Development and Characterization of Bulk and Epoxy Molding Compounds from Non-Metallic Fractions Recovered from Printed Circuit Boards †
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Silva, M.; Silva, R.; Nóvoa, P.; Soares, H.M.V.M.; Bastos, M.M.S.M.; Marques, A. Development and Characterization of Bulk and Epoxy Molding Compounds from Non-Metallic Fractions Recovered from Printed Circuit Boards. Mater. Proc. 2022, 8, 73. https://doi.org/10.3390/materproc2022008073
Silva M, Silva R, Nóvoa P, Soares HMVM, Bastos MMSM, Marques A. Development and Characterization of Bulk and Epoxy Molding Compounds from Non-Metallic Fractions Recovered from Printed Circuit Boards. Materials Proceedings. 2022; 8(1):73. https://doi.org/10.3390/materproc2022008073
Chicago/Turabian StyleSilva, Márcia, Raimundo Silva, Paulo Nóvoa, Helena M. V. M. Soares, Margarida M. S. M. Bastos, and António Marques. 2022. "Development and Characterization of Bulk and Epoxy Molding Compounds from Non-Metallic Fractions Recovered from Printed Circuit Boards" Materials Proceedings 8, no. 1: 73. https://doi.org/10.3390/materproc2022008073
APA StyleSilva, M., Silva, R., Nóvoa, P., Soares, H. M. V. M., Bastos, M. M. S. M., & Marques, A. (2022). Development and Characterization of Bulk and Epoxy Molding Compounds from Non-Metallic Fractions Recovered from Printed Circuit Boards. Materials Proceedings, 8(1), 73. https://doi.org/10.3390/materproc2022008073