Thermally Conductive Composites: Recent Developments and Practical Aspects
A special issue of Materials (ISSN 1996-1944).
Deadline for manuscript submissions: closed (20 April 2024) | Viewed by 233
Special Issue Editors
Interests: thermally conductive composites; thermal management materials; metal matrix composites; thermal conductivity; diamond; graphene; interface engineering
Interests: polymer nanocomposites; thermal conduction; elastomer nanocomposites
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Due to the rapid progression of integration techniques, efficient heat dissipation has become a main issue with increasing the reliability and service life of high-power electronic devices, and thus, superior thermal management materials are in high demand. In recent years, advanced filler designs and interface engineering have substantially improved the thermal properties of thermally conductive composites, which are core thermal management materials.
This Special Issue will summarize the recent developments and practical aspects of thermally conductive composites, including, but not limited to, metal matrix composites, ceramic matrix composites, and polymer matrix composites. Articles addressing thermally conductive fillers, interface microstructure designs, interfacial thermal conductance, theoretical calculations, and so on, are all welcome.
Prof. Dr. Hailong Zhang
Dr. Xiaoliang Zeng
Guest Editors
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Keywords
- thermally conductive composites
- thermal management materials
- metal matrix composites
- polymer matrix composites
- ceramic matrix composites
- thermal conductivity
- interfacial thermal conductane
- interfacial thermal resistance
- interface
- filler
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