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Keywords = flexible printed circuit boards

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16 pages, 63967 KB  
Article
Research on Eddy Current Probes for Sensitivity Improvement in Fatigue Crack Detection of Aluminum Materials
by Qing Zhang, Jiahuan Zheng, Shengping Wu, Yanchang Wang, Lijuan Li and Haitao Wang
Sensors 2025, 25(19), 6100; https://doi.org/10.3390/s25196100 - 3 Oct 2025
Viewed by 320
Abstract
Aluminum alloys under long-term service or repetitive stress are prone to small fatigue cracks (FCs) with arbitrary orientations, necessitating eddy current probes with focused magnetic fields and directional selectivity for reliable detection. This study presents a flexible printed circuit board (FPCB) probe with [...] Read more.
Aluminum alloys under long-term service or repetitive stress are prone to small fatigue cracks (FCs) with arbitrary orientations, necessitating eddy current probes with focused magnetic fields and directional selectivity for reliable detection. This study presents a flexible printed circuit board (FPCB) probe with a double-layer planar excitation coil and a double-layer differential receiving coil. The excitation coil employs a reverse-wound design to enhance magnetic field directionality and focusing, while the differential receiving coil improves sensitivity and suppresses common-mode noise. The probe is optimized by adjusting the excitation coil overlap and the excitation–receiving coil angles to maximize eddy current concentration and detection signals. Finite element simulations and experiments confirm the system’s effectiveness in detecting surface cracks of varying sizes and orientations. To further characterize these defects, two time-domain features are extracted: the peak-to-peak value (ΔP), reflecting amplitude variations associated with defect size and orientation, and the signal width (ΔW), primarily correlated with defect angle. However, substantial overlap in their value ranges for defects with different parameters means that these features alone cannot identify which specific parameter has changed, making prior defect classification using a Transformer-based approach necessary for accurate quantitative analysis. The proposed method demonstrates reliable performance and clear interpretability for defect evaluation in aluminum components. Full article
(This article belongs to the Special Issue Electromagnetic Non-Destructive Testing and Evaluation)
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22 pages, 5941 KB  
Article
Explainable AI Methods for Identification of Glue Volume Deficiencies in Printed Circuit Boards
by Theodoros Tziolas, Konstantinos Papageorgiou, Theodosios Theodosiou, Dimosthenis Ioannidis, Nikolaos Dimitriou, Gregory Tinker and Elpiniki Papageorgiou
Appl. Sci. 2025, 15(16), 9061; https://doi.org/10.3390/app15169061 - 17 Aug 2025
Viewed by 1259
Abstract
In printed circuit board (PCB) assembly, the volume of dispensed glue is closely related to the PCB’s durability, production costs, and the overall product reliability. Currently, quality inspection is performed manually by operators, inheriting the limitations of human-performed procedures. To address this, we [...] Read more.
In printed circuit board (PCB) assembly, the volume of dispensed glue is closely related to the PCB’s durability, production costs, and the overall product reliability. Currently, quality inspection is performed manually by operators, inheriting the limitations of human-performed procedures. To address this, we propose an automatic optical inspection framework that utilizes convolutional neural networks (CNNs) and post-hoc explainable methods. Our methodology handles glue quality inspection as a three-fold procedure. Initially, a detection system based on CenterNet MobileNetV2 is developed to localize PCBs, thus, offering a flexible lightweight tool for targeting and cropping regions of interest. Consequently, a CNN is proposed to classify PCB images into three classes based on the placed glue volume achieving 92.2% accuracy. This classification step ensures that varying glue volumes are accurately assessed, addressing potential quality issues that appear early in the production process. Finally, the Deep SHAP and Grad-CAM methods are applied to the CNN classifier to produce explanations of the decision making and further increase the interpretability of the proposed approach, targeting human-centered artificial intelligence. These post-hoc explainable methods provide visual explanations of the model’s decision-making process, offering insights into which features and regions contribute to each classification decision. The proposed method is validated with real industrial data, demonstrating its practical applicability and robustness. The evaluation procedure indicates that the proposed framework offers increased accuracy, low latency, and high-quality visual explanations, thereby strengthening quality assurance in PCB manufacturing. Full article
(This article belongs to the Special Issue Recent Applications of Explainable AI (XAI))
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19 pages, 1107 KB  
Article
A Novel Harmonic Clocking Scheme for Concurrent N-Path Reception in Wireless and GNSS Applications
by Dina Ibrahim, Mohamed Helaoui, Naser El-Sheimy and Fadhel Ghannouchi
Electronics 2025, 14(15), 3091; https://doi.org/10.3390/electronics14153091 - 1 Aug 2025
Viewed by 829
Abstract
This paper presents a novel harmonic-selective clocking scheme that facilitates concurrent downconversion of spectrally distant radio frequency (RF) signals using a single low-frequency local oscillator (LO) in an N-path receiver architecture. The proposed scheme selectively generates LO harmonics aligned with multiple RF bands, [...] Read more.
