A Parallel Connected Component Labeling Architecture for Heterogeneous Systems-on-Chip
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Perri, S.; Spagnolo, F.; Corsonello, P. A Parallel Connected Component Labeling Architecture for Heterogeneous Systems-on-Chip. Electronics 2020, 9, 292. https://doi.org/10.3390/electronics9020292
Perri S, Spagnolo F, Corsonello P. A Parallel Connected Component Labeling Architecture for Heterogeneous Systems-on-Chip. Electronics. 2020; 9(2):292. https://doi.org/10.3390/electronics9020292
Chicago/Turabian StylePerri, Stefania, Fanny Spagnolo, and Pasquale Corsonello. 2020. "A Parallel Connected Component Labeling Architecture for Heterogeneous Systems-on-Chip" Electronics 9, no. 2: 292. https://doi.org/10.3390/electronics9020292
APA StylePerri, S., Spagnolo, F., & Corsonello, P. (2020). A Parallel Connected Component Labeling Architecture for Heterogeneous Systems-on-Chip. Electronics, 9(2), 292. https://doi.org/10.3390/electronics9020292