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Article
Peer-Review Record

Experimental Characterization of Millimeter-Wave Substrate-Integrated Waveguide Interconnect with Slot Transition in Flexible Printed Circuit Boards

Electronics 2022, 11(19), 2995; https://doi.org/10.3390/electronics11192995
by Myunghoi Kim 1,*, Bumhee Bae 2 and Jeongnam Cheon 2
Reviewer 1: Anonymous
Reviewer 2:
Electronics 2022, 11(19), 2995; https://doi.org/10.3390/electronics11192995
Submission received: 29 August 2022 / Revised: 16 September 2022 / Accepted: 20 September 2022 / Published: 21 September 2022
(This article belongs to the Special Issue Advanced RF, Microwave, and Millimeter-Wave Circuits and Systems)

Round 1

Reviewer 1 Report

This paper presents the mmWave FMSIW and HMSIW in an FPCB substrate for 5G applications. The microstrip-to-SIW transition using the balanced/single slot techniques was developed. The effect of the cutoff frequency and the per-unit-length loss were studied. The quantitative analysis of the loss for the FMSIW and HMSIW may provide a useful design guide for SIW interconnects. The study is systematic and useful. I will recommend publication of this paper. Some errors should be corrected.

1.   Figure 3 should be enlarged and redrawn to provide a better understanding.

2.   Figure 5, measured S-parameters should be added for the bent TVs should be added.

3. Please compare the proposed FMSIW/HMSIW design with other works.

Author Response

Dear reviewer

Thank you very much for your prompt and thoughtful reviews. Your comments helped us refine our paper by clarifying critical details. We take your technical concerns and comments seriously and have addressed them to the best of our ability. Please see the attached revision note file.

Thank you.

Author Response File: Author Response.pdf

Reviewer 2 Report

 

The manuscript presented the experimental characterization of the millimeter-wave full-mode (FMSIW) and half-mode substrate integrated waveguide (HMSIW) in a flexible printed circuit board (FPCB) substrate for the fifth generation (5G) wireless technology, i.e., mobile applications. They have used a directly measurement methodology of transmission loss from the interconnect pattern as a practical and engineer-friendly viewpoint. Further, it seems that the authors have also used a theoretical tool to predict and evaluate their experimental results.

 

I would suggest following major revisions, which may help, improve the manuscript.

1)    The abstract and last paragraph of the introduction need to clearly emphasize on simulation portion of work executed in the research.

2)    The second section (2. Design of Millimeter-Wave SIW with Slot Transition) needs to be renamed as “Theoretical Background: Design of Millimeter-Wave SIW with Slot Transition).

3)    The third section need to separated into two, experimental setups and experimental results. In the former the experimental procedures need to be clearly explained with proper cross referencing to ASTM/ISO standards for the all methodology in away that all the experimental procedures could be repeated.

Author Response

Dear reviewer

Thank you very much for your prompt and thoughtful reviews. Your comments helped us refine our paper by clarifying critical details. We take your technical concerns and comments seriously and have addressed them to the best of our ability. Please see the attached revision note file.

Thank you.

Author Response File: Author Response.pdf

Round 2

Reviewer 2 Report

The comments provided previously were satisfactorily addressed.

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