This paper presents a novel harmonic-selective clocking scheme that facilitates concurrent downconversion of spectrally distant radio frequency (RF) signals using a single low-frequency local oscillator (LO) in an N-path receiver architecture. The proposed scheme selectively generates LO harmonics aligned with multiple RF bands, enabling simultaneous downconversion without modification of the passive mixer topology. The receiver employs a 4-path passive mixer configuration to enhance harmonic selectivity and provide flexible frequency planning.The architecture is implemented on a printed circuit board (PCB) and validated through comprehensive simulation and experimental measurements under continuous wave and modulated signal conditions. Measured results demonstrate a sensitivity of 55dBm and a conversion gain varying from 2.5dB to 9dB depending on the selected harmonic pair. The receiver’s performance is further corroborated by concurrent (dual band) reception of real-world signals, including a GPS signal centered at 1575 MHz and an LTE signal at 1179 MHz, both downconverted using a single 393 MHz LO. Signal fidelity is assessed via Normalized Mean Square Error (NMSE) and Error Vector Magnitude (EVM), confirming the proposed architecture’s effectiveness in maintaining high-quality signal reception under concurrent multiband operation. The results highlight the potential of harmonic-selective clocking to simplify multiband receiver design for wireless communication and global navigation satellite system (GNSS) applications. Full article
(This article belongs to the Section Microwave and Wireless Communications)
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17 pages, 7597 KB  
Article
Screen-Printed 1 × 4 Quasi-Yagi-Uda Antenna Array on Highly Flexible Transparent Substrate for the Emerging 5G Applications
by Matthieu Egels, Anton Venouil, Chaouki Hannachi, Philippe Pannier, Mohammed Benwadih and Christophe Serbutoviez
Electronics 2025, 14(14), 2850; https://doi.org/10.3390/electronics14142850 - 16 Jul 2025
Viewed by 649
Abstract
In the Internet of Things (IoT) era, the demand for cost-effective, flexible, wearable antennas and circuits has been growing. Accordingly, screen-printing techniques are becoming more popular due to their lower costs and high-volume manufacturing. This paper presents and investigates a full-screen-printed 1 × [...] Read more.
In the Internet of Things (IoT) era, the demand for cost-effective, flexible, wearable antennas and circuits has been growing. Accordingly, screen-printing techniques are becoming more popular due to their lower costs and high-volume manufacturing. This paper presents and investigates a full-screen-printed 1 × 4 Quasi-Yagi-Uda antenna array on a high-transparency flexible Zeonor thin-film substrate for emerging 26 GHz band (24.25–27.55 GHz) 5G applications. As part of this study, screen-printing implementation rules are developed by properly managing ink layer thickness on a transparent flexible Zeonor thin-film dielectric to achieve a decent antenna array performance. In addition, a screen-printing repeatability study has been carried out through a performance comparison of 24 antenna array samples manufactured by our research partner from CEA-Liten Grenoble. Despite the challenging antenna array screen printing at higher frequencies, the measured results show a good antenna performance as anticipated from the traditional subtractive printed circuit board (PCB) manufacturing process using standard substrates. It shows a wide-band matched input impedance from 22–28 GHz (i.e., 23% of relative band-width) and a maximum realized gain of 12.8 dB at 27 GHz. Full article
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29 pages, 8416 KB  
Article
WSN-Based Multi-Sensor System for Structural Health Monitoring
by Fatih Dagsever, Zahra Sharif Khodaei and M. H. Ferri Aliabadi
Sensors 2025, 25(14), 4407; https://doi.org/10.3390/s25144407 - 15 Jul 2025
Viewed by 3467
Abstract
Structural Health Monitoring (SHM) is an essential technique for continuously assessing structural conditions using integrated sensor systems during operation. SHM technologies have evolved to address the increasing demand for efficient maintenance strategies in advanced engineering fields, such as civil infrastructure, aerospace, and transportation. [...] Read more.
