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Journal: Electronics, 2024
Volume: 13
Number: 2341
Article:
Challenges: ESD Protection for Heterogeneously Integrated SoICs in Advanced Packaging
Authors:
by
Zijin Pan, Xunyu Li, Weiquan Hao, Runyu Miao, Zijian Yue and Albert Wang
Link:
https://www.mdpi.com/2079-9292/13/12/2341
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