The Progress in Application-Specific Integrated Circuit Design

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Circuit and Signal Processing".

Deadline for manuscript submissions: 15 February 2025 | Viewed by 103

Special Issue Editors


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Guest Editor
1. University of Chinese Academy of Sciences, Beijing 100049, China
2. Institute of Modern Physics, Chinese Academy of Sciences, Lanzhou 730000, China
Interests: ASICs and sensors

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Guest Editor
School of Astronautics, Harbin Institute of Technology, Harbin 150001, China
Interests: low-power and mixed-signal ASICs

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Guest Editor
Institute of Modern Physics, Chinese Academy of Sciences, Lanzhou 730000, China
Interests: pixel sensor and digital ASICs

Special Issue Information

Dear Colleagues,

Application-Specific Integrated Circuits (ASICs) are custom-designed integrated circuits tailored to meet the needs of specific applications. They represent the cutting-edge applications of semiconductor technology. Optimized for particular tasks, ASICs can offer higher performance, lower power consumption, and cost-effectiveness while reducing the overall complexity of systems. This specialized nature makes ASICs crucial in critical areas such as high-performance computing, mobile communications, digital media, automotive electronics, and medical devices. ASICs are an indispensable part of modern electronic systems. They drive technological progress and greatly enrich and facilitate people's daily lives.

This Special Issue aims to collect original research articles on Progress in Application-Specific Integrated Circuit Design. The topics of interest for this Special Issue include, but are not limited to, the following:

  • Frontiers of Process Technology;
  • Expansion into Application Fields;
  • Design Methods and Tools;
  • System Integration technology;
  • New Materials and Devices;
  • ASIC Design for Emerging Technologies;
  • Sensor and Actuator Interfaces;
  • Reliability and Fault Tolerance;
  • Sustainability and Green ASICs;
  • Market Analysis, Future Outlook and Challenges.

Prof. Dr. Chengxin Zhao
Dr. Yongsheng Wang
Dr. Xiaoyang Niu
Guest Editors

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Keywords

  • application-specific integrated circuits (ASICs)
  • AI acceleration
  • energy efficiency
  • manufacturability
  • reliability engineering
  • emerging technologies
  • new application fields
  • new materials and devices
  • design methods and tools
  • integration technology

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Published Papers

This special issue is now open for submission.
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