Structural Health Monitoring (SHM) is an essential technique for continuously assessing structural conditions using integrated sensor systems during operation. SHM technologies have evolved to address the increasing demand for efficient maintenance strategies in advanced engineering fields, such as civil infrastructure, aerospace, and transportation. However, developing a miniaturized, cost-effective, and multi-sensor solution based on Wireless Sensor Networks (WSNs) remains a significant challenge, particularly for SHM applications in weight-sensitive aerospace structures. To address this, the present study introduces a novel WSN-based Multi-Sensor System (MSS) that integrates multiple sensing capabilities onto a 3 × 3 cm flexible Printed Circuit Board (PCB). The proposed system combines a Piezoelectric Transducer (PZT) for impact detection; a strain gauge for mechanical deformation monitoring; an accelerometer for capturing dynamic responses; and an environmental sensor measuring temperature, pressure, and humidity. This high level of functional integration, combined with real-time Data Acquisition (DAQ) and precise time synchronization via Bluetooth Low Energy (LE), distinguishes the proposed MSS from conventional SHM systems, which are typically constrained by bulky hardware, single sensing modalities, or dependence on wired communication. Experimental evaluations on composite panels and aluminum specimens demonstrate reliable high-fidelity recording of PZT signals, strain variations, and acceleration responses, matching the performance of commercial instruments. The proposed system offers a low-power, lightweight, and scalable platform, demonstrating strong potential for on-board SHM in aircraft applications. Full article
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17 pages, 14203 KB  
Article
Low-Profile Omnidirectional and Wide-Angle Beam Scanning Antenna Array Based on Epsilon-Near-Zero and Fabry–Perot Co-Resonance
by Jiaxin Li, Lin Zhao, Dan Long and Hui Xie
Electronics 2025, 14(10), 2012; https://doi.org/10.3390/electronics14102012 - 15 May 2025
Viewed by 1374
Abstract
To address the inherent contradiction between low-profile design and high gain in traditional omnidirectional antennas, as well as the narrow bandwidth constraints of ENZ antennas, this study presents a dual-mode ENZ-FP collaborative resonant antenna array design utilizing a substrate-integrated waveguide (SIW). Through systematic [...] Read more.
To address the inherent contradiction between low-profile design and high gain in traditional omnidirectional antennas, as well as the narrow bandwidth constraints of ENZ antennas, this study presents a dual-mode ENZ-FP collaborative resonant antenna array design utilizing a substrate-integrated waveguide (SIW). Through systematic analysis of ENZ media’s quasi-static field distribution, we innovatively integrated it with Fabry–Perot (F–P) resonance, achieving unprecedented dual-band omnidirectional radiation at 5.18 GHz and 5.72 GHz within a single ENZ antenna configuration for the first time. The directivity of both frequencies reached 12.0 dBi, with a remarkably low profile of only 0.018λ. We then extended this design to an ENZ-FP dual-mode beam-scanning array. By incorporating phase control technology, we achieved wide-angle scanning despite low-profile constraints. The measured 3 dB beam coverage angles at the dual frequencies were ±63° and ±65°, respectively. Moreover, by loading the impedance matching network, the −10 dB impedance bandwidth of the antenna array was further extended to 2.4% and 2.7%, respectively, thus overcoming the narrowband limitations of the ENZ antenna and enhancing practical applicability. The antennas were manufactured using PCB (Printed Circuit Board) technology, offering high integration and cost efficiency. This provides a new paradigm for UAV (Unmanned Aerial Vehicle) communication and radar detection systems featuring multi-band operation, a low-profile design, and flexible beam control capabilities. Full article
(This article belongs to the Section Microwave and Wireless Communications)
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12 pages, 3129 KB  
Article
Development of Low-Dielectric Modified Polyimide with Low-Temperature Radical Curing for High-Frequency Flexible Printed Circuit Boards
by Seonwoo Kim, Suin Chae, Mirae Seo, Yubin Kim, Soobin Park, Sehoon Park and Hyunjin Nam
Micro 2025, 5(2), 23; https://doi.org/10.3390/micro5020023 - 3 May 2025
Viewed by 1395
Abstract
This study presents the development of a modified polyimide (MPI) with low dielectric properties and low-temperature curing capability for high-frequency flexible printed circuit boards (FPCBs). MPI was cured using dicumyl peroxide (DCP) at 80–140 °C through a radical process optimized via DSC analysis, [...] Read more.
