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Editorial Board Members' Collection Series: Electronic Sensors, Devices and Systems
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Editorial Board Members' Collection Series: Electronic Sensors, Devices and Systems

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Electronic Sensors".

Deadline for manuscript submissions: 20 October 2024 | Viewed by 5256

Special Issue Editors

Prof. Dr. Alessandro Formisano

E-Mail Website
Guest Editor
Department of Engineering, University Della Campania “Luigi Vanvitelli”, 81031 Aversa, Italy
Interests: numerical computation of electromagnetic fields; inverse problems in low-frequency electromagnetism; thermonuclear fusion; superconducting magnets
Prof. Dr. Eduardo García Breijo

E-Mail Website
Guest Editor
Instituto Interuniversitario de Investigación de Reconocimiento Molecular y Desarrollo Tecnológico (IDM), Universitat Politècnica de València, Universitat de València, 46022 Valencia, Spain
Interests: printed sensors; printed electronics; thick-film sensors; textile sensors; screen-printed technology
Special Issues, Collections and Topics in MDPI journals
Dr. Federico Alimenti

E-Mail Website
Guest Editor
Dipartimento d'Ingegneria, University of Perugia, Via G. Duranti 93, 06125 Perugia, Italy
Interests: radar and radiometric sensors; high data-rate transceivers; microwave electronic circuits; power amplifiers for wireless communications; RFID systems
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Since its launch in 2001, Sensors has provided an advanced forum for the science and technology of sensors and their applications. During this time, the journal broadened its scope to devices and systems representing the object of measurements. The editor’s choice of providing open access to the articles in the journal, the continuous effort of the editorial team, and the rigor of reviewers providing their valuable work have helped the journal to achieve outstanding relevance in the scientific community. To celebrate the latest achievements of the journal, the Section “Electronic Sensors” is now compiling a collection of feature papers invited by the Section Editorial Board Members (EBMs) and submitted by outstanding scholars in this research field.

This Special Issue aims to provide the state of the art in this field to the broadest possible audience and promote the diffusion of recent results and networking among researchers in the areas of sensors, sensing technologies, and data processing.

We invite you to submit the most advanced results in:

  • Sensor devices, technology, and application;
  • Sensing principles and advanced materials for sensing;
  • Wearable sensors, devices, and electronics;
  • Sensor interface, signal processing, data fusion, and deep learning in sensor systems;
  • Remote sensors, sensor networks and arrays;
  • Smart/Intelligent sensors, Internet of Things, and human–computer interaction.

Prof. Dr. Alessandro Formisano
Prof. Dr. Eduardo García Breijo
Dr. Federico Alimenti
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.

Further information on MDPI's Special Issue polices can be found here.

Published Papers (5 papers)

