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Advanced Characterization of Fiber-Reinforced Composite Materials

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Construction and Building Materials".

Deadline for manuscript submissions: 20 June 2025 | Viewed by 27

Special Issue Editors


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Guest Editor
Department of Materials, Environmental Sciences and Urban Planning, Marche Polytechnic University, 60131 Ancona, Italy
Interests: characterization of composite materials; advanced cement-based materials; retrofitting and strengthening buildings with composite materials; sustainable composite materials
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Department of Science and Engineering of Matter, Environment and Urban Planning (SIMAU), Polytechnic University of Marche, 60131 Ancona, Italy
Interests: polymeric composites and nanocomposites mechanical behaviour of materials thermal properties active packaging biodegradation of polymers natural fibers ligninocellulosic nanostructures
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

This Special Issue aims to showcase cutting-edge research and innovative methodologies in the characterization of fiber-reinforced composites, which are crucial in advancing their applications in various industrial sectors. We welcome original contributions that explore the interfacial properties and the mechanical, thermal, and chemical–physical behaviors of these materials, utilizing both experimental and computational approaches.

Topics of interest include, but are not limited to, mechanical property analysis, damage mechanics, non-destructive testing (NDT) techniques, thermal analysis, and the characterization of nanocomposites. We are particularly interested in papers that present novel micromechanics models, advanced imaging techniques, and multiscale modeling approaches that provide deeper insights into the behavior and performance of fiber-reinforced composites.

This Special Issue aims to serve as a comprehensive resource for the latest advancements in the field, offering a platform for the dissemination of significant findings that can drive future research and development. We welcome submissions from academia, industry, and research institutions.

Dr. Jacopo Donnini
Dr. Francesca Luzi
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • composite materials
  • advanced characterization methods
  • biobased composites
  • non-destructive testing (NDT)
  • fiber-reinforced composites
  • nanocomposites
  • multiscale modeling
  • sustainable composites

Published Papers

This special issue is now open for submission.
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