-coated copper flake paste in air by the addition of sub-micrometer silver-coated copper particles. J. Mater. Res. Technol. 2020, 9, 16006–16017. [Google Scholar] [CrossRef]
- Moon, K.-S.; Dong, H.; Maric, R.; Pothukuchi, S.; Hunt, A.; Li, Y.; Wong, C.P. Thermal behavior of silver nanoparticles for low-temperature interconnect applications. J. Electron. Mater. 2005, 34, 168–175. [Google Scholar] [CrossRef]
- Zhang, M.; Efremov, M.Y.; Schiettekatte, F.; Olson, E.A.; Kwan, A.T.; Lai, S.L.; Wisleder, T.; Greene, J.E.; Allen, L.H. Size-dependent melting point depression of nanostructures: Nanocalorimetric measurements. Phys. Rev. B 2000, 62, 10548–10557. [Google Scholar] [CrossRef] [Green Version]
- Yan, J.; Zou, G.; Zhang, Y.; Li, J.; Liu, L.; Wu, A.; Zhou, Y.N. Metal–Metal Bonding Process Using Cu + Ag Mixed Nanoparticles. Mater. Trans. 2013, 54, 879–883. [Google Scholar] [CrossRef] [Green Version]
- Yan, J.; Zou, G.; Wu, A.; Ren, J.; Hu, A.; Zhou, Y.N. Polymer-Protected Cu-Ag Mixed NPs for Low-Temperature Bonding Application. J. Electron. Mater. 2012, 41, 1886–1892. [Google Scholar] [CrossRef]
- Ko, S.H.; Pan, H.; Grigoropoulos, C.P.; Luscombe, C.K.; Fréchet, J.M.J.; Poulikakos, D. All-inkjet-printed flexible electronics fabrication on a polymer substrate by low-temperature high-resolution selective laser sintering of metal nanoparticles. Nanotechnology 2007, 18, 345202. [Google Scholar] [CrossRef]
- Cui, Q.; Gao, F.; Mukherjee, S.; Gu, Z. Joining and Interconnect Formation of Nanowires and Carbon Nanotubes for Nanoelectronics and Nanosystems. Small 2009, 5, 1246–1257. [Google Scholar] [CrossRef] [PubMed]
- Decharat, A.; Wagle, S.; Jacobsen, S.; Melandsø, F. Using Silver Nano-Particle Ink in Electrode Fabrication of High Frequency Copolymer Ultrasonic Transducers: Modeling and Experimental Investigation. Sensors 2015, 15, 9210–9227. [Google Scholar] [CrossRef] [Green Version]
- Huang, Q.; Shen, W.; Xu, Q.; Tan, R.; Song, W. Properties of polyacrylic acid-coated silver nanoparticle ink for inkjet printing conductive tracks on paper with high conductivity. Mater. Chem. Phys. 2014, 147, 550–556. [Google Scholar] [CrossRef]
- Yan, J.; Zou, G.; Hu, A.; Zhou, Y.N. Preparation of PVP coated Cu NPs and its applications for Low-Temperature Bonding. J. Mater. Chem. 2011, 21, 15981–15986. [Google Scholar]
- Hu, A.; Guo, J.Y.; Alarifi, H.; Patane, G.; Zhou, Y.; Compagnini, G.; Xu, C.X. Low temperature sintering of Ag nanoparticles for flexible electronics packaging. Appl. Phys. Lett. 2010, 97, 153117. [Google Scholar] [CrossRef]
- Lu, Y.; Huang, J.Y.; Wang, C.; Sun, S.; Lou, J. Cold welding of ultrathin gold nanowires. Nat. Nanotechnol. 2010, 5, 218–224. [Google Scholar] [CrossRef]
- Ide, E.; Angata, S.; Hirose, A.; Kobayashi, K. Metal-metal bonding process using Ag metallo-organic nanoparticles. Acta Mater. 2005, 53, 2385–2393. [Google Scholar] [CrossRef]
- Maruyama, M.; Matsubayashi, R.; Iwakuro, H.; Isoda, S.; Komatsu, T. Silver nanosintering: A lead-free alternative to soldering. Appl. Phys. A 2008, 93, 467–470. [Google Scholar] [CrossRef]
- Morita, T.; Ide, E.; Yasuda, Y.; Hirose, A.; Kobayashi, K. Study of Bonding Technology Using Silver Nanoparticles. Jpn. J. Appl. Phys. 2008, 47, 6615–6622. [Google Scholar] [CrossRef]
- Bai, J.G.; Guo-Quan, L. Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly. IEEE Trans. Device Mater. Reliab. 2006, 6, 436–441. [Google Scholar] [CrossRef]
