Kim, H.; Song, J.-i.; Seo, J.-w.; Ko, C.; Seo, G.-h.; Han, S.K.
Digitalized Thermal Inspection Method of the Low-Frequency Stimulation Pads for Preventing Low-Temperature Burn in Sensitive Skin. Bioengineering 2025, 12, 560.
https://doi.org/10.3390/bioengineering12060560
AMA Style
Kim H, Song J-i, Seo J-w, Ko C, Seo G-h, Han SK.
Digitalized Thermal Inspection Method of the Low-Frequency Stimulation Pads for Preventing Low-Temperature Burn in Sensitive Skin. Bioengineering. 2025; 12(6):560.
https://doi.org/10.3390/bioengineering12060560
Chicago/Turabian Style
Kim, HyungTae, Jong-ik Song, Ji-won Seo, CheolWoong Ko, Gi-ho Seo, and Sang Kuy Han.
2025. "Digitalized Thermal Inspection Method of the Low-Frequency Stimulation Pads for Preventing Low-Temperature Burn in Sensitive Skin" Bioengineering 12, no. 6: 560.
https://doi.org/10.3390/bioengineering12060560
APA Style
Kim, H., Song, J.-i., Seo, J.-w., Ko, C., Seo, G.-h., & Han, S. K.
(2025). Digitalized Thermal Inspection Method of the Low-Frequency Stimulation Pads for Preventing Low-Temperature Burn in Sensitive Skin. Bioengineering, 12(6), 560.
https://doi.org/10.3390/bioengineering12060560