Selected Papers from the 26th EuroSimE Conference
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".
Deadline for manuscript submissions: 31 December 2025 | Viewed by 28
Special Issue Editors
Interests: LED packaging and system integration; prognostics and health management; wide bandgap power electronics packaging and reliability modeling
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Interests: solid-state lighting; microelectronics and microsystems technologies; virtual prototyping; virtual reliability qualification; designing for reliability of microelectronics and microsystems
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Special Issue Information
Dear Colleagues,
On behalf of the Editorial Board, we are pleased to propose a selection of papers presented at the 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EurosimE 2025) held in Utrecht, The Netherlands, from 6–9 April 2025 (https://www.eurosime.org/). EuroSimE is the only annual international conference with a focus on thermal, mechanical and multiphysical simulations and experiments for microelectronics and microsystems. The first conference was held in 2000 by the COMPETE network, sponsored by the European Commission, to meet the research and development needs of the microelectronics and microsystems fields. Since then, EuroSimE has garnered worldwide attention, with participants from more than 30 countries, spanning all continents, and is a fully sponsored IEEE CPMT technical event. The EuroSimE conference has earned a reputation for having a high scientific and technical quality. We hope that this Special Issue will be helpful. We also welcome your feedback and suggestions for improvement, with the aim of providing you with valuable references in the future. We would also like to sincerely thank the journal Micromachines for its editorial support and constant assistance throughout the preparation of this Special Issue.
Prof. Dr. Willem Van Driel
Dr. Jiajie Fan
Guest Editors
Manuscript Submission Information
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Keywords
- MEMS/NEMS
- microelectronics microsystems reliability
- simulation and modeling
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