Thermal Noise Limited, Scalable Multi-Piezoresistor Readout Architecture ^†

Abstract

In this work we present a low noise, hardware efficient, and scalable read-out architecture for piezoresistive mechanical transducers containing multiple sensing elements. To reach the thermal noise limit the sensing elements are driven by modulated, differential stimuli at separated frequencies, their current are summed and digitalized for signal processing and response extraction. The solution decreases the complexity of the analog read-out electronics and makes it easily scalable. Besides the improved signal-to-noise ratio the principle can achieve minimised power consumption and self-heating of piezoresistors with minimal analogue hardware resources. The distinguishing features of the arrangement are the multiple frequency modulation, the current based multiple sensor integration, one AD converter, no analog multiplexing, and the need for only a half Wheatstone bridge per sensing element.

1. Introduction

The resolution of the piezoresistive cantilever or membrane deformation based mechanical sensors are limited electrically by the Johnson or thermal noise, shot noise, generation-recombination noise and the Hooge noise ($~1/f)$. The frequency-independent thermal noise and the low-frequency $1/f$ noise are the dominant effects. The thermal noise amplitude becomes larger than the $1/f$ noise after a typically kHz range threshold frequency, thus using higher frequency modulated AC signal stimuli the $1/f$ noise can be supressed as common in lock-in amplification. Though the sensitivity (electrical response over deformation) can be increased by the increasing current flowing through the resistors and make use its voltage drop in parallel the 1/f noise and the threshold frequency also increases [1].

2. Materials and Methods

Our solution based on AC modulation scheme as well, with the extension of dedicating an individual frequency channel for each piezoresistive element (Figure 1).

In order to minimize the hardware resources (namely the area consuming AD converter), the current flowing through the resistor elements is summed using a current conveyor circuit and then digitalized by a single AD converter. The modulation uses square wave waveform to decrease the hardware complexity further (Figure 2).

The signal stream is processed to derive the individual responses of the sensing elements. In order to eliminate the manufacturing mismatches of the piezoresistive elements, the solution uses a half Wheatstone bridge. To limit the accumulated current value of the half bridges a differential signal drives the resistor pairs with forcing the half voltage level by a current conveyor. This way only the resistance change related current flows to the summing node. The demonstration system based on a four element force sensor (Figure 3) fabricated on SOI wafers by using typical processes as doping implantation, DRIE etching, anodic wafer bonding to borosilicate glass containing wiring [2].

The electronics contains solely a 16-bit ARM processor based microcontroller including 24-bit sigma-delta converter (Analog devices, ADuC7061) with supporting elements (Figure 4).

3. Results and Conclusions

Typical noise and time domain signal is demonstrated in Figure 5. At the applied frequencies (200, 210, 220 and 230 Hz) the demodulated voltage changes was in the range of 3–5 µV, the noise floor is near 8–9 $\mathrm{nV}/\sqrt{\mathrm{Hz}}$ (piezoresistor is 3.6 $\mathrm{k}\mathsf{\Omega }$), the modulation was ±0.6 V and one second sample time. The mechanically upper limited SNR is 100 dB.