Article Versions Notes

Jiang Z, Wen K, Song C, Liu T, Dong Y, Liu M, Deng C, Deng C, Yang C. Highly Conductive Mn-Co Spinel Powder Prepared by Cu-Doping Used for Interconnect Protection of SOFC. Coatings. 2021; 11(11):1298. https://doi.org/10.3390/coatings11111298

Jiang, Zhou, Kui Wen, Chen Song, Taikai Liu, Yong Dong, Min Liu, Changguang Deng, Chunming Deng, and Chenghao Yang. 2021. "Highly Conductive Mn-Co Spinel Powder Prepared by Cu-Doping Used for Interconnect Protection of SOFC" Coatings 11, no. 11: 1298. https://doi.org/10.3390/coatings11111298

Jiang, Z., Wen, K., Song, C., Liu, T., Dong, Y., Liu, M., Deng, C., Deng, C., & Yang, C. (2021). Highly Conductive Mn-Co Spinel Powder Prepared by Cu-Doping Used for Interconnect Protection of SOFC. Coatings, 11(11), 1298. https://doi.org/10.3390/coatings11111298