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Journal: Electronics, 2022
Volume: 11
Number: 3417

Article: Electrical Characterization of Through-Silicon-via-Based Coaxial Line for High-Frequency 3D Integration (Invited Paper)
Authors: by Zhibo Zhao, Jinkai Li, Haoyun Yuan, Zeyu Wang, Giovanni Gugliandolo, Nicola Donato, Giovanni Crupi, Liming Si and Xiue Bao
Link: https://www.mdpi.com/2079-9292/11/20/3417

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