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Advance of Cooperative Working in Design, Visualization and Engineering

A project collection of Electronics (ISSN 2079-9292). This project collection belongs to the section "Industrial Electronics".

Papers displayed on this page all arise from the same project. Editorial decisions were made independently of project staff and handled by the Editor-in-Chief or qualified Editorial Board members.

Submission Status: Closed (5 December 2025) | Viewed by 2992

Editors


E-Mail Website
Guest Editor
Department of Computer Science, University of Balearic Islands, Spain
Interests: Computer Supported Cooperative Work; Computer Vision; Computer Graphics; multimedia
Special Issues, Collections and Topics in MDPI journals

Project Overview

Dear Colleagues,

Recently, Artificial Intelligence, the Industrial Internet of Things (IIoT), the metaverse, blockchains, cloud computing, and cyber security have become hot topics, shaping the computing landscape.

This new computing landscape offers a wider opportunities for accessing social media, e-business, e-learning, e-finance, crowdsourcing, and many other cooperative technology-supported services. Their scale and popularity have reached a level that we have never seen before. This Special Issue aims to collate original, state-of-the-art research and development contributions from all types of cooperative-working applications, with a focus on cooperative design, cooperative visualization, and cooperative engineering.

All original papers and papers presented at the International Conferences on Cooperative Design, Visualization and Engineering are welcome. Submissions must not be currently under review for publication elsewhere. Conference papers may be submitted only if they are substantially extended (by more than 50%), and they must be referenced. All submitted papers will be peer-reviewed under normal standards for Electronics, and accepted based on their quality, originality, and relevance to the theme of this Special Issue.

Prof. Dr. Yuhua Luo
Dr. Tony Huang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the collection website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • multi-user, multi-location, multi-modal cooperative design
  • cooperative visualization
  • integration and interoperability in engineering
  • concurrent engineering
  • cooperative applications that network, multiple units are involved
  • basic theories, methods and technologies that support cooperation

Published Papers (1 paper)

2025

20 pages, 4820 KB  
Article
Skeletal Data Matching and Merging from Multiple RGB-D Sensors for Room-Scale Distant Interaction with Multiple Surfaces
by Adrien Coppens and Valerie Maquil
Electronics 2025, 14(4), 790; https://doi.org/10.3390/electronics14040790 - 18 Feb 2025
Cited by 1 | Viewed by 1151
Abstract
Using a commodity RGB-D sensor is a popular and cost-effective way to enable interaction at room scale, as such a device supports body tracking functionality at a reasonable price point. Even though the capabilities of such devices might be enough for applications like [...] Read more.
Using a commodity RGB-D sensor is a popular and cost-effective way to enable interaction at room scale, as such a device supports body tracking functionality at a reasonable price point. Even though the capabilities of such devices might be enough for applications like entertainment systems where a person plays in front of a television, this type of sensor is unfortunately sensitive to occlusions from objects or other people, who might be in the way in more sophisticated room-scale set-ups. One may use multiple RGB-D sensors and aggregate the collected data to address the occlusion problem, increase the tracking range, and improve accuracy. However, doing so requires the gathering of calibration information with regard to the sensors themselves and also regarding their relative placement on interactable surfaces. Another challenging consequence of relying on multiple sensors is the need to perform skeleton matching and merging based on their respective body tracking data (e.g., so that skeletons from different sensors but belonging to the same person are recognised as such). The present contribution focuses on approaches to tackling these issues. Ultimately, it contributes a working human interaction tracking system, leveraging multiple RGB-D sensors to provide unobtrusive and occlusion-resilient understanding capabilities. This constitutes a suitable basis for room-scale experiences such as those based on wall-sized displays. Full article
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