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Review

A Review of Recent Advances in High-Dynamic-Range CMOS Image Sensors

by
Jingyang Chen
1,2,†,
Nanbo Chen
1,2,†,
Zhe Wang
2,3,
Runjiang Dou
2,3,
Jian Liu
2,3,
Nanjian Wu
2,3,
Liyuan Liu
2,3,
Peng Feng
2,3,* and
Gang Wang
1,*
1
School of Physical Science and Technology, Ningbo University, Ningbo 315211, China
2
Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
3
Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
*
Authors to whom correspondence should be addressed.
†
These authors contributed equally to this work.
Chips 2025, 4(1), 8; https://doi.org/10.3390/chips4010008
Submission received: 30 December 2024 / Revised: 13 February 2025 / Accepted: 18 February 2025 / Published: 3 March 2025
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Abstract

High-dynamic-range (HDR) technology enhances the capture of luminance beyond the limits of traditional images, facilitating the capture of more nuanced and lifelike visual effects. This advancement has profound implications across various sectors, such as medical imaging, augmented reality (AR), virtual reality (VR), and autonomous driving systems. The evolution of complementary metal-oxide semiconductor (CMOS) image sensor (CIS) manufacturing techniques, particularly through backside illumination (BSI) and advancements in three-dimensional (3D) stacking architectures, is driving progress in HDR’s capabilities. This paper provides a review of the technologies developed over the past six years that augment the dynamic range (DR) of CIS. It systematically introduces and summarizes the implementation methodologies and distinguishing features of each technology.
Keywords: CMOS image sensor (CIS); high dynamic range (HDR); full well capacity (FWC); conversion gain (CG); photodiode (PD); floating diffusion (FD) CMOS image sensor (CIS); high dynamic range (HDR); full well capacity (FWC); conversion gain (CG); photodiode (PD); floating diffusion (FD)

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MDPI and ACS Style

Chen, J.; Chen, N.; Wang, Z.; Dou, R.; Liu, J.; Wu, N.; Liu, L.; Feng, P.; Wang, G. A Review of Recent Advances in High-Dynamic-Range CMOS Image Sensors. Chips 2025, 4, 8. https://doi.org/10.3390/chips4010008

AMA Style

Chen J, Chen N, Wang Z, Dou R, Liu J, Wu N, Liu L, Feng P, Wang G. A Review of Recent Advances in High-Dynamic-Range CMOS Image Sensors. Chips. 2025; 4(1):8. https://doi.org/10.3390/chips4010008

Chicago/Turabian Style

Chen, Jingyang, Nanbo Chen, Zhe Wang, Runjiang Dou, Jian Liu, Nanjian Wu, Liyuan Liu, Peng Feng, and Gang Wang. 2025. "A Review of Recent Advances in High-Dynamic-Range CMOS Image Sensors" Chips 4, no. 1: 8. https://doi.org/10.3390/chips4010008

APA Style

Chen, J., Chen, N., Wang, Z., Dou, R., Liu, J., Wu, N., Liu, L., Feng, P., & Wang, G. (2025). A Review of Recent Advances in High-Dynamic-Range CMOS Image Sensors. Chips, 4(1), 8. https://doi.org/10.3390/chips4010008

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