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Research

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14 pages, 5334 KiB  
Article
Development and Field Test of Integrated Electronics Piezoelectric Accelerometer Based on Lead-Free Piezoelectric Ceramic for Centrifugal Pump Monitoring
by Byung-Hoon Kim, Dae-Sic Jang, Jeong-Han Lee, Min-Ku Lee and Gyoung-Ja Lee
Sensors 2024, 24(19), 6436; https://doi.org/10.3390/s24196436 - 4 Oct 2024
Viewed by 481
Abstract
In this study, an Integrated Electronics Piezoelectric (IEPE)-type accelerometer based on an environmentally friendly lead-free piezoceramic was fabricated, and its field applicability was verified using a cooling pump owned by the Korea Atomic Energy Research Institute (KAERI). As an environmentally friendly piezoelectric material, [...] Read more.
In this study, an Integrated Electronics Piezoelectric (IEPE)-type accelerometer based on an environmentally friendly lead-free piezoceramic was fabricated, and its field applicability was verified using a cooling pump owned by the Korea Atomic Energy Research Institute (KAERI). As an environmentally friendly piezoelectric material, 0.96(K,Na)NbO3-0.03(Bi,Na,K,Li)ZrO3-0.01BiScO3 (0.96KNN-0.03BNKLZ-0.01BS) piezoceramic with an optimized piezoelectric charge constant (d33) was introduced. It was manufactured in a ring shape using a solid-state reaction method for application to a compression mode accelerometer. The fabricated ceramic ring has a high piezoelectric constant d33 of ~373 pC/N and a Curie temperature TC of ~330 °C. It was found that the electrical and physical characteristics of the 0.96KNN-0.03BNKLZ-0.01BS piezoceramic were comparable to those of a Pb(Zr,Ti)O3 (PZT) ring ceramic. As a result of a vibration test of the IEPE accelerometer fabricated using the lead-free piezoelectric ceramic, the resonant frequency fr = 20.0 kHz and voltage sensitivity Sv = 101.1 mV/g were confirmed. The fabricated IEPE accelerometer sensor showed an excellent performance equivalent to or superior to that of a commercial IEPE accelerometer sensor based on PZT for general industrial use. A field test was carried out to verify the applicability of the fabricated sensor in an actual industrial environment. The test was conducted by simultaneously installing the developed sensor and a commercial PZT-based sensor in the ball bearing housing location of a centrifugal pump. The centrifugal pump was operated at 1180 RPM, and the generated vibration signals were collected and analyzed. The test results confirmed that the developed eco-friendly lead-free sensor has comparable vibration measurement capability to that of commercial PZT-based sensors. Full article
(This article belongs to the Special Issue Editorial Board Members' Collection Series: Electronic Sensors, Devices and Systems)
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19 pages, 2956 KiB  
Article
Eddy Current Sensor Probe Design for Subsurface Defect Detection in Additive Manufacturing
by Heba E. Farag, Mir Behrad Khamesee and Ehsan Toyserkani
Sensors 2024, 24(16), 5355; https://doi.org/10.3390/s24165355 - 19 Aug 2024
Viewed by 675
Abstract
Pore and crack formation in parts produced by additive manufacturing (AM) processes, such as laser powder bed fusion, is one of the issues associated with AM technology. Surface and subsurface cracks and pores are induced during the printing process, undermining the printed part [...] Read more.
Pore and crack formation in parts produced by additive manufacturing (AM) processes, such as laser powder bed fusion, is one of the issues associated with AM technology. Surface and subsurface cracks and pores are induced during the printing process, undermining the printed part durability. In-situ detection of defects will enable the real-time or intermittent control of the process, resulting in higher product quality. In this paper, a new eddy current-based probe design is proposed to detect these defects in parts with various defects that mimic pores and cracks in additively manufactured parts. Electromagnetic finite element analyses were carried out to optimize the probe geometry, followed by fabricating a prototype. Artificial defects were seeded in stainless steel plates to assess the feasibility of detecting various flaws with different widths and lengths. The smallest defect detected had a 0.17 mm radius for blind holes and a 0.43 mm notch with a 5 mm length. All the defects were 0.5 mm from the surface, and the probe was placed on the back surface of the defects. The surface roughness of the tested samples was less than 2 µm. The results show promise for detecting defects, indicating a potential application in AM. Full article
(This article belongs to the Special Issue Editorial Board Members' Collection Series: Electronic Sensors, Devices and Systems)
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17 pages, 13601 KiB  
Article
A Multi-Aperture Technique for Longitudinal Miniaturization of UWB 3 dB Dual-Layer SIW Coupler
by Ahmad Bilal, Abdul Hadee, Yash H. Shah, Sohom Bhattacharjee and Choon Sik Cho
Sensors 2024, 24(11), 3376; https://doi.org/10.3390/s24113376 - 24 May 2024
Viewed by 579
Abstract
Microwave couplers are used in large numbers in beamforming networks, and their miniaturization can lead to a significant size reduction in the overall phased array. While the miniaturization of 3 dB couplers in the transverse direction (width) has been given considerable attention in [...] Read more.
Microwave couplers are used in large numbers in beamforming networks, and their miniaturization can lead to a significant size reduction in the overall phased array. While the miniaturization of 3 dB couplers in the transverse direction (width) has been given considerable attention in the literature, there is minimal to no information on reducing coupler length. This is because of the trade-off between aperture length, bandwidth and coupling strength. The Bethe–Hole theory requires adding multiple apertures in the longitudinal direction for wide bandwidth, thus increasing the device length. Another factor is the aperture size, which determines the coupling strength and puts additional strain on the compactness of a 3 dB coupler. Contrariwise, this paper proposes to merge two weak (and hence compact) coupling mechanisms to design a wideband 3 dB coupler. This is achieved by using a longitudinal rectangular slot and three cross-slots in the transverse direction. Because of weak coupling, the slot sizes are smaller than a conventional 3 dB coupler, hence yielding a device whose length is less than one guided wavelength (λg) without compromising the bandwidth. The presented coupler is 0.63 λg in length, which is smaller than the state-of-the-art while maintaining a fractional bandwidth of 37% that is comparable to half-mode substrate integrated waveguide (HMSIW) couplers. Full article
(This article belongs to the Special Issue Editorial Board Members' Collection Series: Electronic Sensors, Devices and Systems)
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17 pages, 4248 KiB  
Article
Learning-Based Approaches to Current Identification from Magnetic Sensors
by Sami Barmada, Paolo Di Barba, Alessandro Formisano, Maria Evelina Mognaschi and Mauro Tucci
Sensors 2023, 23(8), 3832; https://doi.org/10.3390/s23083832 - 8 Apr 2023
Cited by 3 | Viewed by 1340
Abstract
Direct measurement of electric currents can be prevented by poor accessibility or prohibitive technical conditions. In such cases, magnetic sensors can be used to measure the field in regions adjacent to the sources, and the measured data then can be used to estimate [...] Read more.
Direct measurement of electric currents can be prevented by poor accessibility or prohibitive technical conditions. In such cases, magnetic sensors can be used to measure the field in regions adjacent to the sources, and the measured data then can be used to estimate source currents. Unfortunately, this is classified as an Electromagnetic Inverse Problem (EIP), and data from sensors must be cautiously treated to obtain meaningful current measurements. The usual approach requires using suited regularization schemes. On the other hand, behavioral approaches are recently spreading for this class of problems. The reconstructed model is not obliged to follow the physics equations, and this implies approximations which must be accurately controlled, especially if aiming to reconstruct an inverse model from examples. In this paper, a systematic study of the role of different learning parameters (or rules) on the (re-)construction of an EIP model is proposed, in comparison with more assessed regularization techniques. Attention is particularly devoted to linear EIPs, and in this class, a benchmark problem is used to illustrate in practice the results. It is shown that, by applying classical regularization methods and analogous correcting actions in behavioral models, similar results can be obtained. Both classical methodologies and neural approaches are described and compared in the paper. Full article
(This article belongs to the Special Issue Editorial Board Members' Collection Series: Electronic Sensors, Devices and Systems)
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Review

