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Journal: Electronics, 2024
Volume: 13
Number: 203

Article: Interface Contact Thermal Resistance of Die Attach in High-Power Laser Diode Packages
Authors: by Liting Deng, Te Li, Zhenfu Wang, Pu Zhang, Shunhua Wu, Jiachen Liu, Junyue Zhang, Lang Chen, Jiachen Zhang, Weizhou Huang and Rui Zhang
Link: https://www.mdpi.com/2079-9292/13/1/203

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