Static Thermal Coupling Factors in Multi-Finger Bipolar Transistors: Part II-Experimental Validation
Abstract
:1. Introduction
2. Model Extension for Structures with BEOL and Parameter Extraction
3. TCAD Simulation and Model Testing
4. Model Validation with Measurements
4.1. Structure with Only Shallow Trench
4.2. Structure with Shallow and Deep Trench
5. Conclusions
Author Contributions
Funding
Conflicts of Interest
References
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Gupta, A.; Nidhin, K.; Balanethiram, S.; Yadav, S.; Chakravorty, A.; Fregonese, S.; Zimmer, T. Static Thermal Coupling Factors in Multi-Finger Bipolar Transistors: Part II-Experimental Validation. Electronics 2020, 9, 1365. https://doi.org/10.3390/electronics9091365
Gupta A, Nidhin K, Balanethiram S, Yadav S, Chakravorty A, Fregonese S, Zimmer T. Static Thermal Coupling Factors in Multi-Finger Bipolar Transistors: Part II-Experimental Validation. Electronics. 2020; 9(9):1365. https://doi.org/10.3390/electronics9091365
Chicago/Turabian StyleGupta, Aakashdeep, K Nidhin, Suresh Balanethiram, Shon Yadav, Anjan Chakravorty, Sebastien Fregonese, and Thomas Zimmer. 2020. "Static Thermal Coupling Factors in Multi-Finger Bipolar Transistors: Part II-Experimental Validation" Electronics 9, no. 9: 1365. https://doi.org/10.3390/electronics9091365