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19 pages, 9520 KiB  
Review
Flexible Sensors Based on Conductive Polymer Composites
by Dan Zhao, Weiwei Jia, Xiaona Feng, Huali Yang, Yali Xie, Jie Shang, Pengjun Wang, Yufeng Guo and Run-Wei Li
Sensors 2024, 24(14), 4664; https://doi.org/10.3390/s24144664 - 18 Jul 2024
Viewed by 1039
Abstract
Elastic polymer-based conductive composites (EPCCs) are of great potential in the field of flexible sensors due to the advantages of designable functionality and thermal and chemical stability. As one of the popular choices for sensor electrodes and sensitive materials, considerable progress in EPCCs [...] Read more.
Elastic polymer-based conductive composites (EPCCs) are of great potential in the field of flexible sensors due to the advantages of designable functionality and thermal and chemical stability. As one of the popular choices for sensor electrodes and sensitive materials, considerable progress in EPCCs used in sensors has been made in recent years. In this review, we introduce the types and the conductive mechanisms of EPCCs. Furthermore, the recent advances in the application of EPCCs to sensors are also summarized. This review will provide guidance for the design and optimization of EPCCs and offer more possibilities for the development and application of flexible sensors. Full article
(This article belongs to the Special Issue Editorial Board Members' Collection Series: Electronic Sensors, Devices and Systems)
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