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Article
Peer-Review Record

Using Enhanced Test Systems Based on Digital IC Test Model for the Improvement of Test Yield

Electronics 2022, 11(7), 1115; https://doi.org/10.3390/electronics11071115
by Chung-Huang Yeh *,†, Jwu-E Chen †, Chia-Jui Chang and Tse-Chia Huang
Reviewer 1:
Reviewer 2: Anonymous
Electronics 2022, 11(7), 1115; https://doi.org/10.3390/electronics11071115
Submission received: 3 March 2022 / Revised: 29 March 2022 / Accepted: 29 March 2022 / Published: 31 March 2022
(This article belongs to the Section Circuit and Signal Processing)

Round 1

Reviewer 1 Report

The paper is devoted to a very important task of the quality control of critical electronic products. The authors propose the test method that provides a good balance between increasing profit and increasing test cost. The paper contains a lot of data that confirm the method efficiency. But there are some questions to the authors.

The paper is titled “Using Intelligent Test Systems…” and my main questions are:

“Why is the proposed IC test system intelligent?”,

“What makes a chart flow on figure 11 intelligent?”,

“What kind of AI techniques are used in the smart multiplex testing method?” …

There are only common phrases like “intelligent computing”, “intelligent test procedure” in the paper without any descriptions of them. I think that the “intelligent” part of the proposed approach should be described in more detail. The article is not complete without such a description.

Author Response

Dear Sir,

Please find, in the submission section of the authors, our final response to the comments received from the two reviewers to " Using Intelligent Test Systems Based on Digital IC Test Model for the Improvement of Test Yield." 

Please see the attachment

Author Response File: Author Response.pdf

Reviewer 2 Report


Comments for author File: Comments.pdf

Author Response

Dear Sir,

Please find, in the submission section of the authors, our final response to the comments received from the two reviewers to " Using Intelligent Test Systems Based on Digital IC Test Model for the Improvement of Test Yield."

Please see the attachment.

Author Response File: Author Response.pdf

Round 2

Reviewer 1 Report

Dear authors, thank you for your detailed explanations of what you mean by using the term «intelligent». The new version of the article describes your method in detail and justifies its effectiveness in the context of the term «intelligent», as you understand it. However, (and you correctly noted it in your answer) there is a well-established terminology that is understandable to most researchers in the relevant fields of knowledge. This also applies to the field of AI, to which you do not attribute your achievements, but nevertheless use the appropriate terminology. This requires direct explanation of what you mean by the term "intelligent" in the text of the article (for example, as it was given in response to my comments: "By calling this test system intelligent (ITS), we simply mean that it is a smarter and more efficient than the traditional ones.") Alternatively, the term should not be used at all. Perhaps it can be replaced by more appropriate one based on the characteristics of the proposed method. The second variant seems to me preferable.

Author Response

Dear Sir,

Please find, in the submission section of the authors, our final response to the comments received from the two reviewers to " Using Enhanced Test Systems Based on Digital IC Test Model for the Improvement of Test Yield." 

Please see the attachment.

Author Response File: Author Response.pdf

Reviewer 2 Report

The authors have successfully addressed the provided comments. Some very minor comments below:

1) reference 40 needes to be revised it should be like the following (in the version in the paper the name and surname are reversed) Psarommatis, F., 2021. A generic methodology and a digital twin for zero defect manufacturing (ZDM) performance mapping towards design for ZDM. Journal of Manufacturing Systems59, pp.507-521.

2) Figure 13 why there is the need for the traditional testing and Multiplex test? Can the multiplex test be used alone? Please provide some explanations. 

Author Response

Dear Sir,

Please find, in the submission section of the authors, our final response to the comments received from the two reviewers to " Using Enhanced Test Systems Based on Digital IC Test Model for the Improvement of Test Yield." 

Please see the attachment.

Author Response File: Author Response.pdf

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