This study presents the development of a modified polyimide (MPI) with low dielectric properties and low-temperature curing capability for high-frequency flexible printed circuit boards (FPCBs). MPI was cured using dicumyl peroxide (DCP) at 80–140 °C through a radical process optimized via DSC analysis, while Fourier-transform infrared (FT-IR) confirmed the elimination of C=C bonds and the formation of imide structures. The MPI film exhibited low dielectric constants (Dk) of 1.759 at 20 GHz and 1.734 at 28 GHz, with ultra-low dissipation factors (Df) of 0.00165 and 0.00157. High-frequency S-parameter evaluations showed an excellent performance, with S11 of −32.92 dB and S21 of approximately −1 dB. Mechanical reliability tests demonstrated a strong peel strength of 0.8–1.2 kgf/mm (IPC TM-650 2.4.8 standard) and stable electrical resistance during bending to ~6 mm radius, with full recovery after severe deformation. These results highlight MPI’s potential as a high-performance dielectric material for next-generation FPCBs, combining superior electrical performance, mechanical flexibility, and compatibility with low-temperature processing. Full article
(This article belongs to the Section Microscale Engineering)
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19 pages, 6105 KB  
Article
Polylactic Acid and Polyhydroxybutyrate as Printed Circuit Board Substrates: A Novel Approach
by Zahra Fazlali, David Schaubroeck, Maarten Cauwe, Ludwig Cardon, Pieter Bauwens and Jan Vanfleteren
Processes 2025, 13(5), 1360; https://doi.org/10.3390/pr13051360 - 29 Apr 2025
Cited by 1 | Viewed by 1352
Abstract
This study presents a novel approach to manufacture a rigid printed circuit board (PCB) using sustainable polymers. Current PCBs use a fossil-fuel-based substrate, like FR4. This presents recycling challenges due to its composite nature. Replacing the substrate with an environmentally friendly alternative leads [...] Read more.
This study presents a novel approach to manufacture a rigid printed circuit board (PCB) using sustainable polymers. Current PCBs use a fossil-fuel-based substrate, like FR4. This presents recycling challenges due to its composite nature. Replacing the substrate with an environmentally friendly alternative leads to a reduction in negative impacts. Polylactic acid (PLA) and Polyhydroxybutyrate (PHB) biopolymers are used in this study. These two biopolymers have low melting points (130–180 °C, and 170–180 °C, respectively) and cannot withstand the high temperature soldering process (up to 260 °C for standard SAC (SnAgCu, tin/silver/copper) lead free solder processes). Our approach for replacing the PCB substrate is applying the PLA/PHB carrier substrate at the end of the PCB manufacturing process using injection molding technology. This approach involves all the standard PCB processes, including wet etching of the Cu conductors, and component assembly with SAC solder on a thin flexible polyimide (PI) foil with patterned Cu conductors and then overmolding the biopolymer onto the foil to create a rigid base. This study demonstrates the functionality of two test circuits fabricated using this method. In addition, we evaluated the adhesion between the biopolymer and PI to achieve a durable PCB. Moreover, we performed two different end-of-life approaches (debonding and composting) as a part of the end-of-life consideration. By incorporating biodegradable materials into PCB standard manufacturing, the CO2 emissions and energy consumption are significantly reduced, and installation costs are lowered. Full article
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9 pages, 2086 KB  
Article
Effective Enhancement for Printed Circuit Board Imaging in Near-Field Scanning Microwave Microscopy
by Tao Zhou, Quanxin Zhou, Hao Liu, Haoyun Liu, Zhe Wu, Jianlong Liu, Yubin Gong and Baoqing Zeng
Symmetry 2025, 17(4), 561; https://doi.org/10.3390/sym17040561 - 8 Apr 2025
Viewed by 710
Abstract
Near-field microwave microscopy (NSMM) is a promising technique for the non-destructive, high-resolution imaging of electrical and dielectric properties at the microscale. However, its performance is highly sensitive to the probe-to-sample distance, often requiring extremely close proximity, which limits its practical application in device [...] Read more.
