Chemical Engineering in Revolutionizing 3D Printing with Nanomaterials

A special issue of ChemEngineering (ISSN 2305-7084).

Deadline for manuscript submissions: 10 April 2025 | Viewed by 124

Special Issue Editor


E-Mail Website
Guest Editor
Advanced Construction Materials Lab, Engineering Building 1, #A508 / #A519, Yonsei University, 50 Yonsei-ro, Seodaemun-gu, Seoul 03722, Republic of Korea
Interests: 3D-Concrete printing; nanomaterials; carbon-based nanomaterials; materials characterization; concrete materials; nanocomposites; waste recycling; geopolymer composites

Special Issue Information

Dear Colleagues,

3D-Printing is an emerging technology in various fields of science and technology due to its advantages such as cost efficiency, material savings, and faster productivity. The integration of nanomaterials in 3D printing significantly enhances the mechanical strength, chemical resistance, and other properties of composites. Chemical engineering plays a pivotal role in revolutionizing this field by optimizing the synthesis, dispersion, and functionalities of nanomaterials, thus improving material properties, and expanding their potential application in 3D-printed composites. This integration allows for the creation of sophisticated and intricate designs with higher precision and finer detail, opening new avenues for growth across industries from aerospace and automobile to biomedical and electronics.

We cordially invite you to contribute research articles to this special issue on topics including 3D printing with nanomaterials, synthesis of nanomaterials, chemistry, chemical treatments, performance evaluation, and test methods. Submissions exploring how nanomaterials, including their dispersion, interfacial chemistry, polymer matrix interactions, are transforming the landscape of 3D printing and chemical engineering are welcomed.

Dr. Shaik Inayath Basha
Guest Editor

Manuscript Submission Information

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Keywords

  • chemical engineering
  • 3D printing
  • nanomaterials

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Published Papers

This special issue is now open for submission.
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