Cheng, M.; Zou, X.; Zhu, Y.; Chang, T.; Cao, Q.; Ju, H.; Ning, J.; Ding, Y.; Qiang, L.
Grain Refinement Caused by Dynamic Recrystallization Under Pulsed-Wave Laser Multi-Layer Cyclic Thermal Load. Coatings 2025, 15, 788.
https://doi.org/10.3390/coatings15070788
AMA Style
Cheng M, Zou X, Zhu Y, Chang T, Cao Q, Ju H, Ning J, Ding Y, Qiang L.
Grain Refinement Caused by Dynamic Recrystallization Under Pulsed-Wave Laser Multi-Layer Cyclic Thermal Load. Coatings. 2025; 15(7):788.
https://doi.org/10.3390/coatings15070788
Chicago/Turabian Style
Cheng, Manping, Xi Zou, Yuan Zhu, Tengfei Chang, Qi Cao, Houlai Ju, Jiawei Ning, Yang Ding, and Lijun Qiang.
2025. "Grain Refinement Caused by Dynamic Recrystallization Under Pulsed-Wave Laser Multi-Layer Cyclic Thermal Load" Coatings 15, no. 7: 788.
https://doi.org/10.3390/coatings15070788
APA Style
Cheng, M., Zou, X., Zhu, Y., Chang, T., Cao, Q., Ju, H., Ning, J., Ding, Y., & Qiang, L.
(2025). Grain Refinement Caused by Dynamic Recrystallization Under Pulsed-Wave Laser Multi-Layer Cyclic Thermal Load. Coatings, 15(7), 788.
https://doi.org/10.3390/coatings15070788
