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Mechanical and Thermal Characterization of Novel Thermal Barrier Materials

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Thin Films and Interfaces".

Deadline for manuscript submissions: 20 February 2025 | Viewed by 27

Special Issue Editor


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Guest Editor
School of Materials Science and Engineering, Kumoh National Institute of Technology (KIT), 61 Daehak-ro (yangho-dong), Gumi, Gyeongbuk 39177, Republic of Korea
Interests: materials

Special Issue Information

Dear Colleagues,

The scope of this Special Issue, titled “Mechanical and Thermal Characterization of Novel Thermal Barrier Materials”, includes research on the latest developments in thermal barrier coatings and their applications, in both academia and industry, and it offers a comprehensive understanding of the mechanisms behind the effective protection during operation.

This Special Issue focuses on TBC materials studies for optimizing their properties, the development of their fabrication process, their characterizations, and their evaluation techniques.

We highly encourage the submission of original research, engineering articles, communications, and critical reviews in the area of thermal barrier coatings and their applications from both academia and industry, covering topics including, but not limited to, the following:

  • Novel thermal barrier materials;
  • Novel fabrication technologies of TBC;
  • Chracterization of thermal and/or mechanical properties;
  • Novel evaluation techniques for protection.

Dr. Dowon Song
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • thermal barrier coatings
  • TBC materials
  • TBC evaluation
  • structure optimization
  • fabrication process
  • thermal durability

Published Papers

This special issue is now open for submission.
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