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Wearable and Large Area Electronic Devices and Textiles: Design, Fabrication, and Application

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Wearables".

Deadline for manuscript submissions: closed (30 November 2022) | Viewed by 3976

Special Issue Editor

Dr. Seiichi Takamatsu

E-Mail Website
Guest Editor
Department of Precision Engineering, School of Engineering, The University of Tokyo, Bunkyo, Tokyo 113, Japan
Interests: MEMS; wearable devices; weaving

Special Issue Information

Dear Colleagues,

Wearable and extremely large-area electronic devices and textiles have gained much attention for smart wear, smart houses, and smart society. Wearable, large-area sensor devices have the advantages of monitoring people, livestock animals, and pets. Because of their large area, data can be taken from various parts of the body and are thus expected to have applications in health, sports, telemedicine, and other areas. The challenges are mechanical properties such as flexibility and stretchability to make devices wearable. In addition, unlike conventional semiconductors, large area devices with an area of several tens of centimeters must be made, so manufacturing technology to make devices using new sensor wiring technology and fiber technology is challenging. In this Special Issue, the design, manufacturing, and application of wearable, large-area devices and e-textiles are widely encouraged.

Dr. Seiichi Takamatsu
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • wearable
  • e-textile
  • large-area
  • fiber
  • weaving
  • printing
  • coating

Published Papers (2 papers)

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Research

9 pages, 6910 KiB  
Communication
Four-Level Micro-Via Technology (4LµV) for ASIC Integration in Active Flexible Sensor Arrays
by Maolei Zhou, Chresten von der Heide and Andreas Dietzel
Sensors 2022, 22(13), 4723; https://doi.org/10.3390/s22134723 - 22 Jun 2022
Cited by 3 | Viewed by 1390
Abstract
Systems-in-foil with multi-sensor arrays require extensive wiring with large numbers of data lines. This prevents scalability of the arrays and thus limits the applications. To enable multiplexing and thus reducing the external connections down to few digital data links and a power supply, [...] Read more.
Systems-in-foil with multi-sensor arrays require extensive wiring with large numbers of data lines. This prevents scalability of the arrays and thus limits the applications. To enable multiplexing and thus reducing the external connections down to few digital data links and a power supply, active circuits in the form of ASICs must be integrated into the foils. However, this requires reliable multilayer wiring of the sensors and contacts for chip integration. As an elegant solution to this, a new manufacturing process for multilayer wiring in polyimide-based sensor foils has been developed that also allows ASIC chips to be soldered. The electrical four-level micro-via connections and the contact pads are generated by galvanic copper deposition after all other process steps, including stacking and curing of polyimide layers, are completed. Compared to layer by layer via technology, the processing time is considerably reduced. Because copper plating of vias and solderable copper contact pads happens as the final step, the risk of copper oxidation during polyimide curing is completely eliminated. The entire fabrication process is demonstrated for six strain sensor nodes connected to a surface-mounted ASIC as a detecting unit for sensing spatially resolved bending states. Each sensor node is a full-bridge configuration consisting of four strain gauges distributed across interconnected layers. The sensor foil allows bending of +/−120° without damage. This technology can be used in future for all kinds of complex flexible systems-in-foil, in particular for large arrays of sensors. Full article
(This article belongs to the Special Issue Wearable and Large Area Electronic Devices and Textiles: Design, Fabrication, and Application)
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11 pages, 2979 KiB  
Communication
Urethane-Foam-Embedded Silicon Pressure Sensors including Stress-Concentration Packaging Structure for Driver Posture Monitoring
by Seiichi Takamatsu, Suguru Sato and Toshihiro Itoh
Sensors 2022, 22(12), 4495; https://doi.org/10.3390/s22124495 - 14 Jun 2022
Cited by 2 | Viewed by 2090
Abstract
We propose urethane-foam-embedded silicon pressure sensors, including a stress-concentration packaging structure, for integration into a car seat to monitor the driver’s cognitive state, posture, and driving behavior. The technical challenges of embedding silicon pressure sensors in urethane foam are low sensitivity due to [...] Read more.
We propose urethane-foam-embedded silicon pressure sensors, including a stress-concentration packaging structure, for integration into a car seat to monitor the driver’s cognitive state, posture, and driving behavior. The technical challenges of embedding silicon pressure sensors in urethane foam are low sensitivity due to stress dispersion of the urethane foam and non-linear sensor response caused by the non-uniform deformation of the foam. Thus, the proposed package structure includes a cover to concentrate the force applied over the urethane foam and frame to eliminate this non-linear stress because the outer edge of the cover receives large non-linear stress concentration caused by the geometric non-linearity of the uneven height of the sensor package and ground substrate. With this package structure, the pressure sensitivity of the sensors ranges from 0 to 10 kPa. The sensors also have high linearity with a root mean squared error of 0.049 N in the linear regression of the relationship between applied pressure and sensor output, and the optimal frame width is more than 2 mm. Finally, a prototype 3 × 3 sensor array included in the proposed package structure detects body movements, which will enable the development of sensor-integrated car seats. Full article
(This article belongs to the Special Issue Wearable and Large Area Electronic Devices and Textiles: Design, Fabrication, and Application)
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