- Akada, Y.; Tatsumi, H.; Yamaguchi, T.; Hirose, A.; Morita, T.; Ide, E. Interfacial Bonding Mechanism Using Silver Metallo-Organic Nanoparticles to Bulk Metals and Observation of Sintering Behavior. Mater. Trans. 2008, 49, 1537–1545. [Google Scholar] [CrossRef] [Green Version]
- Yan, J.; Zou, G.; Wu, A.; Ren, J.; Yan, J.; Hu, A.; Liu, L.; Zhou, Y.N. Effect of PVP on the low temperature bonding process using polyol prepared Ag nanoparticle paste for electronic packaging application. J. Phys. Conf. Ser. 2012, 379, 012024. [Google Scholar] [CrossRef] [Green Version]
- Fang, H.; Wang, C.; Zhou, S.; Kang, Q.; Wang, T.; Yang, D.; Tian, Y.; Suga, T. Rapid pressureless and low-temperature bonding of large-area power chips by sintering two-step activated Ag paste. J. Mater. Sci. Mater. Electron. 2020, 31, 6497–6505. [Google Scholar] [CrossRef]
- Zhang, S.; Xu, X.; Lin, T.; He, P. Recent advances in nano-materials for packaging of electronic devices. J. Mater. Sci. Mater. Electron. 2019, 30, 13855–13868. [Google Scholar] [CrossRef]
- Sun, Y.; Xia, Y. Shape-Controlled Synthesis of Gold and Silver Nanoparticles. Science 2003, 34, 2176–2179. [Google Scholar] [CrossRef]
- Suriati, G.; Mariatti, M.; Azizan, A. Synthesis of Silver Nanoparticles by Chemical Reduction Method: Effect of Reducing Agent and Surfactant Concentration. Int. J. Automot. Mech. Eng. 2014, 10, 1920–1927. [Google Scholar] [CrossRef]
- Krajczewski, J.; Joubert, V.; Kudelski, A. Light-induced transformation of citrate-stabilized silver nanoparticles: Photochemical method of increase of SERS activity of silver colloids. Colloids Surf. A Physicochem. Eng. Asp. 2014, 456, 41–48. [Google Scholar] [CrossRef]
- Krajczewski, J.; Kołątaj, K.; Kudelski, A. Light-induced growth of various silver seed nanoparticles: A simple method of synthesis of different silver colloidal SERS substrates. Chem. Phys. Lett. 2015, 625, 84–90. [Google Scholar] [CrossRef]
- Park, S.H.; Son, J.G.; Lee, T.G.; Park, H.M.; Song, J.Y. One-step large-scale synthesis of micrometer-sized silver nanosheets by a template-free electrochemical method. Nanoscale Res. Lett. 2013, 8, 248. [Google Scholar] [CrossRef] [Green Version]
- Lu, Y.D.; Chen, X.X.; Chen, L.H. Applied Mechanics and Materials; Trans Tech Publications: Bäch, Switzerland, 2020; pp. 158–161. [Google Scholar]
- Zhu, D.; Yan, J.; Xie, J. Reshaping enhancement of gold nanorods by femtosecond double-pulse laser. Opt. Lett. 2020, 45, 1758–1761. [Google Scholar] [CrossRef] [PubMed]
- Yan, J.; Zhu, D.; Xie, J.; Shao, Y.; Xiao, W. Light Tailoring of Internal Atomic Structure of Gold Nanorods. Small 2020, 16, 2001101. [Google Scholar] [CrossRef] [PubMed]
- Jia, Q.; Zou, G.; Wang, W.; Ren, H.; Zhang, H.; Deng, Z.; Feng, B.; Liu, L. Sintering Mechanism of a Supersaturated Ag–Cu Nanoalloy Film for Power Electronic Packaging. ACS Appl. Mater. Interfaces 2020, 12, 16743–16752. [Google Scholar] [CrossRef]
- Qiao, M.; Yan, J.; Qu, L.; Zhao, B.; Yin, J.; Cui, T.; Jiang, L. Femtosecond Laser Induced Phase Transformation of TiO2 with Exposed Reactive Facets for Improved Photoelectrochemistry Performance. ACS Appl. Mater. Interfaces 2020, 12, 41250–41258. [Google Scholar] [CrossRef]
- Kim, K.-S.; Park, B.-G.; Jung, K.-H.; Kim, J.-W.; Jeong, M.Y.; Jung, S.-B. Microwave Sintering of Silver Nanoink for Radio Frequency Applications. J. Nanosci. Nanotechnol. 2015, 15, 2333–2337. [Google Scholar] [CrossRef]
