Search Results (10)

Herein, sol–gel-processed Y₂O₃ resistive random-access memory (RRAM) devices were fabricated. The top electrodes (TEs), such as Ag or Cu, affect the electrical characteristics of the Y₂O₃ RRAM devices. The oxidation process, mobile ion migration speed, and reduction process all impact the conductive filament formation of the indium–tin–oxide (ITO)/Y₂O₃/Ag and ITO/Y₂O₃/Cu RRAM devices. Between Ag and Cu, Cu can easily be oxidized due to its standard redox potential values. However, the conductive filament is easily formed using Ag TEs. After triggering the oxidation process, the formed Ag mobile metal ions can migrate faster inside Y₂O₃ active channel materials when compared to the formed Cu mobile metal ions. The fast migration inside the Y₂O₃ active channel materials successfully reduces the SET voltage and improves the number of programming–erasing cycles, i.e., endurance, which is one of the nonvolatile memory parameters. These results elucidate the importance of the electrochemical properties of TEs, providing a deeper understanding of how these factors influence the resistive switching characteristics of metal oxide-based atomic switches and conductive-metal-bridge-filament-based cells. Full article

The conductive bridge random access memory (CBRAM) device has been widely studied as a promising candidate for next-generation nonvolatile memory applications, where Cu as an electrode plays an important role in the resistive switching (RS) process. However, most studies only use Cu as one electrode, either the top electrode (TE) or the bottom electrode (BE); it is rarely reported that Cu is used as both TE and BE at the same time. In this study, we fabricated CBRAM devices by using Cu as both the TE and BE, and studied the RS characteristic of these devices. With Al₂O₃ as the switching layer (5~15 nm), the devices showed good bipolar RS characteristics. The endurance of the device could be as high as 10⁶ cycles and the retention time could be as long as 10⁴ s. The Al₂O₃ thickness influences the bipolar RS characteristic of the devices including the initial resistance, the forming process, endurance, and retention performance. The Cu electrode-based RRAM devices also present negative bias-suppressed complementary resistive switching (CRS) characteristics, which makes it effective to prevent the sneak path current or crosstalk problem in high-density memory array circuits. Full article

In this work, we investigated the effect of the tungsten nitride (WNx) diffusion barrier layer on the resistive switching operation of the aluminum nitride (AlN) based conductive bridge random access memory. The WNx barrier layer limits the diffusion of Cu ions in the AlN switching layer, hence controlling the formation of metallic conductive filament in the host layer. The device operated at a very low operating voltage with a V_set of 0.6 V and a V_reset of 0.4 V. The spatial and temporal switching variability were reduced significantly by inserting a barrier layer. The worst-case coefficient of variations (σ/µ) for HRS and LRS are 33% and 18%, respectively, when barrier layer devices are deployed, compared to 167% and 33% when the barrier layer is not present. With a barrier layer, the device exhibits data retention behavior for more than 10⁴ s at 120 °C, whereas without a barrier layer, the device fails after 10³ s. The device demonstrated synaptic behavior with long-term potentiation/depression (LTP/LTD) for 30 epochs by stimulating with a train of identical optimized pulses of 1 µs duration. Full article

Due to a rapid increase in the amount of data, there is a huge demand for the development of new memory technologies as well as emerging computing systems for high-density memory storage and efficient computing. As the conventional transistor-based storage devices and computing systems are approaching their scaling and technical limits, extensive research on emerging technologies is becoming more and more important. Among other emerging technologies, CBRAM offers excellent opportunities for future memory and neuromorphic computing applications. The principles of the CBRAM are explored in depth in this review, including the materials and issues associated with various materials, as well as the basic switching mechanisms. Furthermore, the opportunities that CBRAMs provide for memory and brain-inspired neuromorphic computing applications, as well as the challenges that CBRAMs confront in those applications, are thoroughly discussed. The emulation of biological synapses and neurons using CBRAM devices fabricated with various switching materials and device engineering and material innovation approaches are examined in depth. Full article

A memristor based on emerging resistive random-access memory (RRAM) is a promising candidate for use as a next-generation neuromorphic computing device which overcomes the von Neumann bottleneck. Meanwhile, due to their unique properties, including atomically thin layers and surface smoothness, two-dimensional (2D) materials are being widely studied for implementation in the development of new information-processing electronic devices. However, inherent drawbacks concerning operational uniformities, such as device-to-device variability, device yield, and reliability, are huge challenges in the realization of concrete memristor hardware devices. In this study, we fabricated Ta₂O₅-based memristor devices, where a 2D-MoS₂ buffer layer was directly inserted between the Ta₂O₅ switching layer and the Ag metal electrode to improve uniform switching characteristics in terms of switching voltage, the distribution of resistance states, endurance, and retention. A 2D-MoS₂ layered buffer film with a 5 nm thickness was directly grown on the Ta₂O₅ switching layer by the atomic-pressure plasma-enhanced chemical vapor deposition (AP-PECVD) method, which is highly uniform and provided a superior yield of 2D-MoS₂ film. It was observed that the switching operation was dramatically stabilized via the introduction of the 2D-MoS₂ buffer layer compared to a pristine device without the buffer layer. It was assumed that the difference in mobility and reduction rates between Ta₂O₅ and MoS₂ caused the narrow localization of ion migration, inducing the formation of more stable conduction filament. In addition, an excellent yield of 98% was confirmed while showing cell-to-cell operation uniformity, and the extrinsic and intrinsic variabilities in operating the device were highly uniform. Thus, the introduction of a MoS₂ buffer layer could improve highly reliable memristor device switching operation. Full article

