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Keywords = electronic processor cooling systems

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29 pages, 9451 KB  
Article
Optimizing Thermal Performance of Mini Heat Exchangers: An Experimental Analysis Using a Full Factorial Design
by Sergio da Silva Franco, Álvaro Augusto Soares Lima, Alvaro Antonio Villa Ochoa, José Ângelo Peixoto da Costa, Gustavo de Novaes Pires Leite, Márcio Vilar, Kilvio Alessandro Ferraz and Paula Suemy Arruda Michima
Appl. Sci. 2025, 15(7), 4052; https://doi.org/10.3390/app15074052 - 7 Apr 2025
Viewed by 870
Abstract
This study seeks to investigate the heat dissipation process in a minichannel heat exchanger, commonly employed for cooling electronic components. The analysis centers on two key factors: global thermal resistance (GTR) and the heat transfer coefficient. The innovation of this [...] Read more.
This study seeks to investigate the heat dissipation process in a minichannel heat exchanger, commonly employed for cooling electronic components. The analysis centers on two key factors: global thermal resistance (GTR) and the heat transfer coefficient. The innovation of this study resides in the development and analysis of a mini heat exchanger optimized using chemometric methods to achieve efficient thermal dissipation. Various conditions, including the power source, volumetric flow rate, and ambient temperature, were varied at both low and high levels to assess their impact on these variables and establish the optimal conditions for heat dissipation. The cooling of electronic components, such as processors, remains a topic of ongoing research, as the miniaturization of components through nanotechnology requires enhanced heat dissipation within increasingly smaller spaces. This experimental study identifies the optimal conditions for both GTR and the heat transfer coefficient within the examined parameters. GTR is minimized with a power of 30 W, an ambient temperature of 29 °C, and a flow rate of 2.50 L·min−1. The results indicate that electrical power was the most significant variable affecting GTR, while ambient temperature also played a determining role in the heat transfer coefficient. Full article
(This article belongs to the Special Issue Thermal and Thermomechanical Management in Electronic Systems)
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13 pages, 2485 KB  
Article
Ultrasonic Vibration Technology to Improve the Thermal Performance of CPU Water-Cooling Systems: Experimental Investigation
by Amin Amiri Delouei, Hasan Sajjadi and Goodarz Ahmadi
Water 2022, 14(24), 4000; https://doi.org/10.3390/w14244000 - 8 Dec 2022
Cited by 55 | Viewed by 5880
Abstract
The rapid growth of the electronics industry and the increase in processor power levels requires new techniques to improve the heat transfer rate in their cooling systems. In this study, ultrasonic vibration technology was introduced as an active method to enhance the thermal [...] Read more.
The rapid growth of the electronics industry and the increase in processor power levels requires new techniques to improve the heat transfer rate in their cooling systems. In this study, ultrasonic vibration technology was introduced as an active method to enhance the thermal performance of water-cooling systems. The effects of ultrasonic vibrations at power levels of 30, 60, and 120 watts for different cooling airflow rates were investigated experimentally. The results were validated with available empirical correlations to ensure the accuracy of the measurement systems. The findings indicated that the ultrasonic vibrations enhanced the heat transfer in the liquid-cooling heat exchangers. In addition, the thermal performance of the ultrasonic vibrations was improved by reducing the airflow rate and increasing the ultrasonic power. In addition to the feature of heat transfer improvement, ultrasonic waves are widely used for the cleaning of different types of heat exchangers. Regarding the anti-fouling and anti-accumulation effects of the ultrasonic vibrations, the introduced technology could provide a practical way for developing high-performance nanofluids-based computer cooling systems. Full article
(This article belongs to the Section Water-Energy Nexus)
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