- Wei, C.; Li, M.; Zhao, X. Surface-Enhanced Raman Scattering (SERS) with Silver Nano Substrates Synthesized by Microwave for Rapid Detection of Foodborne Pathogens. Front. Microbiol. 2018, 9, 2857. [Google Scholar] [CrossRef]
- Ledrappier, F. Research of nano-silver colloids prepared by microwave-assisted synthesis method and its fresh-keeping of strawberry. Sci. Technol. Food Ind. 2014, 35, 326–327. [Google Scholar]
- Li, Y.; Jing, H.; Han, Y.; Xu, L.; Lu, G. Microstructure and Joint Properties of Nano-Silver Paste by Ultrasonic-Assisted Pressureless Sintering. J. Electron. Mater. 2016, 45, 3003–3012. [Google Scholar] [CrossRef]
- Zhang, W.; Zhang, W.; Qiao, X.; Qiu, X.; Chen, Q.; Cai, Y. Controllable preparation of silver nanostructures and the effects of acidity-basicity of the reaction system. Sci. Adv. Mater. 2014, 6, 304–311. [Google Scholar] [CrossRef]
- Bai, J.; Zhang, Z.; Calata, J.; Lu, G. 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis; IEEE: New York, NY, USA, 2005; pp. 1–5. [Google Scholar]
- Kahler, J.; Heuck, N.; Wagner, A.; Stranz, A.; Peiner, E.; Waag, A. Sintering of Copper Particles for Die Attach. IEEE Trans. Compon. Packag. Manuf. Technol. 2012, 2, 1587–1591. [Google Scholar] [CrossRef]
- Manikam, V.R.; Razak, K.A.; Cheong, K.Y. Sintering of Silver–Aluminum Nanopaste with Varying Aluminum Weight Percent for Use as a High-Temperature Die-Attach Material. IEEE Trans. Compon. Packag. Manuf. Technol. 2012, 2, 1940–1948. [Google Scholar] [CrossRef]
- Zeng, G.; McDonald, S.; Nogita, K. Development of high-temperature solders: Review. Microelectron. Reliab. 2012, 52, 1306–1322. [Google Scholar] [CrossRef]
- Manikam, V.R.; Cheong, K.Y. Die Attach Materials for High Temperature Applications: A Review. IEEE Trans. Compon. Packag. Manuf. Technol. 2011, 1, 457–478. [Google Scholar] [CrossRef]
- Abtew, M.; Selvaduray, G. Lead-free Solders in Microelectronics. Mater. Sci. Eng. R Rep. 2000, 27, 95–141. [Google Scholar] [CrossRef]
- Siow, K.S.; Chua, S.T. Thermal Ageing Studies of Sintered Micron-Silver (Ag) Joint as a Lead-Free Bonding Material. Met. Mater. Int. 2020, 26, 1404–1414. [Google Scholar] [CrossRef]
- Ogura, H.; Maruyama, M.; Matsubayashi, R.; Ogawa, T.; Nakamura, S.; Komatsu, T.; Nagasawa, H.; Ichimura, A.; Isoda, S. Carboxylate-Passivated Silver Nanoparticles and Their Application to Sintered Interconnection: A Replacement for High Temperature Lead-Rich Solders. J. Electron. Mater. 2010, 39, 1233–1240. [Google Scholar] [CrossRef]
- Lei, T.G.; Calata, J.N.; Guo-Quan, L.; Xu, C.; Shufang, L. Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area (>100 mm2) Chips. Components and Packaging Technologies. IEEE Trans. Compon. Packag. Technol. 2010, 33, 98–104. [Google Scholar] [CrossRef]
- Alarifi, H.; Hu, A.; Yavuz, M.; Zhou, Y.N. Silver Nanoparticle Paste for Low-Temperature Bonding of Copper. J. Electron. Mater. 2011, 40, 1394–1402. [Google Scholar] [CrossRef]
- Zou, G.; Yan, J.; Mu, F.; Wu, A.; Ren, J.; Hu, A. Low Temperature Bonding of Cu Metal through Sintering of Ag Nanoparticles for High Temperature Electronic Application. Open Surf. Sci. J. 2010, 3, 70–75. [Google Scholar] [CrossRef]
- Yan, J.; Zou, G.; Wu, A.; Ren, J.; Hu, A.; Zhou, Y.N. Improvement of Bondability by Depressing the Inhomogeneous Distribution of Nanoparticles in a Sintering Bonding Process with Silver Nanoparticles. J. Electron. Mater. 2012, 41, 1924–1930. [Google Scholar] [CrossRef]
