Next Article in Journal
Machine Learning (ML) Based Thermal Management for Cooling of Electronics Chips by Utilizing Thermal Energy Storage (TES) in Packaging That Leverages Phase Change Materials (PCM)
Next Article in Special Issue
Recent Progress on 3D NAND Flash Technologies
Previous Article in Journal
Adaptive Robust Control for Networked Strict-Feedback Nonlinear Systems with State and Input Quantization
Previous Article in Special Issue
Technique for Profiling the Cycling-Induced Oxide Trapped Charge in NAND Flash Memories
 
 
Article

Article Versions Notes

Electronics 2021, 10(22), 2784; https://doi.org/10.3390/electronics10222784
Action Date Notes Link
article pdf uploaded. 13 November 2021 10:45 CET Version of Record https://www.mdpi.com/2079-9292/10/22/2784/pdf-vor
article xml file uploaded 16 November 2021 04:47 CET Original file -
article xml uploaded. 16 November 2021 04:47 CET Update https://www.mdpi.com/2079-9292/10/22/2784/xml
article pdf uploaded. 16 November 2021 04:47 CET Updated version of record https://www.mdpi.com/2079-9292/10/22/2784/pdf
article html file updated 16 November 2021 04:49 CET Original file -
article html file updated 30 July 2022 16:30 CEST Update https://www.mdpi.com/2079-9292/10/22/2784/html
Back to TopTop