Near-field microwave microscopy (NSMM) is a promising technique for the non-destructive, high-resolution imaging of electrical and dielectric properties at the microscale. However, its performance is highly sensitive to the probe-to-sample distance, often requiring extremely close proximity, which limits its practical application in device manufacturing, especially in scenarios involving coatings and packaging. In this study, we propose a distance inversion method based on a dual-port symmetrical microwave probe to improve imaging performance at larger, safer scanning distances. This method utilizes the correlation between probe height and resonant frequency to compensate for distance-induced signal distortions. The experimental results demonstrate that even at a probe–sample distance of 80 µm, clear and distinguishable NSMM images of printed circuit boards (PCBs) can be obtained. The imaging resolution reached 13 µm. The defect structure with dimensions of 130 × 130 µm2 on the PCB was successfully identified. The signal-to-noise ratio was significantly enhanced after applying the correction method. This approach not only improves the robustness and flexibility of NSMM in industrial scenarios but also extends its applicability to packaged or coated electronic devices, offering a valuable tool for advanced non-destructive testing. Full article
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16 pages, 6568 KB  
Article
Rapid Mental Stress Evaluation Based on Non-Invasive, Wearable Cortisol Detection with the Self-Assembly of Nanomagnetic Beads
by Junjie Li, Qian Chen, Weixia Li, Shuang Li, Cherie S. Tan, Shuai Ma, Shike Hou, Bin Fan and Zetao Chen
Biosensors 2025, 15(3), 140; https://doi.org/10.3390/bios15030140 - 23 Feb 2025
Cited by 2 | Viewed by 1643
Abstract
The rapid and timely evaluation of the mental health of emergency rescuers can effectively improve the quality of emergency rescues. However, biosensors for mental health evaluation are now facing challenges, such as the rapid and portable detection of multiple mental biomarkers. In this [...] Read more.
The rapid and timely evaluation of the mental health of emergency rescuers can effectively improve the quality of emergency rescues. However, biosensors for mental health evaluation are now facing challenges, such as the rapid and portable detection of multiple mental biomarkers. In this study, a non-invasive, flexible, wearable electrochemical biosensor was constructed based on the self-assembly of nanomagnetic beads for the rapid detection of cortisol in interstitial fluid (ISF) to assess the mental stress of emergency rescuers. Based on a one-step reduction, gold nanoparticles (AuNPs) were functionally modified on a screen-printed electrode to improve the detection of electrochemical properties. Afterwards, nanocomposites of MXene and multi-wall carbon nanotubes were coated onto the AuNPs layer through a physical deposition to enhance the electron transfer rate. The carboxylated nanomagnetic beads immobilized with a cortisol antibody were treated as sensing elements for the specific recognition of the mental stress marker, cortisol. With the rapid attraction of magnets to nanomagnetic beads, the sensing element can be rapidly replaced on the electrode uniformly, which can lead to extreme improvements in detection efficiency. The detected linear response to cortisol was 0–32 ng/mL. With the integrated reverse iontophoresis technique on a flexible printed circuit board, the ISF can be extracted non-invasively for wearable cortisol detection. The stimulating current was set to be under 1 mA for the extraction, which was within the safe and acceptable range for human bodies. Therefore, based on the positive correlation between cortisol concentration and mental stress, the mental stress of emergency rescuers can be evaluated, which will provide feedback on the psychological statuses of rescuers and effectively improve rescuer safety and rescue efficiency. Full article
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18 pages, 3238 KB  
Article
Multilayer Printed Circuit Board Design Based on Copper Paste Sintering Technology for Satellite Communication Receiving Phased Array
by Sicheng Sun, Yijiu Zhao, Sitao Mei, Naixin Zhou and Yongling Ban
Electronics 2025, 14(2), 322; https://doi.org/10.3390/electronics14020322 - 15 Jan 2025
Viewed by 1441
Abstract
A 2048-element dual-polarized receive (RX) phased array for Ku-band (10.7–12.7 GHz) satellite communication (SATCOM) is presented in this paper. The design of the multilayer printed circuit board (PCB) it uses adopts a novel copper paste sintering interconnection technology that allows for [...] Read more.
