Next Article in Journal
Printing and Folding: A Solution for High-Throughput Processing of Organic Thin-Film Thermoelectric Devices
Next Article in Special Issue
A New Design of a Single-Device 3D Hall Sensor: Cross-Shaped 3D Hall Sensor
Previous Article in Journal
2D Analytical Model for the Directivity Prediction of Ultrasonic Contact Type Transducers in the Generation of Guided Waves
Previous Article in Special Issue
Comparison between Modelled and Measured Magnetic Field Scans of Different Planar Coil Topologies for Stress Sensor Applications
 
 
Article

Article Versions Notes

Sensors 2018, 18(4), 988; https://doi.org/10.3390/s18040988
Action Date Notes Link
article pdf uploaded. 27 March 2018 07:53 CEST Version of Record https://www.mdpi.com/1424-8220/18/4/988/pdf
article xml uploaded. 27 March 2018 07:53 CEST Original file https://www.mdpi.com/1424-8220/18/4/988/xml
article html file updated 27 March 2018 07:55 CEST Original file -
article html file updated 7 May 2018 04:07 CEST Update -
article html file updated 29 March 2019 10:05 CET Update -
article html file updated 17 April 2019 08:23 CEST Update -
article html file updated 1 May 2019 08:28 CEST Update -
article html file updated 2 October 2019 00:06 CEST Update -
article html file updated 9 February 2020 11:23 CET Update -
article html file updated 16 July 2022 10:15 CEST Update https://www.mdpi.com/1424-8220/18/4/988/html
Back to TopTop