In this study, the influence of oxygen concentration in InWZnO (IWZO), which was used as the switching layer of conductive bridge random access memory, (CBRAM) is investigated. With different oxygen flow during the sputtering process, the IWZO film can be fabricated with different oxygen concentrations and different oxygen vacancy distribution. In addition, the electrical characteristics of CBRAM device with different oxygen concentration are compared and further analyzed with an atomic force microscope and X-ray photoelectron spectrum. Furthermore, a stacking structure with different bilayer switching is also systematically discussed. Compared with an interchange stacking layer and other single layer memory, the CBRAM with specific stacking sequence of bilayer oxygen-poor/-rich IWZO (IWZOx/IWZOy, x < y) exhibits more stable distribution of a resistance state and also better endurance (more than 3 × 10⁴ cycles). Meanwhile, the memory window of IWZOx/IWZOy can even be maintained over 10⁴ s at 85 °C. Those improvements can be attributed to the oxygen vacancy distribution in switching layers, which may create a suitable environment for the conductive filament formation or rupture. Therefore, it is believed that the specific stacking bilayer IWZO CBRAM might further pave the way for emerging memory applications. Full article

Organic nonvolatile memory devices have a vital role for the next generation of electrical memory units, due to their large scalability and low-cost fabrication techniques. Here, we show bipolar resistive switching based on an Ag/ZnO/P3HT-PCBM/ITO device in which P3HT-PCBM acts as an organic heterojunction with inorganic ZnO protective layer. The prepared memory device has consistent DC endurance (500 cycles), retention properties (10⁴ s), high ON/OFF ratio (10⁵), and environmental stability. The observation of bipolar resistive switching is attributed to creation and rupture of the Ag filament. In addition, our conductive bridge random access memory (CBRAM) device has adequate regulation of the current compliance leads to multilevel resistive switching of a high data density storage. Full article

Here, we present the synaptic characteristics of AlN-based conductive bridge random access memory (CBRAM) as a synaptic device for neuromorphic systems. Both non-volatile and volatile memory are observed by simply controlling the strength of the Cu filament inside the AlN film. For non-volatile switching induced by high compliance current (CC), good retention with a strong Cu metallic filament is verified. Low-resistance state (LRS) and high-resistance state (HRS) conduction follow metallic Ohmic and trap-assisted tunneling (TAT), respectively, which are supported by I–V fitting and temperature dependence. The transition from long-term plasticity (LTP) to short-term plasticity (STP) is demonstrated by increasing the pulse interval time for synaptic device application. Also, paired-pulse facilitation (PPF) in the nervous system is mimicked by sending two identical pulses to the CBRAM device to induce STP. Finally, potentiation and depression are achieved by gradually increasing the set and reset voltage in pulse transient mode. Full article

Diode-like threshold switching and high on/off ratio characteristics by using an Al/Ag/Al₂O₃/TiN conductive bridge resistive random access memories (CBRAM) have been obtained. The 5 nm-thick Al₂O₃ device shows superior memory parameters such as low forming voltage and higher switching uniformity as compared to the 20 nm-thick switching layer, owing to higher electric field across the material. Capacitance-voltage (CV) characteristics are observed for the Ag/Al₂O₃/TiN devices, suggesting the unipolar/bipolar resistive switching phenomena. Negative capacitance (NC) at low frequency proves inductive behavior of the CBRAM devices due to Ag ion migration into the Al₂O₃ oxide-electrolyte. Thicker Al₂O₃ film shows diode-like threshold switching behavior with long consecutive 10,000 cycles. It has been found that a thinner Al₂O₃ device has a larger on/off ratio of >10⁸ as compared to a thicker one. Program/erase (P/E) cycles, read endurance, and data retention of the thinner Al₂O₃ oxide-electrolyte shows superior phenomena than the thicker electrolyte. The switching mechanism is also explored. Full article

This article reports the first results of a Nafion^®-based, solid state, non-volatile, electronically reconfigurable Radio Frequency (RF)-switch integrated to a co-planar waveguide transmission line (CPW) in shunt mode, on a flexible paper substrate. The switch is based on a metal–insulator–metal structure formed respectively using Silver–Nafion–aluminum switching layers. The presented device is fully passive and shows good performance till 3 GHz, with an insertion loss less than 3 dB in the RF-on state and isolation greater than 15 dB in the RF-off state. Low-power direct current pulses in the range 10 V/0.5 mA and −20 V/0.15 A are used to operate the switch. The device was fabricated in an ambient laboratory condition, without the use of any clean room facilities. A brief discussion of the results and potential application of this concept in a re-configurable chipless RFID tag is also given in this article. This study is a proof of concept of fabrication of electronically re-configurable and disposable RF-electronic switches on low cost and flexible substrates, using a process feasible for mass production. Full article