A 2048-element dual-polarized receive (RX) phased array for Ku-band (10.7–12.7 GHz) satellite communication (SATCOM) is presented in this paper. The design of the multilayer printed circuit board (PCB) it uses adopts a novel copper paste sintering interconnection technology that allows for more flexibility in the design of vias and can reduce the PCB’s lamination number. This technology is more suitable for manufacturing multilayer and complex PCBs than traditional processes. The array is designed to consist of sixteen 8 × 16 element subarrays, each based on the silicon RX beamformer and multilayer PCB. Dual-polarized antenna elements are arranged in a regular rectangle with a spacing of 0.5 for a wavelength of 12.7 GHz, thus achieving a scanning range of ±70° in all planes. By adjusting the amplitude and phase of two line polarizations with cross-polarization levels better than −25 dB at boresight, the array can generate linear or circular polarization. Moreover, the antenna gain-to-noise temperature is above 12 dB/K (Tant = 20 K) at boresight. The aperture of the 2048-element RX phased array is 768 × 450 mm. With its low profile, the array is appropriate for usage in Ku-band SATCOM terminals. Full article
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21 pages, 17022 KB  
Article
Impact of Particular Stages of the Manufacturing Process on the Reliability of Flexible Printed Circuits
by Andrzej Kiernich, Jerzy Kalenik, Wojciech Stęplewski, Marek Kościelski and Aneta Chołaj
Sensors 2025, 25(1), 140; https://doi.org/10.3390/s25010140 - 29 Dec 2024
Cited by 1 | Viewed by 1363
Abstract
The purpose of the experiment was to indicate which element of the production process of flexible printed circuit boards is optimal in terms of the reliability of final products. According to the Taguchi method, in the experiment, five factors with two levels each [...] Read more.
The purpose of the experiment was to indicate which element of the production process of flexible printed circuit boards is optimal in terms of the reliability of final products. According to the Taguchi method, in the experiment, five factors with two levels each were chosen for the subsequent analysis. These included the number of conductive layers, the thickness of the laminate layer, the type of the laminate, the diameter of the plated holes, and the current density in the galvanic bath. The reliability of the PCBs in the produced variations was verified using the Interconnect Stress Test environmental test. The qualitatively best variant of the board construction was indicated using the signal-to-noise ratio and the analysis of variance method for each factor. The factors determined to be the most important in terms of reliability were the number of conductive layers and the current density in the galvanic bath. The optimal variant of the board construction was two conductive layers on a polyimide laminate, where the laminate layer was 100 μm thick, the hole diameter was equal to 0.4 mm, and current density was 2 A/dm2 in the galvanic bath. Therefore, the plated experiment indicated the factors needed to obtain a high-quality product with a low failure rate. Full article
(This article belongs to the Special Issue RFID-Enabled Sensor Design and Applications)
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10 pages, 2034 KB  
Article
A Study on the Development of Real-Time Chamber Contamination Diagnosis Sensors
by Junyeob Lee and Kyongnam Kim
Sensors 2025, 25(1), 20; https://doi.org/10.3390/s25010020 - 24 Dec 2024
Cited by 2 | Viewed by 1343
Abstract
Plasma processes are critical for achieving precise device fabrication in semiconductor manufacturing. However, polymer accumulation during processes like plasma etching can cause chamber contamination, adversely affecting plasma characteristics and process stability. This study focused on developing a real-time sensor system for diagnosing chamber [...] Read more.
Plasma processes are critical for achieving precise device fabrication in semiconductor manufacturing. However, polymer accumulation during processes like plasma etching can cause chamber contamination, adversely affecting plasma characteristics and process stability. This study focused on developing a real-time sensor system for diagnosing chamber contamination by quantitatively monitoring polymer accumulation. A quartz crystal sensor integrated with flexible printed circuit boards was designed to measure the frequency shifts corresponding to polymer thickness changes. An impedance probe was also employed to monitor variations in the plasma discharge characteristics. The sensor demonstrated high reliability with a measurement scatter of 2.5% despite repeated plasma exposure. The experimental results revealed that polymer accumulation significantly influenced the plasma impedance, and this correlation was validated through real-time monitoring and scanning electron microscopy (SEM). The study further showed that the sensor could detect the transition point of the plasma state changes under varying process gas conditions, enabling the early detection of potential process anomalies. These findings suggest that the developed sensor system can be crucial for diagnosing plasma and chamber conditions, providing valuable data for optimizing preventive maintenance schedules. This advancement offers a pathway for improving process reliability and extending the operational lifetime of semiconductor manufacturing equipment. Full article
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22 pages, 13474 KB  
Article
Multimodal Human–Robot Interaction Using Gestures and Speech: A Case Study for Printed Circuit Board Manufacturing
by Ángel-Gabriel Salinas-Martínez, Joaquín Cunillé-Rodríguez, Elías Aquino-López and Angel-Iván García-Moreno
J. Manuf. Mater. Process. 2024, 8(6), 274; https://doi.org/10.3390/jmmp8060274 - 30 Nov 2024
Cited by 2 | Viewed by 4215
Abstract
In recent years, technologies for human–robot interaction (HRI) have undergone substantial advancements, facilitating more intuitive, secure, and efficient collaborations between humans and machines. This paper presents a decentralized HRI platform, specifically designed for printed circuit board manufacturing. The proposal incorporates many input devices, [...] Read more.
