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Electronic Materials, Volume 6, Issue 4

2025 December - 11 articles

Cover Story: This cover captures the shift from transistor scaling to system-level integration through advanced packaging. A 3D heterogeneous die stack and interconnect evolution illustrate microbump scaling below 5 µm interconnect pitch. The design reflects comprehensive modeling of thermal cycling, intermetallic growth, fatigue-creep and thermal performance analysis of solder-based thermo-compression bonding (TCB) and Cu–Cu TCB. The paper highlights the markedly superior reliability and lifetime of Cu–Cu thermo-compression bonding compared to conventional solder-based off-chip interconnections. View this paper
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Articles (11)

  • Article
  • Open Access
643 Views
20 Pages

Image Enhancement Algorithm and FPGA Implementation for High-Sensitivity Low-Light Detection Based on Carbon-Based HGFET

  • Yi Cao,
  • Yuyan Zhang,
  • Zhifeng Chen,
  • Dongyi Lin,
  • Chengying Chen,
  • Liming Chen and
  • Jianhua Jiang

To address the issues of insufficient responsivity and low imaging contrast of carbon-based HGFET high-sensitivity short-wave infrared (SWIR) detectors under low-light conditions, this paper proposes a high-sensitivity and high-contrast image enhance...

  • Article
  • Open Access
571 Views
15 Pages

Integration of Silicon PIN Detectors and TENGs for Self-Powered Wireless AI Intelligent Recognition

  • Junjie Tang,
  • Huafei Wang,
  • Maoqiu Pu,
  • Penghui Luo,
  • Min Yu and
  • Zhiyuan Zhu

In this study, we explore the integration of a cost-effective triboelectric nanogenerator (TENG) with an large silicon PIN detector (diameter: 12 mm) for intelligent wireless recognition applications. Wireless communication eliminates the need for ph...

  • Article
  • Open Access
445 Views
11 Pages

Comparative Study of Voltage Amplification in Cylindrical FE-FE-DE and FE-DE Heterostructures

  • Pratheeksha Suresh,
  • Bhaskar Awadhiya,
  • Vikash Mishra,
  • Pramod Martha,
  • Sampath Kumar and
  • Yashwanth Nanjappa

This work examines a cylindrical FE-DE heterostructure and compares its performance with that of a cylindrical FE-FE-DE heterostructure. It aims to maximize voltage amplification, increase capacitance, and attain a constant negative capacitance. Firs...

  • Article
  • Open Access
739 Views
24 Pages

Multiferroic composites of xNi0.8Zn0.2Fe2O4/(1 − x)BaTiO3 (x = 0, 0.1, 0.3, 0.5, labeled NZFO/BTO) with ~100 nm particle size were synthesized via high-energy ball milling and thermal annealing. The X-ray diffraction shows a co-existence of the...

  • Article
  • Open Access
774 Views
18 Pages

The rapid development of electronic devices has led to increasing requirements for higher-performance thermal interface materials (TIMs). Based on the finite element method, this study investigates the heat transfer enhancement mechanism of polymer-b...

  • Article
  • Open Access
1,861 Views
23 Pages

A new and transformative era in semiconductor packaging is underway, wherein, there is a shift from transistor scaling to system scaling and integration through advanced packaging. For advanced packaging, interconnect scaling is a key driver, with in...

  • Article
  • Open Access
848 Views
18 Pages

An Efficient Electrostatic Discharge Analytical Model for a Local Bottom-Gate Carbon Nanotube Field-Effect Transistor

  • Weiyi Zheng,
  • Yuyan Zhang,
  • Zhifeng Chen,
  • Qiaoying Gan,
  • Xuefang Xiao,
  • Ying Gao,
  • Jianhua Jiang and
  • Chengying Chen

In the post-Moore era, carbon nanotube field-effect transistors (CNTFETs) are a promising alternative to complementary metal-oxide-semiconductor (CMOS) technology at and below the 5 nm node. Compact models bridge circuit design and device physics, ye...

  • Review
  • Open Access
2 Citations
1,477 Views
31 Pages

Recent Advances in Triboelectric Materials for Active Health Applications

  • Chang Peng,
  • Yuetong Lin,
  • Zhenyu Jiang,
  • Yiping Liu,
  • Licheng Zhou,
  • Zejia Liu,
  • Liqun Tang and
  • Bao Yang

Triboelectric materials can convert irregular mechanical stimuli from human motion or environmental sources into high surface charge densities and instantaneous electrical outputs. Their intrinsic properties, such as flexibility, stretchability, chem...

  • Communication
  • Open Access
485 Views
6 Pages

In metal nanoparticles, localized surface plasmon resonance occurs due to the interaction between electrons on the surface and light. Among them, aluminum (Al) nanoparticles are known to have a resonant absorption wavelength in the ultraviolet light...

  • Article
  • Open Access
1,341 Views
15 Pages

Impact of SiN Passivation on Dynamic-RON Degradation of 100 V p-GaN Gate AlGaN/GaN HEMTs

  • Marcello Cioni,
  • Giacomo Cappellini,
  • Giovanni Giorgino,
  • Alessandro Chini,
  • Antonino Parisi,
  • Cristina Miccoli,
  • Maria Eloisa Castagna,
  • Aurore Constant and
  • Ferdinando Iucolano

In this paper, the impact of SiN passivation on dynamic-RON degradation of AlGaN/GaN HEMTs devices is put in evidence. To this end, samples showing different SiN passivation stoichiometry are considered, labeled as Sample A and Sample B. For dynamic-...

  • Article
  • Open Access
1 Citations
1,782 Views
12 Pages

Development of Water-Developable Negative Photoresist for i-Line Photolithography Using Cellulose Derivatives with Underlayer

  • Hiryu Hayashi,
  • Yuna Hachikubo,
  • Mano Ando,
  • Misaki Oshima,
  • Mayu Morita and
  • Satoshi Takei

Water-developable photoresist was synthesized by introducing methacrylate groups into hydroxypropyl cellulose (HPC), a cellulose derivative, via substitution of hydroxyl groups. The material enabled micropatterning through ultraviolet (UV) exposure a...

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Electron. Mater. - ISSN 2673-3978