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Article

Preparation and Properties of Inherently Black Polyimide Films with Extremely Low Coefficients of Thermal Expansion and Potential Applications for Black Flexible Copper Clad Laminates

1
Beijing Key Laboratory of Materials Utilization of Nonmetallic Minerals and Solid Wastes, National Laboratory of Mineral Materials, School of Materials Science and Technology, China University of Geosciences, Beijing 100083, China
2
School of Electrical Engineering, Beijing Jiaotong University, Beijing 100044, China
*
Authors to whom correspondence should be addressed.
Polymers 2020, 12(3), 576; https://doi.org/10.3390/polym12030576
Submission received: 30 December 2019 / Revised: 13 February 2020 / Accepted: 18 February 2020 / Published: 5 March 2020
(This article belongs to the Special Issue Polymers for Electronic Applications)

Abstract

In the current work, a series of black polyimide (PI) films with excellent thermal and dimensional stability at elevated temperatures were successfully developed. For this purpose, two aromatic diamines including 4,4′-iminodianline (NDA) and 2-(4-aminophenyl)-5- aminobenzimidazole (APBI) were copolymerized with pyromellitic dianhydride (PMDA) to afford PIs containing imino groups (–NH–) in the molecular structures. The referenced PI film, PI-ref, was simultaneously prepared from PMDA and 4,4′-oxydianiline (ODA). The introduction of imino groups endowed the PI films with excellent blackness and opaqueness with the optical transmittance lower than 2% at the wavelength of 600 nm at a thickness of 25 μm and lightness (L*) below 10 for the CIE (Commission International Eclairage) Lab optical parameters. Meanwhile, the introduction of rigid benzimidazole units apparently improved the thermal and dimensional stability of the PI films. The PI-d film based on PMDA and mixed diamines (NDA:APBI = 70:30, molar ratio) showed a glass transition temperature (Tg) of 445.5 °C and a coefficient of thermal expansion (CTE) of 8.9 × 10−6/K in the temperature range of 50 to 250 °C, respectively. It is obviously superior to those of the PI-a (PMDA-NDA, Tg = 431.6 °C; CTE = 18.8 × 10−6/K) and PI-ref (PMDA-ODA, Tg = 418.8 °C; CTE: 29.5 × 10−6/K) films.
Keywords: black polyimide film; coefficient of thermal expansion (CTE); optical properties; thermal properties; flexible copper clad laminates (FCCL) black polyimide film; coefficient of thermal expansion (CTE); optical properties; thermal properties; flexible copper clad laminates (FCCL)

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MDPI and ACS Style

Tan, Y.-y.; Zhang, Y.; Jiang, G.-l.; Zhi, X.-x.; Xiao, X.; Wu, L.; Jia, Y.-J.; Liu, J.-g.; Zhang, X.-m. Preparation and Properties of Inherently Black Polyimide Films with Extremely Low Coefficients of Thermal Expansion and Potential Applications for Black Flexible Copper Clad Laminates. Polymers 2020, 12, 576. https://doi.org/10.3390/polym12030576

AMA Style

Tan Y-y, Zhang Y, Jiang G-l, Zhi X-x, Xiao X, Wu L, Jia Y-J, Liu J-g, Zhang X-m. Preparation and Properties of Inherently Black Polyimide Films with Extremely Low Coefficients of Thermal Expansion and Potential Applications for Black Flexible Copper Clad Laminates. Polymers. 2020; 12(3):576. https://doi.org/10.3390/polym12030576

Chicago/Turabian Style

Tan, Yao-yao, Yan Zhang, Gang-lan Jiang, Xin-xin Zhi, Xiao Xiao, Lin Wu, Yan-Jiang Jia, Jin-gang Liu, and Xiu-min Zhang. 2020. "Preparation and Properties of Inherently Black Polyimide Films with Extremely Low Coefficients of Thermal Expansion and Potential Applications for Black Flexible Copper Clad Laminates" Polymers 12, no. 3: 576. https://doi.org/10.3390/polym12030576

APA Style

Tan, Y.-y., Zhang, Y., Jiang, G.-l., Zhi, X.-x., Xiao, X., Wu, L., Jia, Y.-J., Liu, J.-g., & Zhang, X.-m. (2020). Preparation and Properties of Inherently Black Polyimide Films with Extremely Low Coefficients of Thermal Expansion and Potential Applications for Black Flexible Copper Clad Laminates. Polymers, 12(3), 576. https://doi.org/10.3390/polym12030576

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