In recent years, technologies for human–robot interaction (HRI) have undergone substantial advancements, facilitating more intuitive, secure, and efficient collaborations between humans and machines. This paper presents a decentralized HRI platform, specifically designed for printed circuit board manufacturing. The proposal incorporates many input devices, including gesture recognition via Leap Motion and Tap Strap, and speech recognition. The gesture recognition system achieved an average accuracy of 95.42% and 97.58% for each device, respectively. The speech control system, called Cellya, exhibited a markedly reduced Word Error Rate of 22.22% and a Character Error Rate of 11.90%. Furthermore, a scalable user management framework, the decentralized multimodal control server, employs biometric security to facilitate the efficient handling of multiple users, regulating permissions and control privileges. The platform’s flexibility and real-time responsiveness are achieved through advanced sensor integration and signal processing techniques, which facilitate intelligent decision-making and enable accurate manipulation of manufacturing cells. The results demonstrate the system’s potential to improve operational efficiency and adaptability in smart manufacturing environments. Full article
(This article belongs to the Special Issue Smart Manufacturing in the Era of Industry 4.0)
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18 pages, 7507 KB  
Article
Fabrication of an Integrated, Flexible, Wireless Pressure Sensor Array for the Monitoring of Ventricular Pressure
by Natiely Hernández-Sebastián, Daniela Diaz-Alonso, Bernardino Barrientos-García, Francisco Javier Renero-Carrillo and Wilfrido Calleja-Arriaga
Micromachines 2024, 15(12), 1435; https://doi.org/10.3390/mi15121435 - 28 Nov 2024
Cited by 1 | Viewed by 2054
Abstract
This work presents the design, fabrication, and rigorous validation of a flexible, wireless, capacitive pressure sensor for the full-range continuous monitoring of ventricular pressure. The proposed system consists of an implantable set and an external readout device; both modules were designed to form [...] Read more.
This work presents the design, fabrication, and rigorous validation of a flexible, wireless, capacitive pressure sensor for the full-range continuous monitoring of ventricular pressure. The proposed system consists of an implantable set and an external readout device; both modules were designed to form an RCL resonant circuit for passive, wireless pressure sensing and signal retrieving. Using surface micromachining and flexible electronics techniques, a two-variable capacitor array and a dual-layer planar coil were integrated into a flexible ergonomic substrate, avoiding hybrid-like connections in the implantable set. The proposed arrangement (capacitor array and dual-layer coil) allows us to optimize the operation pressure range and sensing distance. The use of polyimide as both the flexible substrate and the passivation material is a key feature, ensuring a biocompatible, implantable set that is mechanically flexible and can be folded to a compact size to achieve minimally invasive implantation. An external readout device has also been developed using a discrete printed circuit board (PCB) approach to support pressure measurements. The pressure responsivity of the sensor was validated to the laboratory level using a controlled pressure chamber. The results obtained show that the capacitance value of the sensor changed from 5.68 pF to 33.26 pF as the pressure varied from 0 to 300 mmHg. Correspondingly, the resonance frequency of the implantable set shifted from 12.75 MHz to 5.27 MHz. The sensitivity of the capacitive sensor was approximately 0.58 pF/mmHg and the typical response time was 220 ms. The wireless system performance was evaluated in both air and synthetic biological tissue using a Maxwell–Wien bridge circuit. The results showed a sensing distance longer than 3.5 cm, even under moderate misalignment conditions (up to 1.5 cm). The output voltage was successfully measured, ranging from 502.54 mV to 538.29 mV, throughout the full pressure range, with a measurement error of ±2.2 mV. Full article
(This article belongs to the Special Issue Flexible Intelligent Sensors: Design, Fabrication and Applications)
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