Next Article in Journal
Open-Source Hardware Platforms for Smart Converters with Cloud Connectivity
Previous Article in Journal
Analysis and Experimental Test of Electrical Characteristics on Bonding Wire
 
 
Article

Article Versions Notes

Electronics 2019, 8(3), 366; https://doi.org/10.3390/electronics8030366
Action Date Notes Link
article xml file uploaded 26 March 2019 11:12 CET Original file -
article xml uploaded. 26 March 2019 11:12 CET Update https://www.mdpi.com/2079-9292/8/3/366/xml
article pdf uploaded. 26 March 2019 11:12 CET Version of Record https://www.mdpi.com/2079-9292/8/3/366/pdf
article html file updated 26 March 2019 11:13 CET Original file -
article html file updated 11 April 2019 16:36 CEST Update -
article html file updated 25 April 2019 21:27 CEST Update -
article html file updated 17 October 2019 05:07 CEST Update -
article html file updated 12 February 2020 00:52 CET Update -
article html file updated 19 July 2022 16:51 CEST Update https://www.mdpi.com/2079-9292/8/3/366/html
Back to TopTop