Next Article in Journal
Electrical Characterization of Through-Silicon-via-Based Coaxial Line for High-Frequency 3D Integration (Invited Paper)
Next Article in Special Issue
Enhancing Ransomware Attack Detection Using Transfer Learning and Deep Learning Ensemble Models on Cloud-Encrypted Data
Previous Article in Journal
Hybrid Modulated DCDC Boost Converter for Wearable Devices
Previous Article in Special Issue
Error Level Analysis Technique for Identifying JPEG Block Unique Signature for Digital Forensic Analysis
 
 
Article

Article Versions Notes

Electronics 2022, 11(20), 3416; https://doi.org/10.3390/electronics11203416
Action Date Notes Link
article xml file uploaded 21 October 2022 10:28 CEST Original file -
article xml uploaded. 21 October 2022 10:28 CEST Update https://www.mdpi.com/2079-9292/11/20/3416/xml
article pdf uploaded. 21 October 2022 10:28 CEST Version of Record https://www.mdpi.com/2079-9292/11/20/3416/pdf
article html file updated 21 October 2022 10:30 CEST Original file -
article html file updated 1 March 2023 23:27 CET Update https://www.mdpi.com/2079-9292/11/20/3416/html
Back to TopTop