The Mechanical Properties of a Transient Liquid Phase Diffusion Bonded SSM-ADC12 Aluminum Alloy with a ZnAl4Cu3 Zinc Alloy Interlayer
Abstract
:1. Introduction
2. Materials and Methods
2.1. Materials
2.2. TLPDB Process
2.3. Fatigue Testing
2.4. Metallurgy and Mechanical Testing
3. Results and Discussion
3.1. Characteristics of the TLPDB Samples
3.2. Bonding Strength Analysis
3.3. Fatigue Analysis
3.4. Microstructure of the TLPDB Material of the SSM-ADC12 Aluminum Alloy
3.5. Vickers Microhardness
4. Conclusions
- Different parameters directly affect the mechanical properties. An average maximum bonding strength of 32.21 MPa was obtained at a bonding temperature of 490 °C, a bonding time of 120 min, and a ZnAl4Cu3 zinc alloy interlayer material thickness of 2.0 mm.
- After the TLPDB material was evaluated, crack, void, and deformation defects could be detected in this experiment.
- The fatigue tests for the TLPDB material of the SSM-ADC12 aluminum alloy with ZnAl4Cu3 zinc alloy interlayer materials revealed amplitude fatigue similar to the base material (BMs), and the endurance limits of the TLPDB material and BMs were 20.29 and 31.12 MPa, respectively.
- The maximum Vickers microhardness value obtained with 120 min of bonding, a bonding temperature of 520 °C, and a ZnAl4Cu3 zinc alloy interlayer that was 2.0 mm thick was 83.20 HV. Meanwhile, η(Zn–Al–Cu), β(Al2Mg3Zn3), and MgZn2 intermetallic compounds (IMCs) led to increases in hardness.
- A MgZn2 phase formed in the microstructure and precipitation at and near the bonded line led to improved mechanical properties. A transformation of the α-primary matrix with β-eutectic Si IMCs to form an η(Zn–Al–Cu) phase was also observed at the bonded line. Evaluation using optical microscopy showed that the precipitation changed from globular to coarse structures with larger grains, whilst SEM evaluation showed that β-eutectic Si IMCs diffused into β(Al2Mg3Zn3) and MgZn2 IMCs with an average width of 19–29 µm and an average length of 12–27 µm. Finally, EDX mapping at the joint showed that Mg, Si, and Al were able to move freely.
Author Contributions
Funding
Data Availability Statement
Acknowledgments
Conflicts of Interest
References
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Materials | Bonding Temperature | Bonding Time | Bonding Pressure | Interlayer Materials | Recommended Parameters | Reference |
---|---|---|---|---|---|---|
Al2219 | 480, 500, and 520 °C | 30 min | 2 MPa | Cu | A maximum shear strength of 18.75 MPa was produced at 520 °C, with a maximum hardness value of 723 HV. | [12] |
Al6063 and UNS S32304 | 550, 555, 560, and 570 °C | 90 min | 0.2 KN | Copper foil | A defect-free joint was produced at 570 °C, and IMCs (Al2Cu) were found at the interface. | [13] |
Al-Mg-Si Alloy and 301L Stainless Steel | 485 °C | 10 and 30 min | Not specified | Sn-based material | TLPDB is particularly important for the joining of semiconductor chips with expensive die-attached materials during low-temperature sintering. | [14] |
AR500 Steel and AA7075 | 425 and 477 °C | 1, 2, and 5 min | Not specified | Al–Si–Zn | The highest shear load was 6460 N, which was produced at a brazing temperature of 477 °C, and the hardness of the aluminum base metal was decreased by 1 and 2 min flame times. | [15] |
1420 Al-Li Alloy | 440–560 °C | 60 min | 7 MPa | Not specified | The diffusion bonding temperature promotes the atomic diffusion of Mg in pure aluminum. The bonding temperature is an important factor affecting the quality of the bonding interface and the bonding strength. | [16] |