- Deegan, R.D.; Bakajin, O.; Dupont, T.F.; Huber, G.; Nagel, S.R.; Witten, T.A. Capillary flow as the cause of ring stains from dried liquid drops. Nat. Cell Biol. 1997, 389, 827–829. [Google Scholar] [CrossRef]
- Deegan, R.D.; Bakajin, O.; Dupont, T.F.; Huber, G.; Nagel, S.R.; Witten, T.A. Contact line deposits in an evaporating drop. Phys. Rev. E 2000, 62, 756–765. [Google Scholar] [CrossRef] [Green Version]
- Hu, H.; Larson, R.G. Marangoni Effect Reverses Coffee-Ring Depositions. J. Phys. Chem. B 2006, 110, 7090–7094. [Google Scholar] [CrossRef]
- Pesach, D.; Marmur, A. Marangoni effects in the spreading of liquid mixtures on a solid. Langmuir 1987, 3, 519–524. [Google Scholar] [CrossRef]
- Hasnaoui, A.; Van Swygenhoven, H.; Derlet, P.M. Dimples on Nanocrystalline Fracture Surfaces as Evidence for Shear Plane Formation. Science 2003, 300, 1550–1552. [Google Scholar] [CrossRef]
- Bai, J.G.; Zhang, Z.Z.; Calata, J.N.; Lu, G.-Q. Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material. IEEE Trans. Components Packag. Technol. 2006, 29, 589–593. [Google Scholar] [CrossRef]
- Bakhishev, T.; Subramanian, V. Investigation of Gold Nanoparticle Inks for Low-Temperature Lead-Free Packaging Technology. J. Electron. Mater. 2009, 38, 2720–2725. [Google Scholar] [CrossRef] [Green Version]
- Lu, Y.; Liu, G.L.; Lee, L.P. High-Density Silver Nanoparticle Film with Temperature-Controllable Interparticle Spacing for a Tunable Surface Enhanced Raman Scattering Substrate. Nano Lett. 2005, 5, 5–9. [Google Scholar] [CrossRef] [PubMed]
- Johnson, R.; Evans, J.; Jacobsen, P.; Thompson, J.; Christopher, M. The Changing Automotive Environment: High-Temperature Electronics. IEEE Trans. Electron. Packag. Manuf. 2004, 27, 164–176. [Google Scholar] [CrossRef]
- Desplats, H.; Brisson, E.; Rogeon, P.; Carré, P.; Bonhomme, A. Pressureless sintering behavior and properties of Ag-SnO2. Rare Met. 2019, 38, 35–41. [Google Scholar] [CrossRef]
- Zhang, Z.L.; Wang, B.; Chen, Y.; Tang, Y.H.; Song, X.M.; Li, Q.L.; Yan, H. Ag nanoparticles assisted chemical etching for the preparation of pyramid-SiNWs binary structure. Rare Met. 2019, 38, 312–315. [Google Scholar] [CrossRef]
- Jiang, H.; Moon, K.-S.; Li, Y.; Wong, C.P. Surface Functionalized Silver Nanoparticles for Ultrahigh Conductive Polymer Composites. Chem. Mater. 2006, 18, 2969–2973. [Google Scholar] [CrossRef]
- Zhang, R.; Lin, W.; Moon, K.-S.; Wong, C.P. Fast Preparation of Printable Highly Conductive Polymer Nanocomposites by Thermal Decomposition of Silver Carboxylate and Sintering of Silver Nanoparticles. ACS Appl. Mater. Interfaces 2010, 2, 2637–2645. [Google Scholar] [CrossRef]
- Zhang, P.; Jiang, X.; Yuan, P.; Yan, H.; Yang, D. Silver nanopaste: Synthesis, reinforcements and application. Int. J. Heat Mass Transf. 2018, 127, 1048–1069. [Google Scholar] [CrossRef]
- Yan, J.; Zou, G.; Liu, L.; Zhang, D.; Bai, H.; Wu, A.-P.; Zhou, Y.N. Sintering mechanisms and mechanical properties of joints bonded using silver nanoparticles for electronic packaging applications. Weld. World 2015, 59, 427–432. [Google Scholar] [CrossRef]
- Frenkel, J. Viscous flow of crystalline bodies under the action of surface tension. J. Phys. 1945, 9, 385–391. [Google Scholar]
- Shaler, A.J.; Wulff, J. Mechanism of Sintering. Ind. Eng. Chem. 1948, 40, 838–842. [Google Scholar] [CrossRef]
- Kuczynski, G.C. Self-diffusion in sintering of metallic particles. JOM 1949, 1, 169–178. [Google Scholar] [CrossRef]
