AI-Assisted Machine-Environment Interaction

A special issue of Journal of Sensor and Actuator Networks (ISSN 2224-2708). This special issue belongs to the section "Big Data, Computing and Artificial Intelligence".

Deadline for manuscript submissions: 30 April 2025 | Viewed by 1009

Special Issue Editors


E-Mail Website
Guest Editor
ECE Paris Engineering School, 37 Quai de Grenelle, 75015 Paris, France
Interests: knowledge representation; machine learning; computational intelligence; artificial intelligence; formal methods; multimodal computing
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Département des Réseaux et des Télécommunications (RT), University Paris-Saclay, UVSQ - 12 Avenue de l’Europe, 78114 Vélizy, France
Interests: software architecture; dynamic architecture; knowledge representation and reasoning; interaction machine-environment; ambient intelligence; robotic interaction; data fusion and fission; embedded system
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Machine–environment interaction is a vast and complex domain located at the crossroads of several artificial intelligence disciplines, the representation of knowledge and reasoning, ambient intelligence, networks of sensors, etc.

An intelligent machine (robot, vehicle, drone, etc.) can evolve in a so-called “smart” environment (smart home, smart city, etc.). Such a connected environment has a network of sensors that an intelligent machine can use in addition to its own sensors to better understand the environment and interact with the objects that are present there. Humans are a part of this environment, and hence, human–machine integration is a special case of machine–environment interaction.

Artificial Intelligence (AI) refers to the theory and development of computer systems that are capable of performing tasks that normally require human intelligence. AI significantly enhances machine-environment interaction by improving perception, comprehension, decision-making, and action.

AI can enhance the ability of machines to perceive their surroundings through advanced sensors and data processing techniques. It can comprehend complex data and extract meaningful information, enabling better understanding and situational awareness. In addition, AI enhances decision-making by evaluating multiple factors and predicting outcomes, leading to more informed and optimal choices. And finally, AI enables machines to perform actions based on their perception and decisions, leading to a more efficient and effective execution of tasks.

Research and development in interactive systems entails many challenges and opportunities, not only in hardware and software but also on various sensors, which constitute important tools of these systems to perceive the environment.

This Special Issue on “AI-Assisted Machine-Environment Interaction”, Volume III is dedicated to exploring the cutting-edge developments and applications of artificial intelligence in various forms of machine-environment interaction. This special issue aims to provide a comprehensive platform for

Extended versions of selected papers from the 4th International Conference on Computational Intelligence and Communications (CICom 2024, https://cicom2024.vercel.app), to be held in Paris on 26-27 December 2024), will be considered for this Special Issue.

In addition, we invite researchers, practitioners, and industry experts to participate by submitting their latest findings, methodologies, and case studies. The scope of this Special Issue encompasses a wide range of topics related to AI-Assisted Machine-Environment Interaction, including but not limited to:

  1. Robotics and Autonomous Systems:
    • Advanced algorithms for autonomous navigation and obstacle avoidance.
    • Real-time environment sensing and mapping techniques.
    • Human-robot interaction and collaboration.
  2. Smart Cities and IoT:
    • AI-driven solutions for smart infrastructure and urban planning.
    • Environmental monitoring and data analytics.
    • IoT-enabled intelligent systems for energy management and sustainability.
  3. Industrial Automation:
    • AI applications in manufacturing and process optimization.
    • Predictive maintenance and fault detection.
    • Machine learning for quality control and inspection.
  4. Agriculture and Environmental Science:
    • Precision agriculture using AI and robotics.
    • AI-based environmental impact assessments.
    • Sustainable resource management through intelligent systems.
  5. Healthcare and Assistive Technologies:
    • AI-powered assistive devices for improved patient care.
    • Environmental adaptations for accessibility and safety.
    • Integration of AI in healthcare facilities for better interaction and management.
  6. Intelligent Transportation and Logistics:
    • AI in autonomous vehicles and intelligent transportation systems.
    • Optimization of logistics and supply chain through machine-environment interaction.
    • Safety and efficiency improvements in public transportation.
  7. Natural Language Processing and Computer Vision:
    • NLP and CV techniques for enhanced machine understanding of the environment.
    • AI-driven user interfaces and interaction models.
    • Real-time object and scene recognition.
  8. Ethical and Societal Implications:
    • Ethical considerations in AI-assisted machine-environment interaction.
    • Societal impact and public perception of intelligent machines.
    • Regulatory and policy frameworks.

Dr. Manolo Dulva Hina
Prof. Dr. Amar Ramdane-Cherif
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Journal of Sensor and Actuator Networks is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • artificial intelligence
  • machine learning
  • machine-environment interaction
  • human-computer interaction
  • intelligent machines
  • intelligent transportation
  • computational intelligence

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.

Further information on MDPI's Special Issue polices can be found here.

Published Papers (1 paper)

Order results
Result details
Select all
Export citation of selected articles as:

Research

14 pages, 2976 KiB  
Article
Multi-Domain Data Integration for Plasma Diagnostics in Semiconductor Manufacturing Using Tri-CycleGAN
by Minji Kang, Sung Kyu Jang, Jihun Kim, Seongho Kim, Changmin Kim, Hyo-Chang Lee, Wooseok Kang, Min Sup Choi, Hyeongkeun Kim and Hyeong-U Kim
J. Sens. Actuator Netw. 2024, 13(6), 75; https://doi.org/10.3390/jsan13060075 - 4 Nov 2024
Viewed by 617
Abstract
The precise monitoring of chemical reactions in plasma-based processes is crucial for advanced semiconductor manufacturing. This study integrates three diagnostic techniques—Optical Emission Spectroscopy (OES), Quadrupole Mass Spectrometry (QMS), and Time-of-Flight Mass Spectrometry (ToF-MS)—into a reactive ion etcher (RIE) system to analyze CF4 [...] Read more.
The precise monitoring of chemical reactions in plasma-based processes is crucial for advanced semiconductor manufacturing. This study integrates three diagnostic techniques—Optical Emission Spectroscopy (OES), Quadrupole Mass Spectrometry (QMS), and Time-of-Flight Mass Spectrometry (ToF-MS)—into a reactive ion etcher (RIE) system to analyze CF4-based plasma. To synchronize and integrate data from these different domains, we developed a Tri-CycleGAN model that utilizes three interconnected CycleGANs for bi-directional data transformation between OES, QMS, and ToF-MS. This configuration enables accurate mapping of data across domains, effectively compensating for the blind spots of individual diagnostic techniques. The model incorporates self-attention mechanisms to address temporal misalignments and a direct loss function to preserve fine-grained features, further enhancing data accuracy. Experimental results show that the Tri-CycleGAN model achieves high consistency in reconstructing plasma measurement data under various conditions. The model’s ability to fuse multi-domain diagnostic data offers a robust solution for plasma monitoring, potentially improving precision, yield, and process control in semiconductor manufacturing. This work lays a foundation for future applications of machine learning-based diagnostic integration in complex plasma environments. Full article
(This article belongs to the Special Issue AI-Assisted Machine-Environment Interaction)
Show Figures

Figure 1

Back to TopTop