SSM-ADC12 | 400, 430, 460, 490, and 520 °C | 60, 90, and 120 min | 3.4 MPa | ZnAl4Cu3 zinc alloy | This research represents a new concept for GISS materials. The maximum bonding strength value was high at 32.21 MPa. This was generated at a bonding temperature of 490 °C, with a bonding time of 120 min and a ZnAl4Cu3 zinc alloy that was 2.0 mm thick, which had never been studied before. | Present work |
Element (wt.%) | |||||||||
---|---|---|---|---|---|---|---|---|---|
Materials | Si | Fe | Cu | Mn | Mg | Zn | Sn | Other | Al |
SSM-ADC12 | 11.99 | 0.93 | 1.75 | 0.12 | 0.07 | 0.78 | 0.03 | 0.03 | Rest |
ZnAl4Cu3 | 0.81 | 0.01 | 3.22 | 0.91 | 0.82 | 89.30 | - | - | 4.20 |
Materials | Vickers hardness (HV) | Yield strength (MPa) | Ultimate tensile strength (MPa) | Elongation (%) | |||||
SSM-ADC12 | 96.70 | 163 | 319 | 10–12 | |||||
ZnAl4Cu3 | 79.12 | 97 | 125 | 5–7 |
Material | Optimal TLPDB Parameters | Maximum Bonding Strength (MPa) | Reference |
---|---|---|---|
SSM7075 | Bonding time of 120 min Temperature of 540 °C | 17.44 | [29] |
Al7075 to Ti–6Al–4V | Bonding time of 30 min Temperature of 540 °C | 19.50 | [30] |
Ni3Al superalloy | Bonding time of 6 h Temperature of 1250 °C | 860.84 | [31] |
Ti45Ni49Cu6 | Bonding time of 60 min Temperature of 970 °C | 193.00 | [32] |
SSM-ADC12 | Bonding time of 120 min Temperature of 490 °C | 32.21 | Present work |
Stroke (mm) | SSM-ADC12 (BMs) | SSM-ADC12 (TLPDB) | ||
---|---|---|---|---|
Stress (MPa) | Number of Cycles | Stress (MPa) | Number of Cycles | |
0.35 | 22.21 | 1,000,000 * | 20.92 | 1,000,000 * |
0.40 | 31.12 | 1,000,000 * | 28.45 | 800,000 |
0.45 | 36.72 | 940,470 | 35.79 | 655,334 |
0.50 | 45.52 | 657,134 | 40.24 | 255,560 |
0.60 | 68.31 | 230,780 | 45.81 | 131,835 |
0.70 | 73.10 | 79,104 | 55.66 | 25,465 |
0.80 | 81.52 | 55,360 | 67.72 | 11,747 |
Material | Life Equation at 106 Cycles | Endurance Limit (MPa) |
---|---|---|
SSM-ADC12 (BMs) | σ = 257.32x−0.131 | 31.12 |
SSM-ADC12 (TLPDB) | σ = 188.08x−0.127 | 20.29 |
Element | Line Type | Apparent Concentration | k Ratio | wt% | wt% Sigma | Atomic % | Standard Label |
---|---|---|---|---|---|---|---|
C | K series | 0.44 | 0.00939 | 9.73 | 0.69 | 9.94 | C Vit |
Si | K series | 0.22 | 0.00467 | 4.55 | 0.41 | 5.68 | SiO2 |
Cu | K series | 0.12 | 0.00168 | 1.46 | 0.19 | 2.34 | CuO |
Al | K series | 17.13 | 0.08453 | 65.25 | 0.92 | 49.92 | Al2O3 |
Zn | K series | 5.11 | 0.03453 | 19.01 | 0.32 | 32.12 | ZnO3 |
Total: | 100 | 100 |
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Meengam, C.; Dunyakul, Y.; Maunkhaw, D. The Mechanical Properties of a Transient Liquid Phase Diffusion Bonded SSM-ADC12 Aluminum Alloy with a ZnAl4Cu3 Zinc Alloy Interlayer. J. Manuf. Mater. Process. 2024, 8, 184. https://doi.org/10.3390/jmmp8050184
Meengam C, Dunyakul Y, Maunkhaw D. The Mechanical Properties of a Transient Liquid Phase Diffusion Bonded SSM-ADC12 Aluminum Alloy with a ZnAl4Cu3 Zinc Alloy Interlayer. Journal of Manufacturing and Materials Processing. 2024; 8(5):184. https://doi.org/10.3390/jmmp8050184
Chicago/Turabian StyleMeengam, Chaiyoot, Yongyuth Dunyakul, and Dech Maunkhaw. 2024. "The Mechanical Properties of a Transient Liquid Phase Diffusion Bonded SSM-ADC12 Aluminum Alloy with a ZnAl4Cu3 Zinc Alloy Interlayer" Journal of Manufacturing and Materials Processing 8, no. 5: 184. https://doi.org/10.3390/jmmp8050184