- Rockland, J. The determination of the mechanism of sintering. Acta Met. 1967, 15, 277–286. [Google Scholar] [CrossRef]
- Zhang, Z.; Zhao, B.; Hu, L. PVP Protective Mechanism of Ultrafine Silver Powder Synthesized by Chemical Reduction Processes. J. Solid State Chem. 1996, 121, 105–110. [Google Scholar] [CrossRef]
- Nyce, A.C.; Shafer, W.M. The relationship of B.E.T surface area to the sintering behavior of spherical copper particles. Int. J. Powder Metall. 1972, 8, 171–180. [Google Scholar]
- German, R.M. Manipulation of Strength during Sintering as a Basis for Obtaining Rapid Densification without Distortion. Mater. Trans. 2001, 42, 1400–1410. [Google Scholar] [CrossRef]
- Liu, W.; An, R.; Wang, C.; Zheng, Z.; Tian, Y.; Xu, R.; Wang, Z. Recent Progress in Rapid Sintering of Nanosilver for Electronics Applications. Micromachines 2018, 9, 346. [Google Scholar] [CrossRef] [Green Version]
- Chen, C.; Zhang, Z.; Wang, Q.; Zhang, B.; Gao, Y.; Sasamura, T.; Oda, Y.; Ma, N.; Suganuma, K. Robust bonding and thermal-stable Ag–Au joint on ENEPIG substrate by micron-scale sinter Ag joining in low temperature pressure-less. J. Alloys Compd. 2020, 828, 154397. [Google Scholar] [CrossRef]
- Yan, J.; Zhang, D.; Zou, G.; Liu, L.; Zhou, Y.N. Preparation of Oxidation-Resistant Ag-Cu Alloy Nanoparticles by Polyol Method for Electronic Packaging. J. Electron. Mater. 2018, 48, 1286–1293. [Google Scholar] [CrossRef]
- Yan, J.; Zhang, D.; Zou, G.; Liu, L.; Bai, H.; Wu, A.; Zhou, Y.N. Sintering Bonding Process with Ag Nanoparticle Paste and Joint Properties in High Temperature Environment. J. Nanomater. 2016, 2016, 5284048. [Google Scholar] [CrossRef]
- Paknejad, S.A.; Mannan, S.H. Review of silver nanoparticle based die attach materials for high power/temperature applications. Microelectron. Reliab. 2017, 70, 1–11. [Google Scholar] [CrossRef]
- Chua, S.; Siow, K. Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300 °C. J. Alloys Compd. 2016, 687, 486–498. [Google Scholar] [CrossRef]
Size Diameter | Coffee Ring Effect | Joints | Shear Strength (MPa) | |
---|---|---|---|---|
Aqueous-based Ag NPs | 45 nm | Existence | Gaps | 12 |
Polyol-based Ag NPs | 35 nm | Elimination | No defects | 50 |
Ag NP powders | Micro-sized | Elimination | Voids | 12 |
Pb37Sn63 | Sn96.5Ag3.5 | Au80Sn20 | Ag NP Pastes | |
---|---|---|---|---|
Bonding mechanism | Liquidus reflow | Liquidus reflow | Liquidus reflow | Sintering |
Maximum use temperature (°C) | 180 | 220 | 280 | 960 |
Electrical conductivity ×105 (Ω cm)−1 | 0.69 | 0.82 | 0.62 | 2.6 |
Thermal conductivity (W/mK) | 51 | 60 | 58 | 240 |
Elastic modulus (GPa) | 16 | 26 | 68 | 10 |
Yield strength (MPa) | 27 | 22.5 | N/A | 43 |
Tensile strength (MPa) | 27 | 52 | 275 | 43 |
Publisher’s Note: MDPI stays neutral with regard to jurisdictional claims in published maps and institutional affiliations. |
© 2021 by the author. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
Share and Cite
Yan, J. A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging. Nanomaterials 2021, 11, 927. https://doi.org/10.3390/nano11040927
Yan J. A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging. Nanomaterials. 2021; 11(4):927. https://doi.org/10.3390/nano11040927
Chicago/Turabian StyleYan, Jianfeng. 2021. "A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging" Nanomaterials 11, no. 4: 927. https://doi.org/10.3390/nano11040927